GB2541336A - Method and apparatus for forming a wire structure - Google Patents
Method and apparatus for forming a wire structure Download PDFInfo
- Publication number
- GB2541336A GB2541336A GB1620528.8A GB201620528A GB2541336A GB 2541336 A GB2541336 A GB 2541336A GB 201620528 A GB201620528 A GB 201620528A GB 2541336 A GB2541336 A GB 2541336A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wire
- tube
- forming
- adhesive surface
- wire structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Quality & Reliability (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A method for forming a structure with wire elements (16) using a wire depositing device with a tube (26) for laying a wire (16), the method comprising: providing a substrate (22) with an adhesive surface (24); feeding a free end of the wire (16) through the tube (26) of the wire depositing device; and drawing the tube (26) laterally across the adhesive surface (34) in a pattern such that the free end of the wire (16) adheres to the adhesive surface (34) and the lateral movement causes the wire (16) to be drawn through the tube (26) and deposited as a trail in accordance with the pattern drawn by the tube (26) crossing the substrate (22).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/GB2014/051694 WO2015185879A1 (en) | 2014-06-03 | 2014-06-03 | Method and apparatus for forming a wire structure |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201620528D0 GB201620528D0 (en) | 2017-01-18 |
GB2541336A true GB2541336A (en) | 2017-02-15 |
GB2541336B GB2541336B (en) | 2017-07-05 |
Family
ID=51168295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1620528.8A Active GB2541336B (en) | 2014-06-03 | 2014-06-03 | Method and apparatus for forming a wire structure |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB2541336B (en) |
WO (1) | WO2015185879A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023026062A1 (en) | 2021-08-27 | 2023-03-02 | Ronald Peter Binstead | Element arrangement and associated method of manufacture |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110764637B (en) * | 2018-07-27 | 2023-03-07 | 广州视源电子科技股份有限公司 | Manufacturing device, manufacturing method and application of conductive mesh-type touch sensing layer |
CN115038251B (en) * | 2022-07-20 | 2024-02-02 | 江南大学 | Method for manufacturing sensor by using metal wire-based direct writing process |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1100296A1 (en) * | 1999-05-07 | 2001-05-16 | The Furukawa Electric Co., Ltd. | Wiring method and wiring device |
US20090218310A1 (en) * | 2008-02-28 | 2009-09-03 | Lijun Zu | Methods of patterning a conductor on a substrate |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9406702D0 (en) | 1994-04-05 | 1994-05-25 | Binstead Ronald P | Multiple input proximity detector and touchpad system |
-
2014
- 2014-06-03 WO PCT/GB2014/051694 patent/WO2015185879A1/en active Application Filing
- 2014-06-03 GB GB1620528.8A patent/GB2541336B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1100296A1 (en) * | 1999-05-07 | 2001-05-16 | The Furukawa Electric Co., Ltd. | Wiring method and wiring device |
US20090218310A1 (en) * | 2008-02-28 | 2009-09-03 | Lijun Zu | Methods of patterning a conductor on a substrate |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023026062A1 (en) | 2021-08-27 | 2023-03-02 | Ronald Peter Binstead | Element arrangement and associated method of manufacture |
Also Published As
Publication number | Publication date |
---|---|
WO2015185879A1 (en) | 2015-12-10 |
GB201620528D0 (en) | 2017-01-18 |
GB2541336B (en) | 2017-07-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
S72Z | Claim or counterclaim for revocation before the court (sect. 72 patents act1977) |
Free format text: COUNTERCLAIM LODGED; COUNTERCLAIM FOR REVOCATION LODGED AT THE INTELLECTUAL PROPERTY ENTERPRISE COURT ON 19 JULY 2018 (IP-2017-000218). |
|
S72Z | Claim or counterclaim for revocation before the court (sect. 72 patents act1977) |