NO981507L - Fremstilling av termoelektriske moduler, og loddemiddel for en slik fremstilling - Google Patents

Fremstilling av termoelektriske moduler, og loddemiddel for en slik fremstilling

Info

Publication number
NO981507L
NO981507L NO981507A NO981507A NO981507L NO 981507 L NO981507 L NO 981507L NO 981507 A NO981507 A NO 981507A NO 981507 A NO981507 A NO 981507A NO 981507 L NO981507 L NO 981507L
Authority
NO
Norway
Prior art keywords
manufacture
solder
thermoelectric
thermoelectric modules
modules
Prior art date
Application number
NO981507A
Other languages
English (en)
Norwegian (no)
Other versions
NO981507D0 (no
Inventor
Michael Yahatz
James Harper
Original Assignee
Melcor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melcor Corp filed Critical Melcor Corp
Publication of NO981507L publication Critical patent/NO981507L/no
Publication of NO981507D0 publication Critical patent/NO981507D0/no

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/82Connection of interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/81Structural details of the junction
    • H10N10/817Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered

Landscapes

  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Ceramic Products (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
NO981507A 1995-10-03 1998-04-02 Fremstilling av termoelektriske moduler, og loddemiddel for en slik fremstilling NO981507D0 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53844995A 1995-10-03 1995-10-03
PCT/US1996/016077 WO1997013283A1 (en) 1995-10-03 1996-09-30 Fabrication of thermoelectric modules and solder for such fabrication

Publications (2)

Publication Number Publication Date
NO981507L true NO981507L (no) 1998-04-02
NO981507D0 NO981507D0 (no) 1998-04-02

Family

ID=24146982

Family Applications (1)

Application Number Title Priority Date Filing Date
NO981507A NO981507D0 (no) 1995-10-03 1998-04-02 Fremstilling av termoelektriske moduler, og loddemiddel for en slik fremstilling

Country Status (22)

Country Link
US (1) US5817188A (ja)
EP (1) EP0870337B1 (ja)
JP (1) JP3862179B2 (ja)
KR (1) KR19990066931A (ja)
CN (1) CN1326256C (ja)
AT (1) ATE228270T1 (ja)
AU (1) AU702453B2 (ja)
BR (1) BR9610829A (ja)
CA (1) CA2233979C (ja)
CZ (1) CZ102898A3 (ja)
DE (1) DE69624936T2 (ja)
DK (1) DK0870337T3 (ja)
EA (1) EA000388B1 (ja)
ES (1) ES2183979T3 (ja)
HU (1) HUP9902023A3 (ja)
IL (1) IL123773A (ja)
MX (1) MX9802673A (ja)
NO (1) NO981507D0 (ja)
PT (1) PT870337E (ja)
TR (1) TR199800606T1 (ja)
UA (1) UA51672C2 (ja)
WO (1) WO1997013283A1 (ja)

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CN101409324B (zh) * 2008-07-24 2013-10-16 中国科学院上海硅酸盐研究所 一种碲化铋基热电发电器件的制造方法
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JP5831554B2 (ja) * 2011-11-08 2015-12-09 富士通株式会社 熱電変換素子及びその製造方法
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US20180090660A1 (en) 2013-12-06 2018-03-29 Sridhar Kasichainula Flexible thin-film based thermoelectric device with sputter deposited layer of n-type and p-type thermoelectric legs
US10566515B2 (en) 2013-12-06 2020-02-18 Sridhar Kasichainula Extended area of sputter deposited N-type and P-type thermoelectric legs in a flexible thin-film based thermoelectric device
US10367131B2 (en) 2013-12-06 2019-07-30 Sridhar Kasichainula Extended area of sputter deposited n-type and p-type thermoelectric legs in a flexible thin-film based thermoelectric device
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Also Published As

Publication number Publication date
HUP9902023A2 (hu) 1999-11-29
EA199800303A1 (ru) 1998-10-29
TR199800606T1 (xx) 1998-06-22
MX9802673A (es) 1998-11-30
ES2183979T3 (es) 2003-04-01
KR19990066931A (ko) 1999-08-16
CN1326256C (zh) 2007-07-11
CZ102898A3 (cs) 1998-08-12
AU702453B2 (en) 1999-02-18
BR9610829A (pt) 1999-12-21
PT870337E (pt) 2003-03-31
ATE228270T1 (de) 2002-12-15
JP3862179B2 (ja) 2006-12-27
WO1997013283A1 (en) 1997-04-10
DE69624936T2 (de) 2003-03-27
DK0870337T3 (da) 2003-03-03
JP2002507321A (ja) 2002-03-05
UA51672C2 (uk) 2002-12-16
HUP9902023A3 (en) 2002-11-28
IL123773A (en) 2001-03-19
EA000388B1 (ru) 1999-06-24
IL123773A0 (en) 1999-11-30
US5817188A (en) 1998-10-06
CA2233979C (en) 2005-09-27
EP0870337A4 (en) 1999-02-17
AU7394796A (en) 1997-04-28
EP0870337B1 (en) 2002-11-20
EP0870337A1 (en) 1998-10-14
DE69624936D1 (de) 2003-01-02
CN1211342A (zh) 1999-03-17
CA2233979A1 (en) 1997-04-10
NO981507D0 (no) 1998-04-02

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