IL123773A - Thermoelectric modules method of their production and solder for use in said method - Google Patents

Thermoelectric modules method of their production and solder for use in said method

Info

Publication number
IL123773A
IL123773A IL12377396A IL12377396A IL123773A IL 123773 A IL123773 A IL 123773A IL 12377396 A IL12377396 A IL 12377396A IL 12377396 A IL12377396 A IL 12377396A IL 123773 A IL123773 A IL 123773A
Authority
IL
Israel
Prior art keywords
solder
thermoelectric
production
thermoelectric modules
modules
Prior art date
Application number
IL12377396A
Other languages
English (en)
Other versions
IL123773A0 (en
Original Assignee
Melcor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melcor Corp filed Critical Melcor Corp
Publication of IL123773A0 publication Critical patent/IL123773A0/xx
Publication of IL123773A publication Critical patent/IL123773A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered

Landscapes

  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Ceramic Products (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
IL12377396A 1995-10-03 1996-09-30 Thermoelectric modules method of their production and solder for use in said method IL123773A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US53844995A 1995-10-03 1995-10-03
US08/713,106 US5817188A (en) 1995-10-03 1996-09-16 Fabrication of thermoelectric modules and solder for such fabrication
PCT/US1996/016077 WO1997013283A1 (en) 1995-10-03 1996-09-30 Fabrication of thermoelectric modules and solder for such fabrication

Publications (2)

Publication Number Publication Date
IL123773A0 IL123773A0 (en) 1999-11-30
IL123773A true IL123773A (en) 2001-03-19

Family

ID=24146982

Family Applications (1)

Application Number Title Priority Date Filing Date
IL12377396A IL123773A (en) 1995-10-03 1996-09-30 Thermoelectric modules method of their production and solder for use in said method

Country Status (22)

Country Link
US (1) US5817188A (xx)
EP (1) EP0870337B1 (xx)
JP (1) JP3862179B2 (xx)
KR (1) KR19990066931A (xx)
CN (1) CN1326256C (xx)
AT (1) ATE228270T1 (xx)
AU (1) AU702453B2 (xx)
BR (1) BR9610829A (xx)
CA (1) CA2233979C (xx)
CZ (1) CZ102898A3 (xx)
DE (1) DE69624936T2 (xx)
DK (1) DK0870337T3 (xx)
EA (1) EA000388B1 (xx)
ES (1) ES2183979T3 (xx)
HU (1) HUP9902023A3 (xx)
IL (1) IL123773A (xx)
MX (1) MX9802673A (xx)
NO (1) NO981507L (xx)
PT (1) PT870337E (xx)
TR (1) TR199800606T1 (xx)
UA (1) UA51672C2 (xx)
WO (1) WO1997013283A1 (xx)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3459328B2 (ja) * 1996-07-26 2003-10-20 日本政策投資銀行 熱電半導体およびその製造方法
JPH10178216A (ja) * 1996-12-18 1998-06-30 Seru Appl Kk 熱電素子及び熱電冷却装置
JP3144328B2 (ja) * 1996-12-24 2001-03-12 松下電工株式会社 熱電変換素子およびその製造方法
EP0907973B1 (en) * 1997-02-21 2002-05-08 Volvo Aero Corporation A thermoelectric generator unit
JP3982080B2 (ja) 1997-12-05 2007-09-26 松下電工株式会社 熱電モジュールの製造法と熱電モジュール
IL123238A0 (en) * 1998-02-09 1998-09-24 Israel Thermo Electrical Ltd Thermo-electric generator and module for use therein
US6103967A (en) * 1998-06-29 2000-08-15 Tellurex Corporation Thermoelectric module and method of manufacturing the same
US6222113B1 (en) * 1999-12-09 2001-04-24 International Business Machines Corporation Electrically-isolated ultra-thin substrates for thermoelectric coolers
US20020119079A1 (en) * 1999-12-10 2002-08-29 Norbert Breuer Chemical microreactor and microreactor made by process
US6492585B1 (en) 2000-03-27 2002-12-10 Marlow Industries, Inc. Thermoelectric device assembly and method for fabrication of same
US6271459B1 (en) 2000-04-26 2001-08-07 Wafermasters, Inc. Heat management in wafer processing equipment using thermoelectric device
JP2002134796A (ja) * 2000-10-19 2002-05-10 Nhk Spring Co Ltd Ｂｉ−Ｔｅ系半導体素子およびＢｉ−Ｔｅ系熱電モジュール
US6555413B1 (en) * 2001-02-23 2003-04-29 Triquint Technology Holding Co. Method for interconnecting semiconductor elements to form a thermoelectric cooler and a thermoelectric cooler formed therefrom
US6484513B1 (en) * 2001-09-05 2002-11-26 Chin-Lung Chou Freezing sucker
US7166796B2 (en) * 2001-09-06 2007-01-23 Nicolaou Michael C Method for producing a device for direct thermoelectric energy conversion
US7038234B2 (en) * 2001-12-12 2006-05-02 Hi-Z Technology, Inc. Thermoelectric module with Si/SiGe and B4C/B9C super-lattice legs
JP2003198117A (ja) * 2001-12-28 2003-07-11 Matsushita Electric Ind Co Ltd はんだ付け方法および接合構造体
US6756536B2 (en) * 2002-03-28 2004-06-29 Bae Systems Information And Electronic Systems Integration Inc. Thermoelectric microactuator
US6679064B2 (en) * 2002-05-13 2004-01-20 Taiwan Semiconductor Manufacturing Co., Ltd Wafer transfer system with temperature control apparatus
JP3989486B2 (ja) * 2002-06-06 2007-10-10 古河電気工業株式会社 熱電素子モジュール及びその作製方法
JP4401754B2 (ja) * 2003-11-28 2010-01-20 清仁 石田 熱電変換モジュールの製造方法
WO2005074049A2 (en) * 2004-01-16 2005-08-11 Massachusetts Institute Of Technology Potential amplified nonequilibrium thermal electric device (pantec)
CN100353534C (zh) * 2004-06-16 2007-12-05 华孚科技股份有限公司 热电式散热器的制造方法及所制造的热电式散热器
CN100346490C (zh) * 2004-06-21 2007-10-31 浙江大学 一种薄片型热电转换装置的制备方法
DE102004048220A1 (de) * 2004-09-30 2006-04-06 Basf Ag Kontaktierung thermoelektrischer Materialien durch Ultraschallschweißen
US7527101B2 (en) * 2005-01-27 2009-05-05 Schlumberger Technology Corporation Cooling apparatus and method
US8039726B2 (en) * 2005-05-26 2011-10-18 General Electric Company Thermal transfer and power generation devices and methods of making the same
US7310953B2 (en) 2005-11-09 2007-12-25 Emerson Climate Technologies, Inc. Refrigeration system including thermoelectric module
US20070101737A1 (en) * 2005-11-09 2007-05-10 Masao Akei Refrigeration system including thermoelectric heat recovery and actuation
US20070277866A1 (en) * 2006-05-31 2007-12-06 General Electric Company Thermoelectric nanotube arrays
CN101409324B (zh) * 2008-07-24 2013-10-16 中国科学院上海硅酸盐研究所 一种碲化铋基热电发电器件的制造方法
US20100024436A1 (en) * 2008-08-01 2010-02-04 Baker Hughes Incorporated Downhole tool with thin film thermoelectric cooling
WO2010125411A1 (en) * 2009-04-27 2010-11-04 Szenergia Kft. Procedure for producing a device containing metal and intermetallic semiconductor parts joined together with an electrically conductive and heat conducting connection, especially a rod suitable for use with thermoelectric modules
DE102010035151A1 (de) * 2010-08-23 2012-02-23 Emitec Gesellschaft Für Emissionstechnologie Mbh Halbleiterelement für ein thermoelektrisches Modul und Verfahren zu dessen Herstellung
WO2013069347A1 (ja) * 2011-11-08 2013-05-16 富士通株式会社 熱電変換素子及びその製造方法
US8889454B2 (en) * 2011-11-08 2014-11-18 Ut-Battelle, Llc Manufacture of thermoelectric generator structures by fiber drawing
US8641917B2 (en) * 2011-12-01 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Ternary thermoelectric material containing nanoparticles and process for producing the same
US20130139866A1 (en) * 2011-12-01 2013-06-06 Marlow Industries, Inc. Ceramic Plate
MD542Z (ro) * 2012-01-13 2013-03-31 ИНСТИТУТ ЭЛЕКТРОННОЙ ИНЖЕНЕРИИ И НАНОТЕХНОЛОГИЙ "D. Ghitu" АНМ Material termoelectric anizotropic pe bază de bismut
CN104703749A (zh) * 2013-01-28 2015-06-10 日本半田株式会社 用于芯片焊接的钎焊合金
US10141492B2 (en) 2015-05-14 2018-11-27 Nimbus Materials Inc. Energy harvesting for wearable technology through a thin flexible thermoelectric device
US10566515B2 (en) 2013-12-06 2020-02-18 Sridhar Kasichainula Extended area of sputter deposited N-type and P-type thermoelectric legs in a flexible thin-film based thermoelectric device
US20180090660A1 (en) 2013-12-06 2018-03-29 Sridhar Kasichainula Flexible thin-film based thermoelectric device with sputter deposited layer of n-type and p-type thermoelectric legs
US10290794B2 (en) 2016-12-05 2019-05-14 Sridhar Kasichainula Pin coupling based thermoelectric device
US10367131B2 (en) 2013-12-06 2019-07-30 Sridhar Kasichainula Extended area of sputter deposited n-type and p-type thermoelectric legs in a flexible thin-film based thermoelectric device
US11024789B2 (en) 2013-12-06 2021-06-01 Sridhar Kasichainula Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of N-type and P-type thermoelectric legs
CA2868197C (en) 2014-01-31 2020-03-10 Berken Energy Llc Methods for thick film thermoelectric device fabrication
US20150240793A1 (en) * 2014-02-21 2015-08-27 The Boeing Company Temperature control system for shape-memory alloy
TWI575786B (zh) * 2014-04-08 2017-03-21 財團法人紡織產業綜合研究所 一種熱電轉換元件
KR20160028697A (ko) 2014-09-04 2016-03-14 한국전기연구원 벌크형 소면적 열전모듈 및 그 제조방법
US11283000B2 (en) 2015-05-14 2022-03-22 Nimbus Materials Inc. Method of producing a flexible thermoelectric device to harvest energy for wearable applications
US11276810B2 (en) 2015-05-14 2022-03-15 Nimbus Materials Inc. Method of producing a flexible thermoelectric device to harvest energy for wearable applications
US9995288B2 (en) 2016-01-28 2018-06-12 The Boeing Company Solid-state motor and associated systems and methods
WO2017216797A1 (en) * 2016-06-14 2017-12-21 Ariel Scientific Innovations Ltd. Thermoelectric generator
US10288048B2 (en) 2016-12-16 2019-05-14 The Boeing Company Deforming shape memory alloy using self-regulating thermal elements
CN109873096A (zh) * 2017-12-01 2019-06-11 中国电力科学研究院有限公司 一种温度可调控的车载动力电池组
CN108281541A (zh) * 2018-02-08 2018-07-13 南方科技大学 可预成型的热电器件及制备方法
CN108461617B (zh) * 2018-02-08 2025-03-28 南方科技大学 温度调控器件及制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2685608A (en) * 1951-11-02 1954-08-03 Siemens Ag Thermoelement, particularly for the electrothermic production of cold
US3079455A (en) * 1956-09-14 1963-02-26 Rca Corp Method and materials for obtaining low resistance bonds to bismuth telluride
US3037064A (en) * 1960-12-12 1962-05-29 Rca Corp Method and materials for obtaining low resistance bonds to thermoelectric bodies
US3110100A (en) * 1962-01-11 1963-11-12 Gen Instrument Corp Method of bonding bismuth-containing bodies
DE1295040B (de) * 1964-09-18 1969-05-14 Siemens Ag Thermoelektrische Anordnung und Verfahren zu ihrer Herstellung
GB1142200A (en) * 1965-11-17 1969-02-05 Ass Elect Ind Improvements relating to vacuum switch contacts
US3859143A (en) * 1970-07-23 1975-01-07 Rca Corp Stable bonded barrier layer-telluride thermoelectric device
US4503131A (en) * 1982-01-18 1985-03-05 Richardson Chemical Company Electrical contact materials
US4489742A (en) * 1983-07-21 1984-12-25 Energy Conversion Devices, Inc. Thermoelectric device and method of making and using same
CN85108316B (zh) * 1985-11-07 1987-09-09 西北大学 半导体致冷器焊料
US4764212A (en) * 1986-02-21 1988-08-16 Kabushiki Kaisha Komatsu Seisakusho Thermoelectric material for low temperature use and method of manufacturing the same
US4855810A (en) * 1987-06-02 1989-08-08 Gelb Allan S Thermoelectric heat pump
US4806309A (en) * 1988-01-05 1989-02-21 Willard Industries, Inc. Tin base lead-free solder composition containing bismuth, silver and antimony
US5429680A (en) * 1993-11-19 1995-07-04 Fuschetti; Dean F. Thermoelectric heat pump

Also Published As

Publication number Publication date
EP0870337A4 (en) 1999-02-17
EA199800303A1 (ru) 1998-10-29
ATE228270T1 (de) 2002-12-15
WO1997013283A1 (en) 1997-04-10
JP3862179B2 (ja) 2006-12-27
EP0870337A1 (en) 1998-10-14
CN1326256C (zh) 2007-07-11
EA000388B1 (ru) 1999-06-24
ES2183979T3 (es) 2003-04-01
NO981507D0 (no) 1998-04-02
NO981507L (no) 1998-04-02
EP0870337B1 (en) 2002-11-20
IL123773A0 (en) 1999-11-30
US5817188A (en) 1998-10-06
CN1211342A (zh) 1999-03-17
MX9802673A (es) 1998-11-30
BR9610829A (pt) 1999-12-21
HUP9902023A2 (hu) 1999-11-29
JP2002507321A (ja) 2002-03-05
DK0870337T3 (da) 2003-03-03
AU702453B2 (en) 1999-02-18
CA2233979C (en) 2005-09-27
PT870337E (pt) 2003-03-31
CA2233979A1 (en) 1997-04-10
HUP9902023A3 (en) 2002-11-28
CZ102898A3 (cs) 1998-08-12
TR199800606T1 (xx) 1998-06-22
KR19990066931A (ko) 1999-08-16
DE69624936D1 (de) 2003-01-02
DE69624936T2 (de) 2003-03-27
UA51672C2 (uk) 2002-12-16
AU7394796A (en) 1997-04-28

Similar Documents

Publication Publication Date Title
IL123773A0 (en) Fabrication of thermoelectric modules and solder for such fabrication
GB9312878D0 (en) Electrical interconnection substrate with both wire bond and solder contacts,and fabrication method
GB8416965D0 (en) Fabricating solar cells
GB2135512B (en) Semiconductor photoelectric conversion device light-transparent substrate therefor and their manufacturing methods
DE3571895D1 (en) Semiconductor memory device having stacked-capacitor type memory cells and manufacturing method for the same
MY103143A (en) Interconnected semiconductor devices
GB2233344B (en) Electrically joining superconductors to themselves, to normal conductors, and to semi-conductors
AU636616B2 (en) Electrode structure for iii-v compound semiconductor element and method of manufacturing the same
MY114206A (en) A strip-shaped or wire-shaped compound material
EP0259035A3 (en) Solder joint between an electrical component and a substrate
EP0075454A3 (en) Semiconductor device having new conductive interconnection structure and method for manufacturing the same
FR2604298B1 (fr) Procede de realisation d'une prise de contact electrique sur un substrat en hgcdte de conductivite p et application a la fabrication d'une diode n/p
EP0349021A3 (en) Semiconductor device and method of manufacturing the same
EP0332329A3 (en) Semiconductor substrate including strained layer superlattice structure layer
GB2193838B (en) Composite substrate for fuel cells and process for producing the same
EP0325408A3 (en) Semiconductor device having an interconnection layer
GB2273257B (en) Electrical interconnection substrate with both wire bond and solder contacts
JPS55127027A (en) Semiconductor device
GB8516878D0 (en) Fabricating solar cells
EP0391420A3 (en) Radiation resistant semiconductor structure
DE3476817D1 (en) Genetically stable allopolyploid somatic fusion product useful in the production of fuel alcohols
ADAMO et al. Conductor structure for thick film electrical device(Patent)
GB8525792D0 (en) Fabricating devices on semiconductor substrates
JPS6411349A (en) Semiconductor device
Kistaiah et al. High-Pressure Electrical Resistivity of HgCr sub 2 Se sub 4

Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed
KB Patent renewed
KB Patent renewed
MM9K Patent not in force due to non-payment of renewal fees