ES2183979T3 - Fabricacion de modulos termoelectricos y material de soldadura para dicha fabricacion. - Google Patents
Fabricacion de modulos termoelectricos y material de soldadura para dicha fabricacion.Info
- Publication number
- ES2183979T3 ES2183979T3 ES96936249T ES96936249T ES2183979T3 ES 2183979 T3 ES2183979 T3 ES 2183979T3 ES 96936249 T ES96936249 T ES 96936249T ES 96936249 T ES96936249 T ES 96936249T ES 2183979 T3 ES2183979 T3 ES 2183979T3
- Authority
- ES
- Spain
- Prior art keywords
- manufacture
- thermoelectric
- bismute
- thermoelectric modules
- percent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 239000000463 material Substances 0.000 title abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910052787 antimony Inorganic materials 0.000 abstract 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/82—Connection of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Ceramic Products (AREA)
Abstract
LA PRESENTE INVENCION SE REFIERE A UN MODULO TERMOELECTRICO (10) CONSTRUIDO CON JUNTAS DE SOLDADURA (28, 30), CUYA ALEACION DE APORTE CONTIENE ENTRE 50 Y 99 POR CIENTO EN PESO DE BISMUTO Y ENTRE 50 Y 1 POR CIENTO EN PESO DE ANTIMONIO; LAS JUNTAS ESTAN ESTABLECIDAS ENTRE LOS ELEMENTOS TERMOELECTRICOS (12, 14) Y LOS CONDUCTORES DE CONEXION (24, 26). TAMBIEN PRESENTA UN MODULO TERMOELECTRICO (10) CON ELEMENTOS DE TELURURO DE BISMUTO (12, 14) CUBIERTOS CON UN MATERIAL CONDUCTOR (16, 18), QUE NO REQUIERE NIQUEL U OTRA BARRERA DE DIFUSION. ADEMAS SE PRESENTAN MODULOS (10) QUE DISPONEN DE CONDUCTORES (24, 26) CON SUPERFICIE DE FOSFORO-NIQUEL (20, 22). SE INDICAN ADEMAS LOS METODOS DE FABRICACION Y USO DE DICHOS MODULOS TERMOELECTRICOS (10).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53844995A | 1995-10-03 | 1995-10-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2183979T3 true ES2183979T3 (es) | 2003-04-01 |
Family
ID=24146982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96936249T Expired - Lifetime ES2183979T3 (es) | 1995-10-03 | 1996-09-30 | Fabricacion de modulos termoelectricos y material de soldadura para dicha fabricacion. |
Country Status (22)
Country | Link |
---|---|
US (1) | US5817188A (es) |
EP (1) | EP0870337B1 (es) |
JP (1) | JP3862179B2 (es) |
KR (1) | KR19990066931A (es) |
CN (1) | CN1326256C (es) |
AT (1) | ATE228270T1 (es) |
AU (1) | AU702453B2 (es) |
BR (1) | BR9610829A (es) |
CA (1) | CA2233979C (es) |
CZ (1) | CZ102898A3 (es) |
DE (1) | DE69624936T2 (es) |
DK (1) | DK0870337T3 (es) |
EA (1) | EA000388B1 (es) |
ES (1) | ES2183979T3 (es) |
HU (1) | HUP9902023A3 (es) |
IL (1) | IL123773A (es) |
MX (1) | MX9802673A (es) |
NO (1) | NO981507L (es) |
PT (1) | PT870337E (es) |
TR (1) | TR199800606T1 (es) |
UA (1) | UA51672C2 (es) |
WO (1) | WO1997013283A1 (es) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3459328B2 (ja) * | 1996-07-26 | 2003-10-20 | 日本政策投資銀行 | 熱電半導体およびその製造方法 |
JPH10178216A (ja) * | 1996-12-18 | 1998-06-30 | Seru Appl Kk | 熱電素子及び熱電冷却装置 |
JP3144328B2 (ja) * | 1996-12-24 | 2001-03-12 | 松下電工株式会社 | 熱電変換素子およびその製造方法 |
US6034318A (en) * | 1997-02-21 | 2000-03-07 | Volvo Aero Corporation | Thermoelectric generator unit |
JP3982080B2 (ja) * | 1997-12-05 | 2007-09-26 | 松下電工株式会社 | 熱電モジュールの製造法と熱電モジュール |
IL123238A0 (en) * | 1998-02-09 | 1998-09-24 | Israel Thermo Electrical Ltd | Thermo-electric generator and module for use therein |
US6103967A (en) * | 1998-06-29 | 2000-08-15 | Tellurex Corporation | Thermoelectric module and method of manufacturing the same |
US6222113B1 (en) * | 1999-12-09 | 2001-04-24 | International Business Machines Corporation | Electrically-isolated ultra-thin substrates for thermoelectric coolers |
US20020119079A1 (en) * | 1999-12-10 | 2002-08-29 | Norbert Breuer | Chemical microreactor and microreactor made by process |
US6492585B1 (en) | 2000-03-27 | 2002-12-10 | Marlow Industries, Inc. | Thermoelectric device assembly and method for fabrication of same |
US6271459B1 (en) | 2000-04-26 | 2001-08-07 | Wafermasters, Inc. | Heat management in wafer processing equipment using thermoelectric device |
JP2002134796A (ja) * | 2000-10-19 | 2002-05-10 | Nhk Spring Co Ltd | Bi−Te系半導体素子およびBi−Te系熱電モジュール |
US6555413B1 (en) * | 2001-02-23 | 2003-04-29 | Triquint Technology Holding Co. | Method for interconnecting semiconductor elements to form a thermoelectric cooler and a thermoelectric cooler formed therefrom |
US6484513B1 (en) * | 2001-09-05 | 2002-11-26 | Chin-Lung Chou | Freezing sucker |
US7038234B2 (en) * | 2001-12-12 | 2006-05-02 | Hi-Z Technology, Inc. | Thermoelectric module with Si/SiGe and B4C/B9C super-lattice legs |
JP2003198117A (ja) * | 2001-12-28 | 2003-07-11 | Matsushita Electric Ind Co Ltd | はんだ付け方法および接合構造体 |
US6756536B2 (en) * | 2002-03-28 | 2004-06-29 | Bae Systems Information And Electronic Systems Integration Inc. | Thermoelectric microactuator |
US6679064B2 (en) * | 2002-05-13 | 2004-01-20 | Taiwan Semiconductor Manufacturing Co., Ltd | Wafer transfer system with temperature control apparatus |
JP3989486B2 (ja) * | 2002-06-06 | 2007-10-10 | 古河電気工業株式会社 | 熱電素子モジュール及びその作製方法 |
JP4401754B2 (ja) * | 2003-11-28 | 2010-01-20 | 清仁 石田 | 熱電変換モジュールの製造方法 |
WO2005074049A2 (en) * | 2004-01-16 | 2005-08-11 | Massachusetts Institute Of Technology | Potential amplified nonequilibrium thermal electric device (pantec) |
CN100353534C (zh) * | 2004-06-16 | 2007-12-05 | 华孚科技股份有限公司 | 热电式散热器的制造方法及所制造的热电式散热器 |
CN100346490C (zh) * | 2004-06-21 | 2007-10-31 | 浙江大学 | 一种薄片型热电转换装置的制备方法 |
DE102004048220A1 (de) * | 2004-09-30 | 2006-04-06 | Basf Ag | Kontaktierung thermoelektrischer Materialien durch Ultraschallschweißen |
US7527101B2 (en) * | 2005-01-27 | 2009-05-05 | Schlumberger Technology Corporation | Cooling apparatus and method |
US8039726B2 (en) * | 2005-05-26 | 2011-10-18 | General Electric Company | Thermal transfer and power generation devices and methods of making the same |
US20070101737A1 (en) * | 2005-11-09 | 2007-05-10 | Masao Akei | Refrigeration system including thermoelectric heat recovery and actuation |
US7310953B2 (en) | 2005-11-09 | 2007-12-25 | Emerson Climate Technologies, Inc. | Refrigeration system including thermoelectric module |
US20070277866A1 (en) * | 2006-05-31 | 2007-12-06 | General Electric Company | Thermoelectric nanotube arrays |
CN101409324B (zh) * | 2008-07-24 | 2013-10-16 | 中国科学院上海硅酸盐研究所 | 一种碲化铋基热电发电器件的制造方法 |
US20100024436A1 (en) * | 2008-08-01 | 2010-02-04 | Baker Hughes Incorporated | Downhole tool with thin film thermoelectric cooling |
WO2010125411A1 (en) * | 2009-04-27 | 2010-11-04 | Szenergia Kft. | Procedure for producing a device containing metal and intermetallic semiconductor parts joined together with an electrically conductive and heat conducting connection, especially a rod suitable for use with thermoelectric modules |
DE102010035151A1 (de) * | 2010-08-23 | 2012-02-23 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Halbleiterelement für ein thermoelektrisches Modul und Verfahren zu dessen Herstellung |
JP5831554B2 (ja) * | 2011-11-08 | 2015-12-09 | 富士通株式会社 | 熱電変換素子及びその製造方法 |
US8889454B2 (en) * | 2011-11-08 | 2014-11-18 | Ut-Battelle, Llc | Manufacture of thermoelectric generator structures by fiber drawing |
US20130139866A1 (en) * | 2011-12-01 | 2013-06-06 | Marlow Industries, Inc. | Ceramic Plate |
US8641917B2 (en) * | 2011-12-01 | 2014-02-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Ternary thermoelectric material containing nanoparticles and process for producing the same |
MD542Z (ro) * | 2012-01-13 | 2013-03-31 | ИНСТИТУТ ЭЛЕКТРОННОЙ ИНЖЕНЕРИИ И НАНОТЕХНОЛОГИЙ "D. Ghitu" АНМ | Material termoelectric anizotropic pe bază de bismut |
JP6038187B2 (ja) * | 2013-01-28 | 2016-12-07 | ニホンハンダ株式会社 | ダイボンド接合用はんだ合金 |
US10290794B2 (en) | 2016-12-05 | 2019-05-14 | Sridhar Kasichainula | Pin coupling based thermoelectric device |
US20180090660A1 (en) | 2013-12-06 | 2018-03-29 | Sridhar Kasichainula | Flexible thin-film based thermoelectric device with sputter deposited layer of n-type and p-type thermoelectric legs |
US10141492B2 (en) | 2015-05-14 | 2018-11-27 | Nimbus Materials Inc. | Energy harvesting for wearable technology through a thin flexible thermoelectric device |
US10367131B2 (en) | 2013-12-06 | 2019-07-30 | Sridhar Kasichainula | Extended area of sputter deposited n-type and p-type thermoelectric legs in a flexible thin-film based thermoelectric device |
US10566515B2 (en) | 2013-12-06 | 2020-02-18 | Sridhar Kasichainula | Extended area of sputter deposited N-type and P-type thermoelectric legs in a flexible thin-film based thermoelectric device |
US11024789B2 (en) | 2013-12-06 | 2021-06-01 | Sridhar Kasichainula | Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of N-type and P-type thermoelectric legs |
CA2868197C (en) | 2014-01-31 | 2020-03-10 | Berken Energy Llc | Methods for thick film thermoelectric device fabrication |
US20150240793A1 (en) * | 2014-02-21 | 2015-08-27 | The Boeing Company | Temperature control system for shape-memory alloy |
TWI575786B (zh) * | 2014-04-08 | 2017-03-21 | 財團法人紡織產業綜合研究所 | 一種熱電轉換元件 |
KR20160028697A (ko) | 2014-09-04 | 2016-03-14 | 한국전기연구원 | 벌크형 소면적 열전모듈 및 그 제조방법 |
US11283000B2 (en) | 2015-05-14 | 2022-03-22 | Nimbus Materials Inc. | Method of producing a flexible thermoelectric device to harvest energy for wearable applications |
US11276810B2 (en) | 2015-05-14 | 2022-03-15 | Nimbus Materials Inc. | Method of producing a flexible thermoelectric device to harvest energy for wearable applications |
US9995288B2 (en) | 2016-01-28 | 2018-06-12 | The Boeing Company | Solid-state motor and associated systems and methods |
WO2017216797A1 (en) * | 2016-06-14 | 2017-12-21 | Ariel Scientific Innovations Ltd. | Thermoelectric generator |
US10288048B2 (en) | 2016-12-16 | 2019-05-14 | The Boeing Company | Deforming shape memory alloy using self-regulating thermal elements |
CN109873096A (zh) * | 2017-12-01 | 2019-06-11 | 中国电力科学研究院有限公司 | 一种温度可调控的车载动力电池组 |
CN108281541A (zh) * | 2018-02-08 | 2018-07-13 | 南方科技大学 | 可预成型的热电器件及制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2685608A (en) * | 1951-11-02 | 1954-08-03 | Siemens Ag | Thermoelement, particularly for the electrothermic production of cold |
US3079455A (en) * | 1956-09-14 | 1963-02-26 | Rca Corp | Method and materials for obtaining low resistance bonds to bismuth telluride |
US3037064A (en) * | 1960-12-12 | 1962-05-29 | Rca Corp | Method and materials for obtaining low resistance bonds to thermoelectric bodies |
US3110100A (en) * | 1962-01-11 | 1963-11-12 | Gen Instrument Corp | Method of bonding bismuth-containing bodies |
DE1295040B (de) * | 1964-09-18 | 1969-05-14 | Siemens Ag | Thermoelektrische Anordnung und Verfahren zu ihrer Herstellung |
GB1142200A (en) * | 1965-11-17 | 1969-02-05 | Ass Elect Ind | Improvements relating to vacuum switch contacts |
US3859143A (en) * | 1970-07-23 | 1975-01-07 | Rca Corp | Stable bonded barrier layer-telluride thermoelectric device |
US4503131A (en) * | 1982-01-18 | 1985-03-05 | Richardson Chemical Company | Electrical contact materials |
US4489742A (en) * | 1983-07-21 | 1984-12-25 | Energy Conversion Devices, Inc. | Thermoelectric device and method of making and using same |
CN85108316B (zh) * | 1985-11-07 | 1987-09-09 | 西北大学 | 半导体致冷器焊料 |
US4764212A (en) * | 1986-02-21 | 1988-08-16 | Kabushiki Kaisha Komatsu Seisakusho | Thermoelectric material for low temperature use and method of manufacturing the same |
US4855810A (en) * | 1987-06-02 | 1989-08-08 | Gelb Allan S | Thermoelectric heat pump |
US4806309A (en) * | 1988-01-05 | 1989-02-21 | Willard Industries, Inc. | Tin base lead-free solder composition containing bismuth, silver and antimony |
US5429680A (en) * | 1993-11-19 | 1995-07-04 | Fuschetti; Dean F. | Thermoelectric heat pump |
-
1996
- 1996-09-16 US US08/713,106 patent/US5817188A/en not_active Expired - Lifetime
- 1996-09-30 JP JP51451897A patent/JP3862179B2/ja not_active Expired - Fee Related
- 1996-09-30 EA EA199800303A patent/EA000388B1/ru not_active IP Right Cessation
- 1996-09-30 PT PT96936249T patent/PT870337E/pt unknown
- 1996-09-30 HU HU9902023A patent/HUP9902023A3/hu unknown
- 1996-09-30 AT AT96936249T patent/ATE228270T1/de not_active IP Right Cessation
- 1996-09-30 AU AU73947/96A patent/AU702453B2/en not_active Ceased
- 1996-09-30 CZ CZ981028A patent/CZ102898A3/cs unknown
- 1996-09-30 TR TR1998/00606T patent/TR199800606T1/xx unknown
- 1996-09-30 EP EP96936249A patent/EP0870337B1/en not_active Expired - Lifetime
- 1996-09-30 CA CA002233979A patent/CA2233979C/en not_active Expired - Fee Related
- 1996-09-30 DE DE69624936T patent/DE69624936T2/de not_active Expired - Lifetime
- 1996-09-30 DK DK96936249T patent/DK0870337T3/da active
- 1996-09-30 KR KR1019980702474A patent/KR19990066931A/ko active IP Right Grant
- 1996-09-30 UA UA98041709A patent/UA51672C2/uk unknown
- 1996-09-30 CN CNB961974478A patent/CN1326256C/zh not_active Expired - Fee Related
- 1996-09-30 ES ES96936249T patent/ES2183979T3/es not_active Expired - Lifetime
- 1996-09-30 IL IL12377396A patent/IL123773A/xx not_active IP Right Cessation
- 1996-09-30 WO PCT/US1996/016077 patent/WO1997013283A1/en not_active Application Discontinuation
- 1996-09-30 BR BR9610829-0A patent/BR9610829A/pt unknown
-
1998
- 1998-04-02 NO NO981507A patent/NO981507L/no unknown
- 1998-04-03 MX MX9802673A patent/MX9802673A/es not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0870337A1 (en) | 1998-10-14 |
JP3862179B2 (ja) | 2006-12-27 |
HUP9902023A3 (en) | 2002-11-28 |
AU7394796A (en) | 1997-04-28 |
UA51672C2 (uk) | 2002-12-16 |
CN1211342A (zh) | 1999-03-17 |
EP0870337A4 (en) | 1999-02-17 |
ATE228270T1 (de) | 2002-12-15 |
PT870337E (pt) | 2003-03-31 |
MX9802673A (es) | 1998-11-30 |
DE69624936D1 (de) | 2003-01-02 |
EP0870337B1 (en) | 2002-11-20 |
CN1326256C (zh) | 2007-07-11 |
JP2002507321A (ja) | 2002-03-05 |
IL123773A (en) | 2001-03-19 |
CA2233979C (en) | 2005-09-27 |
WO1997013283A1 (en) | 1997-04-10 |
DE69624936T2 (de) | 2003-03-27 |
NO981507D0 (no) | 1998-04-02 |
US5817188A (en) | 1998-10-06 |
DK0870337T3 (da) | 2003-03-03 |
IL123773A0 (en) | 1999-11-30 |
EA199800303A1 (ru) | 1998-10-29 |
NO981507L (no) | 1998-04-02 |
CZ102898A3 (cs) | 1998-08-12 |
AU702453B2 (en) | 1999-02-18 |
CA2233979A1 (en) | 1997-04-10 |
EA000388B1 (ru) | 1999-06-24 |
TR199800606T1 (xx) | 1998-06-22 |
BR9610829A (pt) | 1999-12-21 |
KR19990066931A (ko) | 1999-08-16 |
HUP9902023A2 (hu) | 1999-11-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2183979T3 (es) | Fabricacion de modulos termoelectricos y material de soldadura para dicha fabricacion. | |
ATE260644T1 (de) | Peptid/lipid-komplexbildung durch co- lyophilisation | |
EP0801765A1 (en) | Picture display device | |
WO1997034316A3 (en) | Interconnection routing system | |
IT8420126A0 (it) | Mosfet di elevata potenza, con connessione diretta dalle aree di collegamento al silicio sottostante. | |
DK0734253T3 (da) | Tofaset kapselformulering | |
ATE114871T1 (de) | Ununterbrochene matrix, deren plattengrösse programmierbar ist. | |
ES2114794B1 (es) | Sistema de cableado de motor. | |
MY118383A (en) | Multiple pixel driven mirror electrodes for improved aperture ratio of reflective displays | |
WO1996030944A3 (de) | Trägermodul | |
ES2024660B3 (es) | Modulo de potencia para equipos automoviles. | |
ES2036343T3 (es) | Mecanismo de espejo abatible. | |
ES2151097T3 (es) | Laminas de embalaje recubiertas con poliuretano. | |
DE3861554D1 (de) | Vordere mittelarmlehne mit zwei stabilen lagen fuer kraftfahrzeuge. | |
ITTO911040A1 (it) | Serbatorio di carburante per autoveicoli e procedimento per la sua realizzazione. | |
IT1267499B1 (it) | Accoppiatore per batteria con fusibili. | |
FR2655393B1 (fr) | Dispositif d'assemblage d'equerre entre des elements tubulaires. | |
ES2193011T3 (es) | Dispositivo indicador para vehiculos con una superficie de visualizacion dispuesta en la direccion visual del conductor. | |
FR2706514B1 (fr) | Dispositif d'assemblage de poutrelles. | |
FI944886A0 (fi) | Yökastelulaitteistoon sovitettava sähköoptinen etäisyysmittari | |
DE69108254D1 (de) | Vesikel aus phospholipidderivaten mit einem succinimidylsubstituenten. | |
FR2690285B1 (fr) | Dispositif de connexion electrique entre deux pieces susceptibles de rotation relative. | |
TH34664A (th) | ไฮดรอกซีฟีนิลไทรอะซีน | |
ITRM940615A0 (it) | Motorino di avviamento di autoveicolo di tipo coassiale. | |
Lang | Message du Maire de Montbéliard au Maire de Ludwigsburg remis par les participant à la rencontre sportive entre policiers des deux villes |