MX9802673A - Fabricacion de modulos termoelectricos y soldador para tal fabricacion. - Google Patents
Fabricacion de modulos termoelectricos y soldador para tal fabricacion.Info
- Publication number
- MX9802673A MX9802673A MX9802673A MX9802673A MX9802673A MX 9802673 A MX9802673 A MX 9802673A MX 9802673 A MX9802673 A MX 9802673A MX 9802673 A MX9802673 A MX 9802673A MX 9802673 A MX9802673 A MX 9802673A
- Authority
- MX
- Mexico
- Prior art keywords
- fabrication
- solder
- thermoelectric
- thermoelectric modules
- modules
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/82—Connection of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Ceramic Products (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Un modulo termoeléctrico (10) se forma con uniones de soldadura (28, 30), la soldadura que contiene aproximadamente 50 hasta 99% en peso de bismuto y aproximadamente 50 hasta 1% en peso de antimonio, entre el elemento termoeléctrico (12, 14) y los conductores de conexion (24, 26). Asimismo se proporciona un modulo termoeléctrico (10) que tiene elementos de telurido de bismuto (12, 14) recubiertos con un material conductor (16, 18) que no requiere una barrera de difusion de níquel u otra. Se proporcionan además modulos (10) que tienen conductores (24, 26) con una superficie de fosforo-níquel (20, 22). Se proporcionan además los métodos de fabricacion y uso de tales modulos termoeléctricos (10).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53844995A | 1995-10-03 | 1995-10-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9802673A true MX9802673A (es) | 1998-11-30 |
Family
ID=24146982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9802673A MX9802673A (es) | 1995-10-03 | 1998-04-03 | Fabricacion de modulos termoelectricos y soldador para tal fabricacion. |
Country Status (22)
Country | Link |
---|---|
US (1) | US5817188A (es) |
EP (1) | EP0870337B1 (es) |
JP (1) | JP3862179B2 (es) |
KR (1) | KR19990066931A (es) |
CN (1) | CN1326256C (es) |
AT (1) | ATE228270T1 (es) |
AU (1) | AU702453B2 (es) |
BR (1) | BR9610829A (es) |
CA (1) | CA2233979C (es) |
CZ (1) | CZ102898A3 (es) |
DE (1) | DE69624936T2 (es) |
DK (1) | DK0870337T3 (es) |
EA (1) | EA000388B1 (es) |
ES (1) | ES2183979T3 (es) |
HU (1) | HUP9902023A3 (es) |
IL (1) | IL123773A (es) |
MX (1) | MX9802673A (es) |
NO (1) | NO981507D0 (es) |
PT (1) | PT870337E (es) |
TR (1) | TR199800606T1 (es) |
UA (1) | UA51672C2 (es) |
WO (1) | WO1997013283A1 (es) |
Families Citing this family (56)
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JP3144328B2 (ja) * | 1996-12-24 | 2001-03-12 | 松下電工株式会社 | 熱電変換素子およびその製造方法 |
US6034318A (en) * | 1997-02-21 | 2000-03-07 | Volvo Aero Corporation | Thermoelectric generator unit |
JP3982080B2 (ja) * | 1997-12-05 | 2007-09-26 | 松下電工株式会社 | 熱電モジュールの製造法と熱電モジュール |
IL123238A0 (en) * | 1998-02-09 | 1998-09-24 | Israel Thermo Electrical Ltd | Thermo-electric generator and module for use therein |
US6103967A (en) * | 1998-06-29 | 2000-08-15 | Tellurex Corporation | Thermoelectric module and method of manufacturing the same |
US6222113B1 (en) * | 1999-12-09 | 2001-04-24 | International Business Machines Corporation | Electrically-isolated ultra-thin substrates for thermoelectric coolers |
US20020119079A1 (en) * | 1999-12-10 | 2002-08-29 | Norbert Breuer | Chemical microreactor and microreactor made by process |
US6492585B1 (en) | 2000-03-27 | 2002-12-10 | Marlow Industries, Inc. | Thermoelectric device assembly and method for fabrication of same |
US6271459B1 (en) | 2000-04-26 | 2001-08-07 | Wafermasters, Inc. | Heat management in wafer processing equipment using thermoelectric device |
JP2002134796A (ja) * | 2000-10-19 | 2002-05-10 | Nhk Spring Co Ltd | Bi−Te系半導体素子およびBi−Te系熱電モジュール |
US6555413B1 (en) * | 2001-02-23 | 2003-04-29 | Triquint Technology Holding Co. | Method for interconnecting semiconductor elements to form a thermoelectric cooler and a thermoelectric cooler formed therefrom |
US6484513B1 (en) * | 2001-09-05 | 2002-11-26 | Chin-Lung Chou | Freezing sucker |
US7038234B2 (en) * | 2001-12-12 | 2006-05-02 | Hi-Z Technology, Inc. | Thermoelectric module with Si/SiGe and B4C/B9C super-lattice legs |
JP2003198117A (ja) * | 2001-12-28 | 2003-07-11 | Matsushita Electric Ind Co Ltd | はんだ付け方法および接合構造体 |
WO2003105244A1 (ja) * | 2002-01-01 | 2003-12-18 | 古河電気工業株式会社 | 熱電素子モジュール及びその作製方法 |
US6756536B2 (en) * | 2002-03-28 | 2004-06-29 | Bae Systems Information And Electronic Systems Integration Inc. | Thermoelectric microactuator |
US6679064B2 (en) * | 2002-05-13 | 2004-01-20 | Taiwan Semiconductor Manufacturing Co., Ltd | Wafer transfer system with temperature control apparatus |
JP4401754B2 (ja) * | 2003-11-28 | 2010-01-20 | 清仁 石田 | 熱電変換モジュールの製造方法 |
WO2005074049A2 (en) * | 2004-01-16 | 2005-08-11 | Massachusetts Institute Of Technology | Potential amplified nonequilibrium thermal electric device (pantec) |
CN100353534C (zh) * | 2004-06-16 | 2007-12-05 | 华孚科技股份有限公司 | 热电式散热器的制造方法及所制造的热电式散热器 |
CN100346490C (zh) * | 2004-06-21 | 2007-10-31 | 浙江大学 | 一种薄片型热电转换装置的制备方法 |
DE102004048220A1 (de) * | 2004-09-30 | 2006-04-06 | Basf Ag | Kontaktierung thermoelektrischer Materialien durch Ultraschallschweißen |
US7527101B2 (en) * | 2005-01-27 | 2009-05-05 | Schlumberger Technology Corporation | Cooling apparatus and method |
US8039726B2 (en) * | 2005-05-26 | 2011-10-18 | General Electric Company | Thermal transfer and power generation devices and methods of making the same |
US20070101737A1 (en) | 2005-11-09 | 2007-05-10 | Masao Akei | Refrigeration system including thermoelectric heat recovery and actuation |
US7310953B2 (en) | 2005-11-09 | 2007-12-25 | Emerson Climate Technologies, Inc. | Refrigeration system including thermoelectric module |
US20070277866A1 (en) * | 2006-05-31 | 2007-12-06 | General Electric Company | Thermoelectric nanotube arrays |
CN101409324B (zh) * | 2008-07-24 | 2013-10-16 | 中国科学院上海硅酸盐研究所 | 一种碲化铋基热电发电器件的制造方法 |
US20100024436A1 (en) * | 2008-08-01 | 2010-02-04 | Baker Hughes Incorporated | Downhole tool with thin film thermoelectric cooling |
WO2010125411A1 (en) * | 2009-04-27 | 2010-11-04 | Szenergia Kft. | Procedure for producing a device containing metal and intermetallic semiconductor parts joined together with an electrically conductive and heat conducting connection, especially a rod suitable for use with thermoelectric modules |
DE102010035151A1 (de) * | 2010-08-23 | 2012-02-23 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Halbleiterelement für ein thermoelektrisches Modul und Verfahren zu dessen Herstellung |
WO2013069347A1 (ja) * | 2011-11-08 | 2013-05-16 | 富士通株式会社 | 熱電変換素子及びその製造方法 |
WO2013119284A2 (en) * | 2011-11-08 | 2013-08-15 | Ut-Battelle, Llc | Manufacture of thermoelectric generator structures by fiber drawing |
US8641917B2 (en) * | 2011-12-01 | 2014-02-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Ternary thermoelectric material containing nanoparticles and process for producing the same |
US20130139866A1 (en) * | 2011-12-01 | 2013-06-06 | Marlow Industries, Inc. | Ceramic Plate |
MD542Z (ro) * | 2012-01-13 | 2013-03-31 | ИНСТИТУТ ЭЛЕКТРОННОЙ ИНЖЕНЕРИИ И НАНОТЕХНОЛОГИЙ "D. Ghitu" АНМ | Material termoelectric anizotropic pe bază de bismut |
CN104703749A (zh) * | 2013-01-28 | 2015-06-10 | 日本半田株式会社 | 用于芯片焊接的钎焊合金 |
US10367131B2 (en) | 2013-12-06 | 2019-07-30 | Sridhar Kasichainula | Extended area of sputter deposited n-type and p-type thermoelectric legs in a flexible thin-film based thermoelectric device |
US20180090660A1 (en) | 2013-12-06 | 2018-03-29 | Sridhar Kasichainula | Flexible thin-film based thermoelectric device with sputter deposited layer of n-type and p-type thermoelectric legs |
US10290794B2 (en) | 2016-12-05 | 2019-05-14 | Sridhar Kasichainula | Pin coupling based thermoelectric device |
US11024789B2 (en) | 2013-12-06 | 2021-06-01 | Sridhar Kasichainula | Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of N-type and P-type thermoelectric legs |
US10566515B2 (en) | 2013-12-06 | 2020-02-18 | Sridhar Kasichainula | Extended area of sputter deposited N-type and P-type thermoelectric legs in a flexible thin-film based thermoelectric device |
US10141492B2 (en) | 2015-05-14 | 2018-11-27 | Nimbus Materials Inc. | Energy harvesting for wearable technology through a thin flexible thermoelectric device |
CA2868197C (en) | 2014-01-31 | 2020-03-10 | Berken Energy Llc | Methods for thick film thermoelectric device fabrication |
US20150240793A1 (en) * | 2014-02-21 | 2015-08-27 | The Boeing Company | Temperature control system for shape-memory alloy |
TWI575786B (zh) * | 2014-04-08 | 2017-03-21 | 財團法人紡織產業綜合研究所 | 一種熱電轉換元件 |
KR20160028697A (ko) | 2014-09-04 | 2016-03-14 | 한국전기연구원 | 벌크형 소면적 열전모듈 및 그 제조방법 |
US11276810B2 (en) | 2015-05-14 | 2022-03-15 | Nimbus Materials Inc. | Method of producing a flexible thermoelectric device to harvest energy for wearable applications |
US11283000B2 (en) | 2015-05-14 | 2022-03-22 | Nimbus Materials Inc. | Method of producing a flexible thermoelectric device to harvest energy for wearable applications |
US9995288B2 (en) | 2016-01-28 | 2018-06-12 | The Boeing Company | Solid-state motor and associated systems and methods |
WO2017216797A1 (en) * | 2016-06-14 | 2017-12-21 | Ariel Scientific Innovations Ltd. | Thermoelectric generator |
US10288048B2 (en) | 2016-12-16 | 2019-05-14 | The Boeing Company | Deforming shape memory alloy using self-regulating thermal elements |
CN109873096A (zh) * | 2017-12-01 | 2019-06-11 | 中国电力科学研究院有限公司 | 一种温度可调控的车载动力电池组 |
CN108281541A (zh) * | 2018-02-08 | 2018-07-13 | 南方科技大学 | 可预成型的热电器件及制备方法 |
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US2685608A (en) * | 1951-11-02 | 1954-08-03 | Siemens Ag | Thermoelement, particularly for the electrothermic production of cold |
US3079455A (en) * | 1956-09-14 | 1963-02-26 | Rca Corp | Method and materials for obtaining low resistance bonds to bismuth telluride |
US3037064A (en) * | 1960-12-12 | 1962-05-29 | Rca Corp | Method and materials for obtaining low resistance bonds to thermoelectric bodies |
US3110100A (en) * | 1962-01-11 | 1963-11-12 | Gen Instrument Corp | Method of bonding bismuth-containing bodies |
DE1295040B (de) * | 1964-09-18 | 1969-05-14 | Siemens Ag | Thermoelektrische Anordnung und Verfahren zu ihrer Herstellung |
GB1142200A (en) * | 1965-11-17 | 1969-02-05 | Ass Elect Ind | Improvements relating to vacuum switch contacts |
US3859143A (en) * | 1970-07-23 | 1975-01-07 | Rca Corp | Stable bonded barrier layer-telluride thermoelectric device |
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US4764212A (en) * | 1986-02-21 | 1988-08-16 | Kabushiki Kaisha Komatsu Seisakusho | Thermoelectric material for low temperature use and method of manufacturing the same |
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US4806309A (en) * | 1988-01-05 | 1989-02-21 | Willard Industries, Inc. | Tin base lead-free solder composition containing bismuth, silver and antimony |
US5429680A (en) * | 1993-11-19 | 1995-07-04 | Fuschetti; Dean F. | Thermoelectric heat pump |
-
1996
- 1996-09-16 US US08/713,106 patent/US5817188A/en not_active Expired - Lifetime
- 1996-09-30 AT AT96936249T patent/ATE228270T1/de not_active IP Right Cessation
- 1996-09-30 IL IL12377396A patent/IL123773A/xx not_active IP Right Cessation
- 1996-09-30 CZ CZ981028A patent/CZ102898A3/cs unknown
- 1996-09-30 JP JP51451897A patent/JP3862179B2/ja not_active Expired - Fee Related
- 1996-09-30 DK DK96936249T patent/DK0870337T3/da active
- 1996-09-30 CA CA002233979A patent/CA2233979C/en not_active Expired - Fee Related
- 1996-09-30 CN CNB961974478A patent/CN1326256C/zh not_active Expired - Fee Related
- 1996-09-30 PT PT96936249T patent/PT870337E/pt unknown
- 1996-09-30 BR BR9610829-0A patent/BR9610829A/pt unknown
- 1996-09-30 HU HU9902023A patent/HUP9902023A3/hu unknown
- 1996-09-30 EP EP96936249A patent/EP0870337B1/en not_active Expired - Lifetime
- 1996-09-30 ES ES96936249T patent/ES2183979T3/es not_active Expired - Lifetime
- 1996-09-30 TR TR1998/00606T patent/TR199800606T1/xx unknown
- 1996-09-30 WO PCT/US1996/016077 patent/WO1997013283A1/en not_active Application Discontinuation
- 1996-09-30 AU AU73947/96A patent/AU702453B2/en not_active Ceased
- 1996-09-30 EA EA199800303A patent/EA000388B1/ru not_active IP Right Cessation
- 1996-09-30 UA UA98041709A patent/UA51672C2/uk unknown
- 1996-09-30 KR KR1019980702474A patent/KR19990066931A/ko active IP Right Grant
- 1996-09-30 DE DE69624936T patent/DE69624936T2/de not_active Expired - Lifetime
-
1998
- 1998-04-02 NO NO981507A patent/NO981507D0/no unknown
- 1998-04-03 MX MX9802673A patent/MX9802673A/es not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2002507321A (ja) | 2002-03-05 |
HUP9902023A2 (hu) | 1999-11-29 |
NO981507L (no) | 1998-04-02 |
TR199800606T1 (xx) | 1998-06-22 |
HUP9902023A3 (en) | 2002-11-28 |
UA51672C2 (uk) | 2002-12-16 |
CA2233979C (en) | 2005-09-27 |
US5817188A (en) | 1998-10-06 |
EP0870337A1 (en) | 1998-10-14 |
WO1997013283A1 (en) | 1997-04-10 |
KR19990066931A (ko) | 1999-08-16 |
CN1326256C (zh) | 2007-07-11 |
DE69624936T2 (de) | 2003-03-27 |
NO981507D0 (no) | 1998-04-02 |
JP3862179B2 (ja) | 2006-12-27 |
EP0870337B1 (en) | 2002-11-20 |
ES2183979T3 (es) | 2003-04-01 |
DE69624936D1 (de) | 2003-01-02 |
AU7394796A (en) | 1997-04-28 |
DK0870337T3 (da) | 2003-03-03 |
IL123773A (en) | 2001-03-19 |
CN1211342A (zh) | 1999-03-17 |
PT870337E (pt) | 2003-03-31 |
EA199800303A1 (ru) | 1998-10-29 |
ATE228270T1 (de) | 2002-12-15 |
BR9610829A (pt) | 1999-12-21 |
EP0870337A4 (en) | 1999-02-17 |
IL123773A0 (en) | 1999-11-30 |
CA2233979A1 (en) | 1997-04-10 |
CZ102898A3 (cs) | 1998-08-12 |
AU702453B2 (en) | 1999-02-18 |
EA000388B1 (ru) | 1999-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration | ||
MM | Annulment or lapse due to non-payment of fees |