HUP9902023A3 - Fabrication of thermoelectric modules and method to produce electricity - Google Patents

Fabrication of thermoelectric modules and method to produce electricity

Info

Publication number
HUP9902023A3
HUP9902023A3 HU9902023A HUP9902023A HUP9902023A3 HU P9902023 A3 HUP9902023 A3 HU P9902023A3 HU 9902023 A HU9902023 A HU 9902023A HU P9902023 A HUP9902023 A HU P9902023A HU P9902023 A3 HUP9902023 A3 HU P9902023A3
Authority
HU
Hungary
Prior art keywords
fabrication
produce electricity
thermoelectric modules
thermoelectric
modules
Prior art date
Application number
HU9902023A
Other languages
English (en)
Original Assignee
Melcor Corp Trenton
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melcor Corp Trenton filed Critical Melcor Corp Trenton
Publication of HUP9902023A2 publication Critical patent/HUP9902023A2/hu
Publication of HUP9902023A3 publication Critical patent/HUP9902023A3/hu

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/81Structural details of the junction
    • H10N10/817Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/82Connection of interconnections
HU9902023A 1995-10-03 1996-09-30 Fabrication of thermoelectric modules and method to produce electricity HUP9902023A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53844995A 1995-10-03 1995-10-03

Publications (2)

Publication Number Publication Date
HUP9902023A2 HUP9902023A2 (hu) 1999-11-29
HUP9902023A3 true HUP9902023A3 (en) 2002-11-28

Family

ID=24146982

Family Applications (1)

Application Number Title Priority Date Filing Date
HU9902023A HUP9902023A3 (en) 1995-10-03 1996-09-30 Fabrication of thermoelectric modules and method to produce electricity

Country Status (22)

Country Link
US (1) US5817188A (hu)
EP (1) EP0870337B1 (hu)
JP (1) JP3862179B2 (hu)
KR (1) KR19990066931A (hu)
CN (1) CN1326256C (hu)
AT (1) ATE228270T1 (hu)
AU (1) AU702453B2 (hu)
BR (1) BR9610829A (hu)
CA (1) CA2233979C (hu)
CZ (1) CZ102898A3 (hu)
DE (1) DE69624936T2 (hu)
DK (1) DK0870337T3 (hu)
EA (1) EA000388B1 (hu)
ES (1) ES2183979T3 (hu)
HU (1) HUP9902023A3 (hu)
IL (1) IL123773A (hu)
MX (1) MX9802673A (hu)
NO (1) NO981507L (hu)
PT (1) PT870337E (hu)
TR (1) TR199800606T1 (hu)
UA (1) UA51672C2 (hu)
WO (1) WO1997013283A1 (hu)

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US6103967A (en) * 1998-06-29 2000-08-15 Tellurex Corporation Thermoelectric module and method of manufacturing the same
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US6555413B1 (en) * 2001-02-23 2003-04-29 Triquint Technology Holding Co. Method for interconnecting semiconductor elements to form a thermoelectric cooler and a thermoelectric cooler formed therefrom
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US6756536B2 (en) * 2002-03-28 2004-06-29 Bae Systems Information And Electronic Systems Integration Inc. Thermoelectric microactuator
US6679064B2 (en) * 2002-05-13 2004-01-20 Taiwan Semiconductor Manufacturing Co., Ltd Wafer transfer system with temperature control apparatus
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JP4401754B2 (ja) * 2003-11-28 2010-01-20 清仁 石田 熱電変換モジュールの製造方法
WO2005074049A2 (en) * 2004-01-16 2005-08-11 Massachusetts Institute Of Technology Potential amplified nonequilibrium thermal electric device (pantec)
CN100353534C (zh) * 2004-06-16 2007-12-05 华孚科技股份有限公司 热电式散热器的制造方法及所制造的热电式散热器
CN100346490C (zh) * 2004-06-21 2007-10-31 浙江大学 一种薄片型热电转换装置的制备方法
DE102004048220A1 (de) * 2004-09-30 2006-04-06 Basf Ag Kontaktierung thermoelektrischer Materialien durch Ultraschallschweißen
US7527101B2 (en) * 2005-01-27 2009-05-05 Schlumberger Technology Corporation Cooling apparatus and method
US8039726B2 (en) * 2005-05-26 2011-10-18 General Electric Company Thermal transfer and power generation devices and methods of making the same
US20070101737A1 (en) * 2005-11-09 2007-05-10 Masao Akei Refrigeration system including thermoelectric heat recovery and actuation
US7310953B2 (en) 2005-11-09 2007-12-25 Emerson Climate Technologies, Inc. Refrigeration system including thermoelectric module
US20070277866A1 (en) * 2006-05-31 2007-12-06 General Electric Company Thermoelectric nanotube arrays
CN101409324B (zh) * 2008-07-24 2013-10-16 中国科学院上海硅酸盐研究所 一种碲化铋基热电发电器件的制造方法
US20100024436A1 (en) * 2008-08-01 2010-02-04 Baker Hughes Incorporated Downhole tool with thin film thermoelectric cooling
WO2010125411A1 (en) * 2009-04-27 2010-11-04 Szenergia Kft. Procedure for producing a device containing metal and intermetallic semiconductor parts joined together with an electrically conductive and heat conducting connection, especially a rod suitable for use with thermoelectric modules
DE102010035151A1 (de) * 2010-08-23 2012-02-23 Emitec Gesellschaft Für Emissionstechnologie Mbh Halbleiterelement für ein thermoelektrisches Modul und Verfahren zu dessen Herstellung
JP5831554B2 (ja) * 2011-11-08 2015-12-09 富士通株式会社 熱電変換素子及びその製造方法
US8889454B2 (en) * 2011-11-08 2014-11-18 Ut-Battelle, Llc Manufacture of thermoelectric generator structures by fiber drawing
US20130139866A1 (en) * 2011-12-01 2013-06-06 Marlow Industries, Inc. Ceramic Plate
US8641917B2 (en) * 2011-12-01 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Ternary thermoelectric material containing nanoparticles and process for producing the same
MD542Z (ro) * 2012-01-13 2013-03-31 ИНСТИТУТ ЭЛЕКТРОННОЙ ИНЖЕНЕРИИ И НАНОТЕХНОЛОГИЙ "D. Ghitu" АНМ Material termoelectric anizotropic pe bază de bismut
JP6038187B2 (ja) * 2013-01-28 2016-12-07 ニホンハンダ株式会社 ダイボンド接合用はんだ合金
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US20180090660A1 (en) 2013-12-06 2018-03-29 Sridhar Kasichainula Flexible thin-film based thermoelectric device with sputter deposited layer of n-type and p-type thermoelectric legs
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US10367131B2 (en) 2013-12-06 2019-07-30 Sridhar Kasichainula Extended area of sputter deposited n-type and p-type thermoelectric legs in a flexible thin-film based thermoelectric device
US10566515B2 (en) 2013-12-06 2020-02-18 Sridhar Kasichainula Extended area of sputter deposited N-type and P-type thermoelectric legs in a flexible thin-film based thermoelectric device
US11024789B2 (en) 2013-12-06 2021-06-01 Sridhar Kasichainula Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of N-type and P-type thermoelectric legs
CA2868197C (en) 2014-01-31 2020-03-10 Berken Energy Llc Methods for thick film thermoelectric device fabrication
US20150240793A1 (en) * 2014-02-21 2015-08-27 The Boeing Company Temperature control system for shape-memory alloy
TWI575786B (zh) * 2014-04-08 2017-03-21 財團法人紡織產業綜合研究所 一種熱電轉換元件
KR20160028697A (ko) 2014-09-04 2016-03-14 한국전기연구원 벌크형 소면적 열전모듈 및 그 제조방법
US11283000B2 (en) 2015-05-14 2022-03-22 Nimbus Materials Inc. Method of producing a flexible thermoelectric device to harvest energy for wearable applications
US11276810B2 (en) 2015-05-14 2022-03-15 Nimbus Materials Inc. Method of producing a flexible thermoelectric device to harvest energy for wearable applications
US9995288B2 (en) 2016-01-28 2018-06-12 The Boeing Company Solid-state motor and associated systems and methods
WO2017216797A1 (en) * 2016-06-14 2017-12-21 Ariel Scientific Innovations Ltd. Thermoelectric generator
US10288048B2 (en) 2016-12-16 2019-05-14 The Boeing Company Deforming shape memory alloy using self-regulating thermal elements
CN109873096A (zh) * 2017-12-01 2019-06-11 中国电力科学研究院有限公司 一种温度可调控的车载动力电池组
CN108281541A (zh) * 2018-02-08 2018-07-13 南方科技大学 可预成型的热电器件及制备方法

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Also Published As

Publication number Publication date
EP0870337A1 (en) 1998-10-14
JP3862179B2 (ja) 2006-12-27
AU7394796A (en) 1997-04-28
UA51672C2 (uk) 2002-12-16
CN1211342A (zh) 1999-03-17
EP0870337A4 (en) 1999-02-17
ATE228270T1 (de) 2002-12-15
PT870337E (pt) 2003-03-31
MX9802673A (es) 1998-11-30
DE69624936D1 (de) 2003-01-02
EP0870337B1 (en) 2002-11-20
CN1326256C (zh) 2007-07-11
JP2002507321A (ja) 2002-03-05
IL123773A (en) 2001-03-19
CA2233979C (en) 2005-09-27
WO1997013283A1 (en) 1997-04-10
DE69624936T2 (de) 2003-03-27
NO981507D0 (no) 1998-04-02
US5817188A (en) 1998-10-06
DK0870337T3 (da) 2003-03-03
IL123773A0 (en) 1999-11-30
EA199800303A1 (ru) 1998-10-29
NO981507L (no) 1998-04-02
ES2183979T3 (es) 2003-04-01
CZ102898A3 (cs) 1998-08-12
AU702453B2 (en) 1999-02-18
CA2233979A1 (en) 1997-04-10
EA000388B1 (ru) 1999-06-24
TR199800606T1 (xx) 1998-06-22
BR9610829A (pt) 1999-12-21
KR19990066931A (ko) 1999-08-16
HUP9902023A2 (hu) 1999-11-29

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