BR9610829A - Módulo termoelétrico,método para fabricar módulos termoelétricos,método para gerar eletricidade,método para gerar um gradiente térmico,método para efetuar refrigeração e método para efetuar aquecimento ter - moelétrico,módulo termoelétrico,método para fabricar módulos termoelétricos,método para gerar eletrici - dade,método para gerar um gradiente térmico, método, para efetuar refrigeração e método para efetuar a - quecimento termoelétrico. - Google Patents

Módulo termoelétrico,método para fabricar módulos termoelétricos,método para gerar eletricidade,método para gerar um gradiente térmico,método para efetuar refrigeração e método para efetuar aquecimento ter - moelétrico,módulo termoelétrico,método para fabricar módulos termoelétricos,método para gerar eletrici - dade,método para gerar um gradiente térmico, método, para efetuar refrigeração e método para efetuar a - quecimento termoelétrico.

Info

Publication number
BR9610829A
BR9610829A BR9610829-0A BR9610829A BR9610829A BR 9610829 A BR9610829 A BR 9610829A BR 9610829 A BR9610829 A BR 9610829A BR 9610829 A BR9610829 A BR 9610829A
Authority
BR
Brazil
Prior art keywords
thermoelectric
perform
generate
thermal gradient
modules
Prior art date
Application number
BR9610829-0A
Other languages
English (en)
Portuguese (pt)
Inventor
Michael Yahatz
James Harper
Original Assignee
Melcor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melcor Corp filed Critical Melcor Corp
Publication of BR9610829A publication Critical patent/BR9610829A/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Connection of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered

Landscapes

  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Ceramic Products (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
BR9610829-0A 1995-10-03 1996-09-30 Módulo termoelétrico,método para fabricar módulos termoelétricos,método para gerar eletricidade,método para gerar um gradiente térmico,método para efetuar refrigeração e método para efetuar aquecimento ter - moelétrico,módulo termoelétrico,método para fabricar módulos termoelétricos,método para gerar eletrici - dade,método para gerar um gradiente térmico, método, para efetuar refrigeração e método para efetuar a - quecimento termoelétrico. BR9610829A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53844995A 1995-10-03 1995-10-03
PCT/US1996/016077 WO1997013283A1 (en) 1995-10-03 1996-09-30 Fabrication of thermoelectric modules and solder for such fabrication

Publications (1)

Publication Number Publication Date
BR9610829A true BR9610829A (pt) 1999-12-21

Family

ID=24146982

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9610829-0A BR9610829A (pt) 1995-10-03 1996-09-30 Módulo termoelétrico,método para fabricar módulos termoelétricos,método para gerar eletricidade,método para gerar um gradiente térmico,método para efetuar refrigeração e método para efetuar aquecimento ter - moelétrico,módulo termoelétrico,método para fabricar módulos termoelétricos,método para gerar eletrici - dade,método para gerar um gradiente térmico, método, para efetuar refrigeração e método para efetuar a - quecimento termoelétrico.

Country Status (22)

Country Link
US (1) US5817188A (ja)
EP (1) EP0870337B1 (ja)
JP (1) JP3862179B2 (ja)
KR (1) KR19990066931A (ja)
CN (1) CN1326256C (ja)
AT (1) ATE228270T1 (ja)
AU (1) AU702453B2 (ja)
BR (1) BR9610829A (ja)
CA (1) CA2233979C (ja)
CZ (1) CZ102898A3 (ja)
DE (1) DE69624936T2 (ja)
DK (1) DK0870337T3 (ja)
EA (1) EA000388B1 (ja)
ES (1) ES2183979T3 (ja)
HU (1) HUP9902023A3 (ja)
IL (1) IL123773A (ja)
MX (1) MX9802673A (ja)
NO (1) NO981507D0 (ja)
PT (1) PT870337E (ja)
TR (1) TR199800606T1 (ja)
UA (1) UA51672C2 (ja)
WO (1) WO1997013283A1 (ja)

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US10566515B2 (en) 2013-12-06 2020-02-18 Sridhar Kasichainula Extended area of sputter deposited N-type and P-type thermoelectric legs in a flexible thin-film based thermoelectric device
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Also Published As

Publication number Publication date
NO981507L (no) 1998-04-02
HUP9902023A2 (hu) 1999-11-29
EA199800303A1 (ru) 1998-10-29
TR199800606T1 (xx) 1998-06-22
MX9802673A (es) 1998-11-30
ES2183979T3 (es) 2003-04-01
KR19990066931A (ko) 1999-08-16
CN1326256C (zh) 2007-07-11
CZ102898A3 (cs) 1998-08-12
AU702453B2 (en) 1999-02-18
PT870337E (pt) 2003-03-31
ATE228270T1 (de) 2002-12-15
JP3862179B2 (ja) 2006-12-27
WO1997013283A1 (en) 1997-04-10
DE69624936T2 (de) 2003-03-27
DK0870337T3 (da) 2003-03-03
JP2002507321A (ja) 2002-03-05
UA51672C2 (uk) 2002-12-16
HUP9902023A3 (en) 2002-11-28
IL123773A (en) 2001-03-19
EA000388B1 (ru) 1999-06-24
IL123773A0 (en) 1999-11-30
US5817188A (en) 1998-10-06
CA2233979C (en) 2005-09-27
EP0870337A4 (en) 1999-02-17
AU7394796A (en) 1997-04-28
EP0870337B1 (en) 2002-11-20
EP0870337A1 (en) 1998-10-14
DE69624936D1 (de) 2003-01-02
CN1211342A (zh) 1999-03-17
CA2233979A1 (en) 1997-04-10
NO981507D0 (no) 1998-04-02

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B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]