GB9325978D0 - Electrical interconnection substrate with both wire bond and solder contacts,and fabrication method - Google Patents
Electrical interconnection substrate with both wire bond and solder contacts,and fabrication methodInfo
- Publication number
- GB9325978D0 GB9325978D0 GB939325978A GB9325978A GB9325978D0 GB 9325978 D0 GB9325978 D0 GB 9325978D0 GB 939325978 A GB939325978 A GB 939325978A GB 9325978 A GB9325978 A GB 9325978A GB 9325978 D0 GB9325978 D0 GB 9325978D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- fabrication method
- wire bond
- electrical interconnection
- interconnection substrate
- solder contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
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- H—ELECTRICITY
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- H05K3/3468—Applying molten solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/906,637 US5311404A (en) | 1992-06-30 | 1992-06-30 | Electrical interconnection substrate with both wire bond and solder contacts |
GB9312878A GB2268108B (en) | 1992-06-30 | 1993-06-22 | Methods of preparing electrical interconnection substrates with both wire bond and solder contacts |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9325978D0 true GB9325978D0 (en) | 1994-02-23 |
GB2273257A GB2273257A (en) | 1994-06-15 |
GB2273257B GB2273257B (en) | 1996-03-27 |
Family
ID=26303110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9325978A Expired - Fee Related GB2273257B (en) | 1992-06-30 | 1993-06-22 | Electrical interconnection substrate with both wire bond and solder contacts |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2273257B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6403457B2 (en) * | 1999-08-25 | 2002-06-11 | Micron Technology, Inc. | Selectively coating bond pads |
DE10018025A1 (en) | 2000-04-04 | 2001-10-18 | Atotech Deutschland Gmbh | Production of solderable surface on circuit carriers in circuit board manufacture comprises preparing a dielectric substrate having copper structures, producing solderable surfaces, and forming functional surfaces in functional regions |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5933894A (en) * | 1982-08-19 | 1984-02-23 | 電気化学工業株式会社 | Method of producing hybrid integrated circuit board |
-
1993
- 1993-06-22 GB GB9325978A patent/GB2273257B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2273257A (en) | 1994-06-15 |
GB2273257B (en) | 1996-03-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20020622 |