EP0180808A3 - Electrical interconnection and method for its fabrication - Google Patents

Electrical interconnection and method for its fabrication Download PDF

Info

Publication number
EP0180808A3
EP0180808A3 EP85112906A EP85112906A EP0180808A3 EP 0180808 A3 EP0180808 A3 EP 0180808A3 EP 85112906 A EP85112906 A EP 85112906A EP 85112906 A EP85112906 A EP 85112906A EP 0180808 A3 EP0180808 A3 EP 0180808A3
Authority
EP
European Patent Office
Prior art keywords
fabrication
electrical interconnection
interconnection
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP85112906A
Other versions
EP0180808B1 (en
EP0180808A2 (en
Inventor
Robert Benjamin Laibowitz
Corwin Paul Umbach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of EP0180808A2 publication Critical patent/EP0180808A2/en
Publication of EP0180808A3 publication Critical patent/EP0180808A3/en
Application granted granted Critical
Publication of EP0180808B1 publication Critical patent/EP0180808B1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0912—Manufacture or treatment of Josephson-effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/10—Junction-based devices
    • H10N60/12—Josephson-effect devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
EP85112906A 1984-11-05 1985-10-11 Electrical interconnection and method for its fabrication Expired EP0180808B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/668,537 US4751563A (en) 1984-11-05 1984-11-05 Microminiaturized electrical interconnection device and its method of fabrication
US668537 1991-03-13

Publications (3)

Publication Number Publication Date
EP0180808A2 EP0180808A2 (en) 1986-05-14
EP0180808A3 true EP0180808A3 (en) 1987-05-13
EP0180808B1 EP0180808B1 (en) 1990-07-11

Family

ID=24682719

Family Applications (1)

Application Number Title Priority Date Filing Date
EP85112906A Expired EP0180808B1 (en) 1984-11-05 1985-10-11 Electrical interconnection and method for its fabrication

Country Status (4)

Country Link
US (1) US4751563A (en)
EP (1) EP0180808B1 (en)
JP (1) JPS61114585A (en)
DE (1) DE3578634D1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4740700A (en) * 1986-09-02 1988-04-26 Hughes Aircraft Company Thermally insulative and electrically conductive interconnect and process for making same
US4926237A (en) * 1988-04-04 1990-05-15 Motorola, Inc. Device metallization, device and method
US5185073A (en) * 1988-06-21 1993-02-09 International Business Machines Corporation Method of fabricating nendritic materials
US5137461A (en) * 1988-06-21 1992-08-11 International Business Machines Corporation Separable electrical connection technology
US4966885A (en) * 1989-08-25 1990-10-30 At&T Bell Laboratories Method of producing a device comprising a metal oxide superconductor layer
US5118299A (en) * 1990-05-07 1992-06-02 International Business Machines Corporation Cone electrical contact
EP0478466B1 (en) * 1990-09-27 1995-11-08 Sumitomo Electric Industries, Ltd. A superconducting device and a method for manufacturing the same
EP0478464B1 (en) * 1990-09-27 1997-08-27 Sumitomo Electric Industries, Ltd. Method for manufacturing a superconducting device having an extremely thin superconducting channel formed of oxide superconductor material
DE69119022T2 (en) * 1990-10-08 1996-10-31 Sumitomo Electric Industries Superconducting device with ultrathin channel made of oxidic superconducting material and method for its production
US5105537A (en) * 1990-10-12 1992-04-21 International Business Machines Corporation Method for making a detachable electrical contact
FI950805A (en) * 1994-02-24 1995-08-25 Shimadzu Corp Superconducting tunnel joint and method of making it
US5863868A (en) * 1996-04-08 1999-01-26 Trw Inc. Superconductive quantum interference device for digital logic circuits
US6184062B1 (en) 1999-01-19 2001-02-06 International Business Machines Corporation Process for forming cone shaped solder for chip interconnection
US6198113B1 (en) 1999-04-22 2001-03-06 Acorn Technologies, Inc. Electrostatically operated tunneling transistor
US6347901B1 (en) 1999-11-01 2002-02-19 International Business Machines Corporation Solder interconnect techniques
US7615402B1 (en) 2000-07-07 2009-11-10 Acorn Technologies, Inc. Electrostatically operated tunneling transistor
KR100413828B1 (en) * 2001-12-13 2004-01-03 삼성전자주식회사 Semiconductor device and method of making the same
US7615385B2 (en) 2006-09-20 2009-11-10 Hypres, Inc Double-masking technique for increasing fabrication yield in superconducting electronics
US9692147B1 (en) * 2015-12-22 2017-06-27 Intel Corporation Small form factor sockets and connectors
JP6569959B2 (en) * 2017-08-30 2019-09-04 国立研究開発法人理化学研究所 High temperature superconducting wire connector

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3846166A (en) * 1971-09-25 1974-11-05 Hitachi Ltd Method of producing multilayer wiring structure of integrated circuit
US4430790A (en) * 1980-05-20 1984-02-14 Rikagaku Kenkyusho Method of making a Josephson junction

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3689780A (en) * 1969-08-14 1972-09-05 Hans Walter Meissner Control of flow across a weak link in superconductive and superfluid devices
US4197332A (en) * 1977-10-26 1980-04-08 International Business Machines Corporation Sub 100A range line width pattern fabrication
US4224630A (en) * 1978-08-25 1980-09-23 Sperry Corporation Multiple weak-link SQUID
JPS6029234B2 (en) * 1982-02-18 1985-07-09 理化学研究所 Microbridge type Josephson device, its manufacturing method, and its manufacturing device
US4415606A (en) * 1983-01-10 1983-11-15 Ncr Corporation Method of reworking upper metal in multilayer metal integrated circuits

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3846166A (en) * 1971-09-25 1974-11-05 Hitachi Ltd Method of producing multilayer wiring structure of integrated circuit
US4430790A (en) * 1980-05-20 1984-02-14 Rikagaku Kenkyusho Method of making a Josephson junction

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 14, no. 9, February 1972, page 2684, New York, US; S. BASAVAIAH: "Metal barrier Josephson junctions suitable for memory arrays" *
PATENTS ABSTRACTS OF JAPAN, vol. 7, no. 255 (E-210)[1400], 12th November 1983; & JP-A-58 141 583 (RIKAGAKU KENKYUSHO) 22-08-1983 *

Also Published As

Publication number Publication date
DE3578634D1 (en) 1990-08-16
JPS61114585A (en) 1986-06-02
JPH036675B2 (en) 1991-01-30
US4751563A (en) 1988-06-14
EP0180808B1 (en) 1990-07-11
EP0180808A2 (en) 1986-05-14

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