NO852512L - Fremgangsmaate og anordning for fremstilling av flerlagslederplater. - Google Patents
Fremgangsmaate og anordning for fremstilling av flerlagslederplater.Info
- Publication number
- NO852512L NO852512L NO852512A NO852512A NO852512L NO 852512 L NO852512 L NO 852512L NO 852512 A NO852512 A NO 852512A NO 852512 A NO852512 A NO 852512A NO 852512 L NO852512 L NO 852512L
- Authority
- NO
- Norway
- Prior art keywords
- laminates
- relation
- connecting elements
- rivets
- press
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 71
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000004020 conductor Substances 0.000 claims description 36
- 238000010276 construction Methods 0.000 claims description 17
- 238000003475 lamination Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 description 16
- 239000000047 product Substances 0.000 description 8
- 239000011888 foil Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 238000012432 intermediate storage Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 238000009417 prefabrication Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/469—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers
- H01L21/47—Organic layers, e.g. photoresist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Details Of Indoor Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843423181 DE3423181A1 (de) | 1984-06-22 | 1984-06-22 | Verfahren zur herstellung von vorlaminaten fuer mehrlagenleiterplatten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO852512L true NO852512L (no) | 1985-12-23 |
Family
ID=6238964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO852512A NO852512L (no) | 1984-06-22 | 1985-06-21 | Fremgangsmaate og anordning for fremstilling av flerlagslederplater. |
Country Status (18)
| Country | Link |
|---|---|
| EP (1) | EP0167867A3 (fr) |
| JP (1) | JPS6169197A (fr) |
| KR (1) | KR860000711A (fr) |
| AU (1) | AU4395185A (fr) |
| BR (1) | BR8502956A (fr) |
| CA (1) | CA1224884A (fr) |
| DD (1) | DD234643A5 (fr) |
| DE (1) | DE3423181A1 (fr) |
| DK (1) | DK278185A (fr) |
| ES (1) | ES8701453A1 (fr) |
| FI (1) | FI852464L (fr) |
| GR (1) | GR851516B (fr) |
| HU (1) | HUT39311A (fr) |
| IL (1) | IL75551A0 (fr) |
| NO (1) | NO852512L (fr) |
| PL (1) | PL254118A1 (fr) |
| PT (1) | PT80686B (fr) |
| ZA (1) | ZA854662B (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1261481A (fr) * | 1986-03-13 | 1989-09-26 | Kazumasa Eguchi | Carte a circuit imprime pouvant faire echec aux parasites electomagnetiques |
| JPS62295488A (ja) * | 1986-06-14 | 1987-12-22 | 松下電工株式会社 | 多層プリント配線板の製法 |
| DE3819785A1 (de) * | 1988-06-10 | 1989-12-14 | Ferrozell Sachs & Co Gmbh | Verfahren zum herstellen von mehrlagigen, gedruckten leiterplatten |
| CH678412A5 (fr) * | 1988-11-11 | 1991-09-13 | Fela Planungs Ag | |
| SE465399B (sv) * | 1990-05-16 | 1991-09-02 | Perstorp Ab | Saett vid tillverkning av flerlagermoensterkort |
| US5832596A (en) * | 1996-12-31 | 1998-11-10 | Stmicroelectronics, Inc. | Method of making multiple-bond shelf plastic package |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57196598A (en) * | 1981-05-29 | 1982-12-02 | Hitachi Ltd | Method of producing multilayer printed board |
-
1984
- 1984-06-22 DE DE19843423181 patent/DE3423181A1/de not_active Withdrawn
-
1985
- 1985-06-12 EP EP85107263A patent/EP0167867A3/fr not_active Withdrawn
- 1985-06-18 IL IL75551A patent/IL75551A0/xx unknown
- 1985-06-19 DK DK278185A patent/DK278185A/da not_active Application Discontinuation
- 1985-06-20 ZA ZA854662A patent/ZA854662B/xx unknown
- 1985-06-20 BR BR8502956A patent/BR8502956A/pt unknown
- 1985-06-20 DD DD85277577A patent/DD234643A5/de unknown
- 1985-06-20 GR GR851516A patent/GR851516B/el unknown
- 1985-06-20 FI FI852464A patent/FI852464L/fi not_active Application Discontinuation
- 1985-06-20 KR KR1019850004389A patent/KR860000711A/ko not_active Application Discontinuation
- 1985-06-21 CA CA000484824A patent/CA1224884A/fr not_active Expired
- 1985-06-21 PT PT80686A patent/PT80686B/pt not_active IP Right Cessation
- 1985-06-21 JP JP60134463A patent/JPS6169197A/ja active Pending
- 1985-06-21 AU AU43951/85A patent/AU4395185A/en not_active Abandoned
- 1985-06-21 NO NO852512A patent/NO852512L/no unknown
- 1985-06-21 HU HU852453A patent/HUT39311A/hu unknown
- 1985-06-21 PL PL25411885A patent/PL254118A1/xx unknown
- 1985-06-21 ES ES544405A patent/ES8701453A1/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| EP0167867A2 (fr) | 1986-01-15 |
| DE3423181A1 (de) | 1986-01-02 |
| HUT39311A (en) | 1986-08-28 |
| DK278185D0 (da) | 1985-06-19 |
| CA1224884A (fr) | 1987-07-28 |
| DK278185A (da) | 1985-12-23 |
| BR8502956A (pt) | 1986-03-04 |
| PL254118A1 (en) | 1986-05-06 |
| PT80686B (de) | 1987-02-12 |
| ES544405A0 (es) | 1986-11-16 |
| GR851516B (fr) | 1985-11-25 |
| IL75551A0 (en) | 1985-10-31 |
| ZA854662B (en) | 1986-04-30 |
| FI852464A0 (fi) | 1985-06-20 |
| AU4395185A (en) | 1986-01-02 |
| KR860000711A (ko) | 1986-01-30 |
| PT80686A (de) | 1985-07-01 |
| EP0167867A3 (fr) | 1987-01-28 |
| FI852464L (fi) | 1985-12-23 |
| JPS6169197A (ja) | 1986-04-09 |
| ES8701453A1 (es) | 1986-11-16 |
| DD234643A5 (de) | 1986-04-09 |
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