WO1996010486A1 - Procede de pressage et presse utilisee a cet effet - Google Patents

Procede de pressage et presse utilisee a cet effet Download PDF

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Publication number
WO1996010486A1
WO1996010486A1 PCT/SE1995/001114 SE9501114W WO9610486A1 WO 1996010486 A1 WO1996010486 A1 WO 1996010486A1 SE 9501114 W SE9501114 W SE 9501114W WO 9610486 A1 WO9610486 A1 WO 9610486A1
Authority
WO
WIPO (PCT)
Prior art keywords
press
pressure
pressure chamber
copper foil
water
Prior art date
Application number
PCT/SE1995/001114
Other languages
English (en)
Inventor
Bernt Ekström
Original Assignee
Metfoils Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metfoils Ab filed Critical Metfoils Ab
Priority to AU36907/95A priority Critical patent/AU3690795A/en
Publication of WO1996010486A1 publication Critical patent/WO1996010486A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • B30B15/064—Press plates with heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Definitions

  • the present invention relates to a process preferably for the production of multilayer printed circuit boards or copper laminates for printed circuits by pressing under heat and pressure in a press, the press room of which is enclosed in a pressure chamber or the like or forms a pressure chamber and the pressing takes place at an under ⁇ pressure in the pressure chamber.
  • the invention relates to a press preferably for the production of multilayer printed circuit boards or copper laminates, which press includes a press room with two press tables, preferably operated in a hydraulic or pneumatic way so that a pressure between the tables of
  • 2 2-25 kp/cm can be brought about, whereby at least the press room is enclosed in a pressure chamber or the like or forms a pressure chamber, which can be put at under ⁇ pressure by means of a vacuum pump.
  • a press of this kind where the heating is brought about by connecting a direct current to a continuous sheet of copper foil is already used commercially.
  • the copper foil will constitute a surface layer for instance of a copper foil laminate.
  • the above rather new kind of press has however a serious disadvantage. Thus, it is not provided with any cooling system for the pressed products. Therefore, they must stay in the press until they have cooled down sufficiently to be handled.
  • the products are only allowed to be cooled down so far that the resin has been solidified. Then the products are taken out of the press and allowed to cool down on a pallet or the like. Alternatively they are introduced into a conventional press where they are cooled down to a temperature of 25-50°C.
  • the present invention it has wholly unexpec ⁇ tedly been possible to solve the above problem and bring about a process preferably for the production of multi ⁇ layer printed circuit boards or copper laminates for printed circuits by pressing under heat and pressure in a press, the press room of which is enclosed in a pressure chamber or the like or forms a pressure chamber and the pressing takes place at an under-pressure in the pressure chamber.
  • the process comprises cooling down the product produced preferably at a maintained pressure of the press and at a maintained under-pressure in the pressure chamber by injecting water into the pressure chamber, preferably against the sides of the pressed product, the product thereby being cooled down by means of the water which is evaporated and then removed from the pressure chamber with a vacuum pump or the like, whereby the final tem ⁇ perature is adjusted to the pressure so that water in liquid state will not remain in the pressure chamber.
  • the copper surfaces of the pressed products are not deteriorated by the cooling method of the invention, which of course is a demand for its usefulness.
  • the cooling is carried out while the press pressure is maintained. Therefore, possible warping problems can be avoided.
  • the press pressure can be maintained at the first part of the cooling only.
  • the side edges of the pressed products are then cooled.
  • a larger surface of the pressed products can be reached for cooling.
  • the cooling time can be shortened even more.
  • the steam formed at the cooling is suitably removed by means of a ring pump with water as a sealing agent.
  • Pre ⁇ ferably the same pump is used for bringing about the under ⁇ pressure in the pressure chamber.
  • two or more pumps can be used as well.
  • the pressure in the pressure chamber at the pressing as well as at the cooling is kept within the interval 30-150 millibar, preferably 50-125 millibar. In certain cases it can be preferable that the pressure within these intervals is a bit lower at the cooling than at the pressing.
  • the pressed product is often cooled to a temperature of 20-60°C, preferable 25-50 C, while the pressure in the pressure chamber is kept within the interval 50-125 millibar.
  • the cooling temperature and the under-pressure in the pressure chamber are adapted to each other so that water in liquid state will not remain in the pressure chamber and/or on the pressed products.
  • the press pressure is normally regulated to 2-25 kp/cm 2, preferably 4-10 kp/cm2.
  • the temperature used at the pressing is adapted to the plastic material in the pressed products.
  • Multilayer printed circuit boards and copper laminates contain a thermosetting resin such as polyimide resin or epoxy resin. Normally the temperature at the pressing of thermo ⁇ setting resins is within the interval 130-260 C, preferably 150-240°C.
  • the copper laminate is built up of so-called prepreg sheets, preferably of glass fibre cloth impregnated with thermosetting resin such as polyimide resin or epoxy resin which has been cured to so-called B-stage and a continuous sheet of copper foil.
  • the copper foil is first put on an electri ⁇ cally uninsulated press plate. An electrically insulated press plate is put on top of the copper foil which is then folded over the plate.
  • a number of prepreg sheets are placed on top of the copper foil.
  • the copper foil is folded over the uppermost prepreg sheet.
  • a second elec ⁇ trically insulated press plate is put on top of the copper foil and the copper foil is folded over the second press plate whereupon more prepreg sheets are put on the copper foil and so on until a desired number of so-called press packages has been obtained with an electrically un ⁇ insulated press plate on top.
  • the stack obtained is placed between press tables in the press.
  • the press packages are heated up to a temperature of 130-260 C by connecting a direct current of 10-30 V and 600-5000 A, preferably 10-20 V and 600-2000 A to the copper foil.
  • the pressure in the pressure chamber is regulated to 30-150 millibar
  • the copper laminates in the press are then cooled down to a temperature of 20-60 C by injecting water into the pressure chamber where the water is totally evaporated by adjustment of the under-pressure in the pressure chamber to the final temperature of the cooled laminates, whereupon these are removed from the press.
  • the press pressure is kept during the cooling.
  • the printed circuit board is built up of one or more so-called inner layers, each consisting of an insulating base of thin laminate of reinforcing material, preferably glass fibre cloth impregnated with thermosetting resin, with a layer of metal or metal alloy, preferably on both sides in which layers a wire pattern has been formed, so-called prepreg sheets, preferably of glass fibre cloth impregnated with a thermosetting resin such as polyimide or epoxy resin which has been cured to so-called B-stage and a continuous sheet of copper foil.
  • the copper foil is first put on an electrically uninsulated press plate.
  • An electrically insulated press plate is put on top of the copper foil which is then folded over the plate. At least one prepreg sheet is placed on top of the copper foil. One inner layer is placed on top of the prepreg sheet and at least one prepreg sheet is placed on top of this first inner layer. More inner layers are possibly placed on top of the first inner layer with at least one prepreg sheet between these and on top of the uppermost innerlayer.
  • the copper foil is then folded over the uppermost prepreg sheet whereupon a second insulated press plate is put over the copper foil.
  • the copper foil is folded over the second press plate and at least one prepreg sheet is placed on top of the copper foil and so on until a desired number of so-called press packages has been obtained with an electrically uninsulated press plate uppermost.
  • the stack obtained is then placed between press tables in the press.
  • the press packages are heated up to a temperature of 130-260 C by connecting a direct current of 10-30 V and 600-5000 A, preferably 10-20 V and 600-2000 A to the copper foil.
  • the pressure in the pressure chamber is regulated to 30-150 millibar and the press pressure to 2-25 kp/cm.
  • the pressing is continued until the thermosetting resin has been cured.
  • the multi ⁇ layer printed circuit boards produced in the press are cooled down to a temperature of 20-60 C by injecting water into the pressure chamber where the water is totally evaporated by adjustment of the under-pressure in the pressure chamber to the final temperature of the cooled multilayer printed circuit boards whereupon these are re ⁇ moved from the press.
  • the press pressure is kept during the cooling.
  • the invention also relates to a press preferably for the production of multilayer printed circuit boards or copper laminates.
  • the press includes a press room with two press tables, preferably operated in a hydraulic or pneumatic way so that a pressure between
  • the tables of 2-25 kp/cm can be brought about, whereby at least the press room is enclosed in a pressure chamber or the like or forms a pressure chamber, which can be put at under-pressure by means of a vacuum pump.
  • the pressure chamber is provided with one or more injection pipes, injection nozzles or the like passing tightly through the wall of the pressure chamber for injecting cooling water into the pressure chamber at a maintained under-pressure in the pressure chamber. The water is totally transformed to water steam at cooling of the pressed products in the press, which steam is then removed by means of the vacuum pump.
  • the vacuum pump consists of a ring pump having water as a sealing agent.
  • the invention is further explained in connection with the embodiment example below and the enclosed figures.
  • the example illustrates the production of copper laminates by a preferred process according to the invention.
  • Fig. 1 schematically shows how copper laminates according to the embodiment examples can be built up.
  • Fig. 2 shows schematically in cross-section a pressing of such laminates.
  • a continuous sheet of copper foil having a thickness of 18 / um was placed on top of an electrically uninsulated press plate.
  • An electrically insulated press plate of anodized aluminium with a thickness of about 1 mm was placed on top of the continuous sheet of copper foil which foil was then folded over the press plate.
  • Eight so-called prepreg sheets of glass fibre cloth impregnated with polyi ide resin which had been partially cured to so-called B-stage were placed on top of the copper foil which was then folded over the uppermost prepreg sheet.
  • a second electrically insulated press plate was placed on top of the copper foil which was then folded over the plate.
  • a so-called press package was formed between the insulated press plates.
  • a direct current of 12 V and 800 A was connected to the above-mentioned continuous sheet of copper foil, which then worked as a resistor and was heated to 220°C.
  • the pressure between the press tables was 7 kp/cm .
  • Fig. 1 it is shown that a continuous sheet of copper foil 1 is placed on top of an electrically uninsulated press plate 2. On top of the copper foil a first electrically insulated press plate 3 is placed. The copper foil is folded over the plate 3.
  • a number of so-called prepreg sheets 4 of glass fibre cloth impregnated with polyimide plastic which had been partially cured to so-called B-stage were placed on top of the copper foil.
  • the copper foil is folded over the uppermost prepreg sheet.
  • a second insulated press plate 5 is placed on top of the copper foil.
  • the copper foil is folded over the press plate 5.
  • a number of prepreg sheets 4 of the above-mentioned type were put on top of the copper foil.
  • the copper foil is folded over the uppermost prepreg sheet.
  • a third insulated press plate 6 is placed on top of the copper foil which is then folded over the press plate 6.
  • An electrically uninsulated press plate 7 is put on top of the copper foil.
  • the whole stack is placed between press tables 8 of a press placed in a pressure chamber 9. Through the wall of the pressure chamber two injection nozzles 10 for water are passing.
  • a vacuum pump 11 is connected to the pressure chamber and is used for bringing about an under-pressure therein.
  • the above stack is pressed to copper laminates by applying pressure on the press tables 8 as indicated by arrows.
  • the stack is heated by connecting a direct current to the continuous sheet of copper foil which is shown by a + and a - at the ends of the continuous sheet of copper foil.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Press Drives And Press Lines (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention concerne un procédé de pressage à chaud et sous pression dans une presse, l'espace de pressage étant enfermé dans une chambre de compression ou similaire et le pressage s'effectuant dans un environnement de sous-compression dans la chambre de compression. Le produit ainsi obtenu est refroidi dans un environnement de sous-compression dans la chambre de compression, par injection d'eau dans ladite chambre. L'invention porte également sur une presse pour la production, par exemple, de cartes à circuit imprimé multicouche et de stratifiés en cuivre.
PCT/SE1995/001114 1994-10-03 1995-10-02 Procede de pressage et presse utilisee a cet effet WO1996010486A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU36907/95A AU3690795A (en) 1994-10-03 1995-10-02 Pressing process and a press used at the process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9403323A SE502457C2 (sv) 1994-10-03 1994-10-03 Pressningsförfarande samt press avsedd för användning vid förfarandet
SE9403323-0 1994-10-03

Publications (1)

Publication Number Publication Date
WO1996010486A1 true WO1996010486A1 (fr) 1996-04-11

Family

ID=20395447

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE1995/001114 WO1996010486A1 (fr) 1994-10-03 1995-10-02 Procede de pressage et presse utilisee a cet effet

Country Status (3)

Country Link
AU (1) AU3690795A (fr)
SE (1) SE502457C2 (fr)
WO (1) WO1996010486A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0785068A3 (fr) * 1996-01-18 1998-07-08 Matsushita Electric Works, Ltd. Procédé et dispositif pour la fabrication de laminés
EP1014768A2 (fr) * 1998-12-23 2000-06-28 Robert Bürkle GmbH Procédé et dispositif pour la fabrication de multicouches
CN102625586A (zh) * 2012-04-19 2012-08-01 苏州市嘉明机械制造有限公司 一种新型油压式铜箔导电压合机
WO2015183655A1 (fr) * 2014-05-30 2015-12-03 Saint-Gobain Ceramics & Plastics, Inc. Presse à chaud et procédés d'utilisation
WO2016009455A1 (fr) * 2014-07-17 2016-01-21 Cedal Equipment Srl Appareil permettant d'obtenir des feuilles multicouches pour circuits imprimés et procédé associé

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0254901A2 (fr) * 1986-07-18 1988-02-03 Tektronix, Inc. Méthode et appareil pour la fabrication de stratifiés
EP0297027A1 (fr) * 1987-05-27 1988-12-28 Fela Planungs Ag Méthode et appareil pour la fabrication des circuits imprimés muticouches par pression sous vide

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0254901A2 (fr) * 1986-07-18 1988-02-03 Tektronix, Inc. Méthode et appareil pour la fabrication de stratifiés
EP0297027A1 (fr) * 1987-05-27 1988-12-28 Fela Planungs Ag Méthode et appareil pour la fabrication des circuits imprimés muticouches par pression sous vide

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, Vol. 1647, No. 1, (M-1318), 30 September 1992; & JP,A,04 168 038, (SUMITOMO BAKELITE CO. LTD.), 16 June 1992. *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0785068A3 (fr) * 1996-01-18 1998-07-08 Matsushita Electric Works, Ltd. Procédé et dispositif pour la fabrication de laminés
EP1014768A2 (fr) * 1998-12-23 2000-06-28 Robert Bürkle GmbH Procédé et dispositif pour la fabrication de multicouches
DE19859613A1 (de) * 1998-12-23 2000-07-13 Buerkle Gmbh Robert Verfahren und Vorrichtung zur Herstellung von Multilayern
DE19859613C2 (de) * 1998-12-23 2001-09-06 Buerkle Gmbh Robert Presspaketaufbau und Verfahren zu dessen Herstellung
EP1014768A3 (fr) * 1998-12-23 2002-07-10 Robert Bürkle GmbH Procédé et dispositif pour la fabrication de multicouches
US6537412B1 (en) 1998-12-23 2003-03-25 Robert Burke Gmbh Process and apparatus for producing multilayers
CN102625586A (zh) * 2012-04-19 2012-08-01 苏州市嘉明机械制造有限公司 一种新型油压式铜箔导电压合机
WO2015183655A1 (fr) * 2014-05-30 2015-12-03 Saint-Gobain Ceramics & Plastics, Inc. Presse à chaud et procédés d'utilisation
WO2016009455A1 (fr) * 2014-07-17 2016-01-21 Cedal Equipment Srl Appareil permettant d'obtenir des feuilles multicouches pour circuits imprimés et procédé associé

Also Published As

Publication number Publication date
SE9403323D0 (sv) 1994-10-03
AU3690795A (en) 1996-04-26
SE9403323L (sv) 1995-10-23
SE502457C2 (sv) 1995-10-23

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