NO332795B1 - Fremgangsmate og anordning til laserbehandling av kretskort - Google Patents
Fremgangsmate og anordning til laserbehandling av kretskort Download PDFInfo
- Publication number
- NO332795B1 NO332795B1 NO20012728A NO20012728A NO332795B1 NO 332795 B1 NO332795 B1 NO 332795B1 NO 20012728 A NO20012728 A NO 20012728A NO 20012728 A NO20012728 A NO 20012728A NO 332795 B1 NO332795 B1 NO 332795B1
- Authority
- NO
- Norway
- Prior art keywords
- laser beam
- value
- laser processing
- laser
- hole
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 229
- 238000000034 method Methods 0.000 title claims description 70
- 230000002159 abnormal effect Effects 0.000 claims abstract description 98
- 238000003672 processing method Methods 0.000 claims abstract description 66
- 239000010410 layer Substances 0.000 claims description 76
- 239000002344 surface layer Substances 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 5
- 238000001514 detection method Methods 0.000 description 94
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 33
- 239000011889 copper foil Substances 0.000 description 33
- 238000007689 inspection Methods 0.000 description 32
- 230000003287 optical effect Effects 0.000 description 28
- 238000010586 diagram Methods 0.000 description 22
- 230000005856 abnormality Effects 0.000 description 19
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 230000001788 irregular Effects 0.000 description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 230000010354 integration Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000012805 post-processing Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010330 laser marking Methods 0.000 description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 230000000644 propagated effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000020477 pH reduction Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000165991A JP3460678B2 (ja) | 2000-06-02 | 2000-06-02 | レーザ加工方法および加工装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO20012728D0 NO20012728D0 (no) | 2001-06-01 |
| NO20012728L NO20012728L (no) | 2001-12-03 |
| NO332795B1 true NO332795B1 (no) | 2013-01-14 |
Family
ID=18669377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO20012728A NO332795B1 (no) | 2000-06-02 | 2001-06-01 | Fremgangsmate og anordning til laserbehandling av kretskort |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6694614B2 (de) |
| EP (1) | EP1161126B1 (de) |
| JP (1) | JP3460678B2 (de) |
| KR (1) | KR100864067B1 (de) |
| CN (1) | CN1198490C (de) |
| NO (1) | NO332795B1 (de) |
| TW (1) | TWI250059B (de) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6947802B2 (en) * | 2000-04-10 | 2005-09-20 | Hypertherm, Inc. | Centralized control architecture for a laser materials processing system |
| US7916388B2 (en) | 2007-12-20 | 2011-03-29 | Cymer, Inc. | Drive laser for EUV light source |
| US6690692B2 (en) * | 2002-01-29 | 2004-02-10 | Hans Laser Technology Co., Ltd. | Third harmonic laser system |
| US7186947B2 (en) | 2003-03-31 | 2007-03-06 | Hypertherm, Inc. | Process monitor for laser and plasma materials processing of materials |
| JP2005125359A (ja) * | 2003-10-23 | 2005-05-19 | Honda Motor Co Ltd | レーザビームによる溝の加工方法 |
| US20060163220A1 (en) | 2005-01-27 | 2006-07-27 | Brandt Aaron D | Automatic gas control for a plasma arc torch |
| JP2006305608A (ja) * | 2005-04-28 | 2006-11-09 | Toshiba Corp | レーザ加工装置、及びレーザ加工方法 |
| JP2007206550A (ja) * | 2006-02-03 | 2007-08-16 | Toshiba Corp | 液晶パネルの欠陥画素修正装置 |
| US7945087B2 (en) * | 2006-06-26 | 2011-05-17 | Orbotech Ltd. | Alignment of printed circuit board targets |
| JP5090690B2 (ja) * | 2006-08-28 | 2012-12-05 | 三菱電機株式会社 | 半導体薄膜の製造方法、薄膜トランジスタの製造方法、及び半導体薄膜の製造装置 |
| JP5132911B2 (ja) * | 2006-10-03 | 2013-01-30 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| JP5029804B2 (ja) * | 2006-11-02 | 2012-09-19 | 澁谷工業株式会社 | 脆性材料の割断方法 |
| TW200936287A (en) * | 2007-11-26 | 2009-09-01 | Nat Inst Of Advanced Ind Scien | Mold removing method |
| US8284247B2 (en) * | 2008-02-15 | 2012-10-09 | Enerize Corporation | Method and apparatus for detecting and inspecting through-penetrating defects in foils and films |
| US9390172B2 (en) * | 2009-12-03 | 2016-07-12 | Microsoft Technology Licensing, Llc | Communication channel between web application and process outside browser |
| JP6425368B2 (ja) * | 2012-04-27 | 2018-11-21 | 株式会社ディスコ | レーザー加工装置及びレーザー加工方法 |
| JP5967122B2 (ja) * | 2014-03-20 | 2016-08-10 | トヨタ自動車株式会社 | レーザー溶接装置及びレーザー溶接方法 |
| JP2016019997A (ja) * | 2014-07-15 | 2016-02-04 | ファナック株式会社 | 被加工物をレーザ加工するレーザ加工システム |
| JP6423812B2 (ja) | 2016-02-29 | 2018-11-14 | ファナック株式会社 | 反射光を抑制しつつレーザ加工を開始できるレーザ加工装置 |
| TWI571761B (zh) * | 2016-03-08 | 2017-02-21 | 國立勤益科技大學 | 印刷電路板之裝配排程最佳化方法 |
| CN109365410B (zh) * | 2018-10-17 | 2020-09-18 | 北京航天控制仪器研究所 | 一种实现高效激光清洗的加工头装置及清洗方法 |
| WO2022215127A1 (ja) * | 2021-04-05 | 2022-10-13 | 三菱電機株式会社 | レーザ加工装置、学習装置、および推論装置 |
| JP2023008089A (ja) * | 2021-07-05 | 2023-01-19 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| CN113618837B (zh) * | 2021-08-09 | 2023-03-24 | 金宝电子(铜陵)有限公司 | 自动化覆铜箔层压板加工方法、系统及其装置 |
| WO2024024579A1 (ja) * | 2022-07-28 | 2024-02-01 | パナソニックＩｐマネジメント株式会社 | レーザ溶接モニタリング装置 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5645715B2 (de) * | 1973-06-29 | 1981-10-28 | ||
| US4328410A (en) * | 1978-08-24 | 1982-05-04 | Slivinsky Sandra H | Laser skiving system |
| US4519064A (en) * | 1980-10-27 | 1985-05-21 | Nippon Columbia Kabushikikaisha | Optical record disc |
| US4412743A (en) * | 1981-09-08 | 1983-11-01 | Discovision Associates | Off-axis light beam defect detector |
| JPH0785128B2 (ja) * | 1986-01-14 | 1995-09-13 | 三晃技研工業株式会社 | 細孔内壁内視方法およびその装置 |
| JPH0292482A (ja) * | 1988-09-30 | 1990-04-03 | Hitachi Ltd | レーザ穿孔装置 |
| US5310986A (en) * | 1992-04-28 | 1994-05-10 | Mitsubishi Denki Kabushiki Kaisha | Laser machining apparatus |
| US5317141A (en) * | 1992-08-14 | 1994-05-31 | National Semiconductor Corporation | Apparatus and method for high-accuracy alignment |
| US5726443A (en) * | 1996-01-18 | 1998-03-10 | Chapman Glenn H | Vision system and proximity detector |
| US6037103A (en) * | 1996-12-11 | 2000-03-14 | Nitto Denko Corporation | Method for forming hole in printed board |
| US6040552A (en) * | 1997-01-30 | 2000-03-21 | Jain; Kanti | High-speed drilling system for micro-via pattern formation, and resulting structure |
| JP3346263B2 (ja) * | 1997-04-11 | 2002-11-18 | イビデン株式会社 | プリント配線板及びその製造方法 |
| JP3794120B2 (ja) * | 1997-09-02 | 2006-07-05 | 松下電器産業株式会社 | レーザ孔加工方法および装置 |
| KR100369688B1 (ko) * | 1997-12-12 | 2003-01-30 | 마쯔시다덴기산교 가부시키가이샤 | 레이저 가공 방법 및 레이저 가공 장치와 그 제어 방법 |
| JP3011173B2 (ja) * | 1998-01-27 | 2000-02-21 | 日本電気株式会社 | 半導体装置のホール開口検査方法とそのための装置 |
-
2000
- 2000-06-02 JP JP2000165991A patent/JP3460678B2/ja not_active Expired - Fee Related
-
2001
- 2001-05-30 EP EP01112831.1A patent/EP1161126B1/de not_active Expired - Lifetime
- 2001-05-31 US US09/867,621 patent/US6694614B2/en not_active Expired - Lifetime
- 2001-05-31 KR KR1020010030341A patent/KR100864067B1/ko not_active IP Right Cessation
- 2001-06-01 CN CNB011208341A patent/CN1198490C/zh not_active Expired - Fee Related
- 2001-06-01 NO NO20012728A patent/NO332795B1/no not_active IP Right Cessation
- 2001-06-01 TW TW090113376A patent/TWI250059B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100864067B1 (ko) | 2008-10-16 |
| JP3460678B2 (ja) | 2003-10-27 |
| JP2001340980A (ja) | 2001-12-11 |
| US20020008093A1 (en) | 2002-01-24 |
| NO20012728L (no) | 2001-12-03 |
| EP1161126A3 (de) | 2003-01-22 |
| KR20010110150A (ko) | 2001-12-12 |
| CN1198490C (zh) | 2005-04-20 |
| EP1161126B1 (de) | 2013-11-20 |
| EP1161126A2 (de) | 2001-12-05 |
| NO20012728D0 (no) | 2001-06-01 |
| CN1326837A (zh) | 2001-12-19 |
| US6694614B2 (en) | 2004-02-24 |
| TWI250059B (en) | 2006-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| NO332795B1 (no) | Fremgangsmate og anordning til laserbehandling av kretskort | |
| US7531767B2 (en) | Method and apparatus for laser perforating printed circuit board | |
| US7834293B2 (en) | Method and apparatus for laser processing | |
| KR100423714B1 (ko) | 프린트기판의 검사장치 | |
| US9463529B2 (en) | Laser machining apparatus that monitors material thickness and type by reflected light intensity | |
| JP4174267B2 (ja) | レーザ加工方法 | |
| CN1829418B (zh) | 印制电路板的冲孔方法及印制电路板的冲孔装置 | |
| JP2002542043A (ja) | 多重レーザビームを使用する材料処理システム及び方法 | |
| JP4852098B2 (ja) | レーザ加工装置 | |
| JP5268749B2 (ja) | 基板状態検査方法及びレーザ加工装置並びにソーラパネル製造方法 | |
| JP2003136267A (ja) | レーザ加工方法およびレーザ加工装置 | |
| JP2005118815A (ja) | レーザ加工方法およびレーザ加工装置 | |
| JP5349352B2 (ja) | レーザ光状態検査方法及び装置、レーザ加工方法及び装置並びにソーラパネル製造方法 | |
| JP2010240665A (ja) | レーザ光状態検査方法及び装置並びにソーラパネル製造方法 | |
| JPH11277261A (ja) | レーザ穴あけ加工装置 | |
| US12013374B2 (en) | Break strength method for testing glass laser cut quality of disc substrates using break testing apparatus | |
| JP5460068B2 (ja) | レーザ光状態検査方法及び装置並びにソーラパネル製造方法 | |
| JP3920710B2 (ja) | レーザ加工方法 | |
| CN114074214A (zh) | 激光加工装置和激光加工方法 | |
| JP2007029964A (ja) | レーザ加工装置 | |
| JP3926620B2 (ja) | レーザ加工装置およびその方法 | |
| JP2000126880A (ja) | レーザ加工装置及びレーザ加工方法 | |
| KR100982344B1 (ko) | 레이저 리페어시스템 | |
| JP2005118814A (ja) | レーザ加工方法およびレーザ加工装置 | |
| TW202247720A (zh) | 使用在修復期間感應及發射之光之光譜組件控制電子電路之雷射修復處理 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM1K | Lapsed by not paying the annual fees |