CN1829418B - 印制电路板的冲孔方法及印制电路板的冲孔装置 - Google Patents
印制电路板的冲孔方法及印制电路板的冲孔装置 Download PDFInfo
- Publication number
- CN1829418B CN1829418B CN2006100586348A CN200610058634A CN1829418B CN 1829418 B CN1829418 B CN 1829418B CN 2006100586348 A CN2006100586348 A CN 2006100586348A CN 200610058634 A CN200610058634 A CN 200610058634A CN 1829418 B CN1829418 B CN 1829418B
- Authority
- CN
- China
- Prior art keywords
- conductor layer
- laser beam
- circuit board
- processing
- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Laser Beam Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005061322 | 2005-03-04 | ||
JP2005-061322 | 2005-03-04 | ||
JP2005061322A JP4559260B2 (ja) | 2005-03-04 | 2005-03-04 | プリント基板の穴明け方法 |
JP2005-213608 | 2005-07-25 | ||
JP2005213608 | 2005-07-25 | ||
JP2005213608A JP4977341B2 (ja) | 2005-07-25 | 2005-07-25 | レーザ加工装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101738483A Division CN101676059B (zh) | 2005-03-04 | 2006-03-02 | 印制电路板的冲孔方法及印制电路板的冲孔装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1829418A CN1829418A (zh) | 2006-09-06 |
CN1829418B true CN1829418B (zh) | 2010-09-08 |
Family
ID=36947466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100586348A Expired - Fee Related CN1829418B (zh) | 2005-03-04 | 2006-03-02 | 印制电路板的冲孔方法及印制电路板的冲孔装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4559260B2 (zh) |
CN (1) | CN1829418B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8288684B2 (en) * | 2007-05-03 | 2012-10-16 | Electro Scientific Industries, Inc. | Laser micro-machining system with post-scan lens deflection |
KR100969946B1 (ko) * | 2007-07-24 | 2010-07-14 | 주식회사 이오테크닉스 | 레이저 빔 분할을 이용한 레이저 가공 장치 및 방법 |
JP4717916B2 (ja) * | 2008-09-29 | 2011-07-06 | 日立ビアメカニクス株式会社 | レーザ加工装置 |
JP2011003666A (ja) * | 2009-06-17 | 2011-01-06 | Sony Corp | 照射装置および半導体素子の製造方法 |
KR101352731B1 (ko) * | 2010-04-12 | 2014-01-17 | 미쓰비시덴키 가부시키가이샤 | 레이저 가공기, 레이저 가공방법 및 레이저 가공 제어장치 |
WO2017130960A1 (ja) * | 2016-01-27 | 2017-08-03 | 株式会社デンソー | 部材の製造方法、及び、部材の製造装置 |
JP6468295B2 (ja) * | 2016-01-27 | 2019-02-13 | 株式会社デンソー | 部材の製造方法、及び、部材の製造装置 |
EP3466597A1 (en) * | 2017-10-05 | 2019-04-10 | Synova S.A. | Apparatus for machining a workpiece with a laser beam |
DE112021001140T5 (de) * | 2020-04-27 | 2022-12-29 | Panasonic Intellectual Property Management Co., Ltd. | Laserverarbeitungskopf und laserverarbeitungsvorrichtung |
CN114571103A (zh) * | 2020-11-30 | 2022-06-03 | 大族激光科技产业集团股份有限公司 | 印制线路板的激光加工方法和系统、计算机存储介质 |
JP2022105463A (ja) * | 2021-01-02 | 2022-07-14 | 大船企業日本株式会社 | プリント基板のレーザ加工方法およびプリント基板のレーザ加工機 |
CN114791605B (zh) * | 2021-01-26 | 2023-08-22 | 南京大量数控科技有限公司 | 印刷电路板内层深度测量光学系统 |
CN114698250B (zh) * | 2022-04-08 | 2024-03-22 | 安捷利电子科技(苏州)有限公司 | 一种电路板盲孔的开设方法及电路板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1282203A (zh) * | 1999-07-27 | 2001-01-31 | 松下电工株式会社 | 印刷线路板处理方法 |
US6433301B1 (en) * | 1999-05-28 | 2002-08-13 | Electro Scientific Industries, Inc. | Beam shaping and projection imaging with solid state UV Gaussian beam to form vias |
US6441337B1 (en) * | 1997-12-12 | 2002-08-27 | Matsushita Electric Industrial Co., Ltd. | Laser machining method, laser machining device and control method of laser machining |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0441091A (ja) * | 1990-06-04 | 1992-02-12 | Canon Inc | レーザーによるプリント板の加工方法 |
JP3488614B2 (ja) * | 1998-01-09 | 2004-01-19 | 三菱電機株式会社 | 積層材料の凹設部検査装置及びレーザ加工装置 |
JP3583279B2 (ja) * | 1998-01-13 | 2004-11-04 | 三菱電機株式会社 | 穴あけ加工方法 |
JP2000263263A (ja) * | 1999-03-12 | 2000-09-26 | Sumitomo Heavy Ind Ltd | レーザ穴あけ加工方法及び加工装置 |
JP2001313471A (ja) * | 2000-02-24 | 2001-11-09 | Matsushita Electric Works Ltd | 配線板のビアホール形成方法 |
JP2002335063A (ja) * | 2001-05-09 | 2002-11-22 | Hitachi Via Mechanics Ltd | プリント基板の穴あけ加工方法および装置 |
JP2002137074A (ja) * | 2000-10-31 | 2002-05-14 | Hitachi Via Mechanics Ltd | レーザ加工方法およびレーザ加工機 |
JP4316827B2 (ja) * | 2001-08-13 | 2009-08-19 | 日立ビアメカニクス株式会社 | レーザ加工方法およびレーザ加工装置 |
JP3921992B2 (ja) * | 2001-10-26 | 2007-05-30 | 松下電器産業株式会社 | レーザ加工方法 |
JP2003136267A (ja) * | 2001-11-01 | 2003-05-14 | Hitachi Via Mechanics Ltd | レーザ加工方法およびレーザ加工装置 |
JP4174267B2 (ja) * | 2002-08-21 | 2008-10-29 | 日立ビアメカニクス株式会社 | レーザ加工方法 |
-
2005
- 2005-03-04 JP JP2005061322A patent/JP4559260B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-02 CN CN2006100586348A patent/CN1829418B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6441337B1 (en) * | 1997-12-12 | 2002-08-27 | Matsushita Electric Industrial Co., Ltd. | Laser machining method, laser machining device and control method of laser machining |
US6433301B1 (en) * | 1999-05-28 | 2002-08-13 | Electro Scientific Industries, Inc. | Beam shaping and projection imaging with solid state UV Gaussian beam to form vias |
CN1282203A (zh) * | 1999-07-27 | 2001-01-31 | 松下电工株式会社 | 印刷线路板处理方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4559260B2 (ja) | 2010-10-06 |
CN1829418A (zh) | 2006-09-06 |
JP2006245438A (ja) | 2006-09-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1829418B (zh) | 印制电路板的冲孔方法及印制电路板的冲孔装置 | |
CN101676059B (zh) | 印制电路板的冲孔方法及印制电路板的冲孔装置 | |
KR20010106439A (ko) | 프린트기판의 검사장치 | |
CN103370164B (zh) | 用于检查工件上的切割加工的方法 | |
EP1161126B1 (en) | Laser processing method and equipment for printed circuit board | |
JP2020069532A (ja) | レーザ加工装置及びレーザ加工方法 | |
JP4174267B2 (ja) | レーザ加工方法 | |
US6818858B2 (en) | Laser processing unit and processing apparatus comprising laser processing unit | |
CN109834387A (zh) | 激光加工前对外部光学系统异常进行警报的激光加工装置 | |
WO2020090929A1 (ja) | レーザ加工装置及びレーザ加工方法 | |
US7595895B2 (en) | Laser beam machining system | |
CN110587159A (zh) | 一种实时监测激光加工性能的系统及方法 | |
JP5371514B2 (ja) | レーザ光状態検査方法及び装置並びにソーラパネル製造方法 | |
JP5460068B2 (ja) | レーザ光状態検査方法及び装置並びにソーラパネル製造方法 | |
JP2019200225A (ja) | 集光光学ユニット及びそれを用いたレーザ発振器、レーザ加工装置、レーザ発振器の異常診断方法 | |
WO2020090902A1 (ja) | レーザ加工装置及びレーザ加工方法 | |
CN215145673U (zh) | 激光加工系统 | |
JP2007029964A (ja) | レーザ加工装置 | |
WO2020090901A1 (ja) | レーザ加工装置及びレーザ加工方法 | |
CN118321713A (zh) | 一种用于监测激光焊接过程的光学系统 | |
JPH07232291A (ja) | レーザ加工装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
CI02 | Correction of invention patent application |
Correction item: Priority Correct: 2005.07.25 JP 2005-213608 False: Lack of priority second Number: 36 Page: The title page Volume: 22 |
|
COR | Change of bibliographic data |
Free format text: CORRECT: PRIORITY; FROM: MISSING THE SECOND ARTICLE OF PRIORITY TO: 2005.7.25 JP 2005-213608 |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1097990 Country of ref document: HK |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: WD Ref document number: 1097990 Country of ref document: HK |
|
C56 | Change in the name or address of the patentee |
Owner name: VIA MECHANICS LTD. Free format text: FORMER NAME: HITACHI BIA MACINE CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa Patentee after: Via Mechanics Ltd. Address before: Kanagawa Patentee before: Hitachi Bia Macine Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100908 Termination date: 20160302 |
|
CF01 | Termination of patent right due to non-payment of annual fee |