NO318126B1 - Organisk termistor med positiv temperaturkoeffisient og forebyggende anordning mot overoppvarming med sadant PTK-termistorelement - Google Patents
Organisk termistor med positiv temperaturkoeffisient og forebyggende anordning mot overoppvarming med sadant PTK-termistorelement Download PDFInfo
- Publication number
- NO318126B1 NO318126B1 NO19963059A NO963059A NO318126B1 NO 318126 B1 NO318126 B1 NO 318126B1 NO 19963059 A NO19963059 A NO 19963059A NO 963059 A NO963059 A NO 963059A NO 318126 B1 NO318126 B1 NO 318126B1
- Authority
- NO
- Norway
- Prior art keywords
- ptk
- thermistor
- organic
- resistivity
- fluorescent tube
- Prior art date
Links
- 238000013021 overheating Methods 0.000 title claims description 19
- 230000003449 preventive effect Effects 0.000 title description 4
- 229910052751 metal Inorganic materials 0.000 claims description 81
- 239000002184 metal Substances 0.000 claims description 81
- 239000000843 powder Substances 0.000 claims description 39
- 150000001875 compounds Chemical class 0.000 claims description 36
- 239000000126 substance Substances 0.000 claims description 31
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical group [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 31
- 239000002245 particle Substances 0.000 claims description 29
- 229920000620 organic polymer Polymers 0.000 claims description 20
- 238000004898 kneading Methods 0.000 claims description 18
- 239000002033 PVDF binder Substances 0.000 claims description 16
- 230000002159 abnormal effect Effects 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 16
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 16
- -1 polyethylene Polymers 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 10
- 239000004698 Polyethylene Substances 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 7
- 229920000573 polyethylene Polymers 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 229920000554 ionomer Polymers 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 4
- 239000011118 polyvinyl acetate Substances 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- 238000001947 vapour-phase growth Methods 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims 2
- 229920001756 Polyvinyl chloride acetate Polymers 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 24
- 230000008859 change Effects 0.000 description 17
- 239000006229 carbon black Substances 0.000 description 15
- 230000015556 catabolic process Effects 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000919 ceramic Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 238000004132 cross linking Methods 0.000 description 8
- 230000002265 prevention Effects 0.000 description 8
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 7
- 229920006370 Kynar Polymers 0.000 description 7
- 229920000578 graft copolymer Polymers 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 230000020169 heat generation Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007738 vacuum evaporation Methods 0.000 description 5
- 206010040954 Skin wrinkling Diseases 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000009941 weaving Methods 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000010348 incorporation Methods 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910033181 TiB2 Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910020968 MoSi2 Inorganic materials 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 229910019802 NbC Inorganic materials 0.000 description 1
- 229910034327 TiC Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910007948 ZrB2 Inorganic materials 0.000 description 1
- 229910026551 ZrC Inorganic materials 0.000 description 1
- 229910008322 ZrN Inorganic materials 0.000 description 1
- OTCHGXYCWNXDOA-UHFFFAOYSA-N [C].[Zr] Chemical compound [C].[Zr] OTCHGXYCWNXDOA-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- VWZIXVXBCBBRGP-UHFFFAOYSA-N boron;zirconium Chemical compound B#[Zr]#B VWZIXVXBCBBRGP-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000010382 chemical cross-linking Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- NPURPEXKKDAKIH-UHFFFAOYSA-N iodoimino(oxo)methane Chemical compound IN=C=O NPURPEXKKDAKIH-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- GALOTNBSUVEISR-UHFFFAOYSA-N molybdenum;silicon Chemical compound [Mo]#[Si] GALOTNBSUVEISR-UHFFFAOYSA-N 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 1
- 239000011225 non-oxide ceramic Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18909695A JP3229170B2 (ja) | 1995-07-25 | 1995-07-25 | 蛍光ランプ異常過熱防止装置 |
| JP27355095 | 1995-09-27 | ||
| JP908496A JP2936057B2 (ja) | 1996-01-23 | 1996-01-23 | 有機質ｐｔｃサーミスタ |
| JP17423196A JP2810351B2 (ja) | 1995-09-27 | 1996-06-13 | 有機質正特性サーミスタ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO963059D0 NO963059D0 (no) | 1996-07-23 |
| NO963059L NO963059L (no) | 1997-01-27 |
| NO318126B1 true NO318126B1 (no) | 2005-02-07 |
Family
ID=27455091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO19963059A NO318126B1 (no) | 1995-07-25 | 1996-07-23 | Organisk termistor med positiv temperaturkoeffisient og forebyggende anordning mot overoppvarming med sadant PTK-termistorelement |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5793276A (fr) |
| EP (1) | EP0758131B1 (fr) |
| KR (1) | KR100295013B1 (fr) |
| CN (1) | CN1090797C (fr) |
| DE (1) | DE69633547T2 (fr) |
| MY (1) | MY115034A (fr) |
| NO (1) | NO318126B1 (fr) |
| TW (1) | TW312794B (fr) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW344828B (en) * | 1997-02-28 | 1998-11-11 | Mitsubishi Electric Corp | Organic positive temperature coefficient composition and a circuit protection device using such composition |
| JP3219044B2 (ja) * | 1997-03-31 | 2001-10-15 | 松下電器産業株式会社 | 環形蛍光ランプ |
| DE69837378T2 (de) * | 1998-01-22 | 2007-11-29 | Mitsubishi Denki K.K. | PTC-Polymerzusammensetzung und daraus hergestellte Schaltungsschutzeinrichtung |
| JP3736171B2 (ja) * | 1998-03-31 | 2006-01-18 | 東芝ライテック株式会社 | 電球形蛍光ランプ及び照明器具 |
| WO1999067833A1 (fr) * | 1998-06-25 | 1999-12-29 | Mitsubishi Denki Kabushiki Kaisha | Cellule et son procede de production |
| EP1035606A4 (fr) * | 1998-06-25 | 2006-06-14 | Mitsubishi Electric Corp | Cellule et procede de production correspondant |
| US6159635A (en) * | 1998-09-29 | 2000-12-12 | Electrofuel Inc. | Composite electrode including current collector |
| US20020198145A1 (en) * | 1999-06-10 | 2002-12-26 | Cognetix, Inc. | MuO-conopeptides and their use as local anesthetics |
| US6362721B1 (en) * | 1999-08-31 | 2002-03-26 | Tyco Electronics Corporation | Electrical device and assembly |
| AU2001230356A1 (en) * | 2000-01-28 | 2001-08-07 | Catalytic Electrodes Limited | Carbon monoxide detector |
| US6597551B2 (en) | 2000-12-13 | 2003-07-22 | Huladyne Corporation | Polymer current limiting device and method of manufacture |
| KR100411778B1 (ko) * | 2001-10-12 | 2003-12-24 | 주식회사 쎄라텍 | 중합체 양성온도계수 써미스터 제조방법 |
| JP3857571B2 (ja) * | 2001-11-15 | 2006-12-13 | タイコ エレクトロニクス レイケム株式会社 | ポリマーｐｔｃサーミスタおよび温度センサ |
| TWI269317B (en) * | 2005-07-28 | 2006-12-21 | Polytronics Technology Corp | Over-current protection device |
| TWI292972B (en) * | 2005-08-11 | 2008-01-21 | Polytronics Technology Corp | Over-current protection device |
| USRE44224E1 (en) | 2005-12-27 | 2013-05-21 | Polytronics Technology Corp. | Surface-mounted over-current protection device |
| TWI282696B (en) | 2005-12-27 | 2007-06-11 | Polytronics Technology Corp | Surface-mounted over-current protection device |
| US8044763B2 (en) | 2005-12-27 | 2011-10-25 | Polytronics Technology Corp. | Surface-mounted over-current protection device |
| TWI298598B (en) * | 2006-02-15 | 2008-07-01 | Polytronics Technology Corp | Over-current protection device |
| TWI310955B (en) * | 2006-09-26 | 2009-06-11 | Polytronics Technology Corp | Over-current protection device |
| CN101162632B (zh) * | 2006-10-10 | 2010-05-19 | 聚鼎科技股份有限公司 | 过电流保护组件 |
| WO2008064215A2 (fr) * | 2006-11-20 | 2008-05-29 | Sabic Innovative Plastics Ip Bv | Compositions électroconductrices |
| DE102007029525A1 (de) * | 2007-04-12 | 2008-10-23 | Metallux Ag | Verbundbauteil |
| CN102127287A (zh) * | 2011-01-31 | 2011-07-20 | 上海长园维安电子线路保护股份有限公司 | 导电复合材料及由其制备的ptc热敏元件 |
| JP5955014B2 (ja) | 2011-02-14 | 2016-07-20 | 株式会社半導体エネルギー研究所 | 発光モジュール、発光パネルおよび照明装置 |
| JP5786961B2 (ja) | 2011-12-27 | 2015-09-30 | トヨタ自動車株式会社 | 通電加熱式触媒装置及びその製造方法 |
| WO2013114293A1 (fr) * | 2012-01-30 | 2013-08-08 | Pst Sensors (Proprietary) Limited | Capteur de température à grande étendue |
| CN106317544B (zh) | 2015-06-30 | 2018-12-21 | 上海利韬电子有限公司 | 导电聚合物组合物、导电聚合物片材、电气器件以及它们的制备方法 |
| EP3533072B1 (fr) | 2016-10-25 | 2022-02-16 | Hewlett-Packard Development Company, L.P. | Objet imprimé en 3d avec capteur de température intégré |
| TWI642148B (zh) * | 2016-12-27 | 2018-11-21 | 日商三星皮帶股份有限公司 | Conductive paste and electronic substrate and method of manufacturing same |
| US10575412B2 (en) | 2016-12-27 | 2020-02-25 | Mitsuboshi Belting Ltd. | Electroconductive paste, electronic substrate, and method for manufacturing said substrate |
| US20190096621A1 (en) | 2017-09-22 | 2019-03-28 | Littelfuse, Inc. | Pptc device having low melting temperature polymer body |
| WO2019083970A1 (fr) * | 2017-10-23 | 2019-05-02 | Illinois Tool Works Inc. | Connecteur flexible sans soudure à haute puissance pour conducteurs imprimés |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3591526A (en) * | 1968-01-25 | 1971-07-06 | Polyelectric Corp | Method of manufacturing a temperature sensitive,electrical resistor material |
| US3673121A (en) * | 1970-01-27 | 1972-06-27 | Texas Instruments Inc | Process for making conductive polymers and resulting compositions |
| US4237441A (en) * | 1978-12-01 | 1980-12-02 | Raychem Corporation | Low resistivity PTC compositions |
| US4369343A (en) * | 1979-11-26 | 1983-01-18 | Nissan Motor Co., Ltd. | Ignition distributor having electrodes with thermistor discharging portions |
| US4545926A (en) * | 1980-04-21 | 1985-10-08 | Raychem Corporation | Conductive polymer compositions and devices |
| US4314230A (en) * | 1980-07-31 | 1982-02-02 | Raychem Corporation | Devices comprising conductive polymers |
| DE3311051A1 (de) * | 1983-03-25 | 1984-09-27 | Siemens AG, 1000 Berlin und 8000 München | Flexibles heizelement in bandform, das aus elektrisch leitfaehigen koernchen aus ptc-material und einem organischen isolierenden kunststoff als bindemittel besteht, und verfahren zur herstellung des flexiblen heizelementes |
| JPS6285401A (ja) * | 1985-10-09 | 1987-04-18 | 株式会社村田製作所 | 有機質正特性サ−ミスタ |
| JPS62299833A (ja) * | 1986-06-19 | 1987-12-26 | Matsushita Graphic Commun Syst Inc | 照明光源装置 |
| JPH01143203A (ja) * | 1987-11-27 | 1989-06-05 | Murata Mfg Co Ltd | 有機正特性サーミスタ |
| JPH01257304A (ja) * | 1988-04-06 | 1989-10-13 | Murata Mfg Co Ltd | 有機正特性サーミスタ |
| JPH0616442B2 (ja) * | 1988-04-06 | 1994-03-02 | 株式会社村田製作所 | 有機正特性サーミスタ |
| BE1002413A3 (nl) * | 1988-05-11 | 1991-01-29 | Spoelders Ludy | Inrichting voor het in zaagtandvorm tussen twee paren van boven- en ondermessen uitsnijden en verlijmen van de einden van fineerbanden. |
| JP2876125B2 (ja) * | 1988-09-21 | 1999-03-31 | ティーディーケイ株式会社 | 低抵抗ｐｔｃ素子 |
| JPH0651859B2 (ja) * | 1989-04-04 | 1994-07-06 | 帝国通信工業株式会社 | 摺接パターン用印刷導電ペースト |
| AU637370B2 (en) * | 1989-05-18 | 1993-05-27 | Fujikura Ltd. | Ptc thermistor and manufacturing method for the same |
| US5214738A (en) * | 1989-08-07 | 1993-05-25 | Mitsui Toatsu Chemicals, Inc. | Positive coefficient thin-film thermistor |
| JPH047801A (ja) * | 1990-04-25 | 1992-01-13 | Daito Tsushinki Kk | Ｐｔｃ素子 |
| SE468026B (sv) * | 1990-06-05 | 1992-10-19 | Asea Brown Boveri | Saett att framstaella en elektrisk anordning |
| JP2508894B2 (ja) * | 1990-06-11 | 1996-06-19 | 株式会社村田製作所 | 誘電体フィルタ装置 |
| JP2833242B2 (ja) * | 1991-03-12 | 1998-12-09 | 株式会社村田製作所 | Ｎｔｃサーミスタ素子 |
| JPH05109502A (ja) * | 1991-10-18 | 1993-04-30 | Daito Tsushinki Kk | Ｐｔｃ素子 |
-
1996
- 1996-07-17 US US08/682,301 patent/US5793276A/en not_active Expired - Lifetime
- 1996-07-22 EP EP96111794A patent/EP0758131B1/fr not_active Expired - Lifetime
- 1996-07-22 DE DE69633547T patent/DE69633547T2/de not_active Expired - Fee Related
- 1996-07-23 NO NO19963059A patent/NO318126B1/no not_active IP Right Cessation
- 1996-07-24 TW TW085109112A patent/TW312794B/zh active
- 1996-07-24 MY MYPI96003041A patent/MY115034A/en unknown
- 1996-07-25 KR KR1019960030230A patent/KR100295013B1/ko not_active IP Right Cessation
- 1996-07-25 CN CN96112244A patent/CN1090797C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1090797C (zh) | 2002-09-11 |
| EP0758131B1 (fr) | 2004-10-06 |
| TW312794B (fr) | 1997-08-11 |
| DE69633547T2 (de) | 2005-02-03 |
| EP0758131A3 (fr) | 1997-08-20 |
| NO963059L (no) | 1997-01-27 |
| CN1150314A (zh) | 1997-05-21 |
| KR100295013B1 (ko) | 2001-11-30 |
| KR970008228A (ko) | 1997-02-24 |
| US5793276A (en) | 1998-08-11 |
| DE69633547D1 (de) | 2004-11-11 |
| EP0758131A2 (fr) | 1997-02-12 |
| MY115034A (en) | 2003-03-31 |
| NO963059D0 (no) | 1996-07-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM1K | Lapsed by not paying the annual fees |