NO2881199T3 - - Google Patents
Info
- Publication number
- NO2881199T3 NO2881199T3 NO13825854A NO13825854A NO2881199T3 NO 2881199 T3 NO2881199 T3 NO 2881199T3 NO 13825854 A NO13825854 A NO 13825854A NO 13825854 A NO13825854 A NO 13825854A NO 2881199 T3 NO2881199 T3 NO 2881199T3
- Authority
- NO
- Norway
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0545—Dispersions or suspensions of nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/36—Inkjet printing inks based on non-aqueous solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012171882 | 2012-08-02 | ||
PCT/JP2013/070498 WO2014021270A1 (ja) | 2012-08-02 | 2013-07-29 | 銀ナノ粒子含有インクの製造方法及び銀ナノ粒子含有インク |
Publications (1)
Publication Number | Publication Date |
---|---|
NO2881199T3 true NO2881199T3 (no) | 2017-12-16 |
Family
ID=50027945
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO13825854A NO2881199T3 (no) | 2012-08-02 | 2013-07-29 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9422443B2 (no) |
EP (1) | EP2881199B1 (no) |
JP (1) | JP5923608B2 (no) |
KR (1) | KR101641472B1 (no) |
CN (1) | CN104520033B (no) |
NO (1) | NO2881199T3 (no) |
TW (1) | TWI591134B (no) |
WO (1) | WO2014021270A1 (no) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6241908B2 (ja) * | 2011-02-04 | 2017-12-06 | 国立大学法人山形大学 | 被覆金属微粒子とその製造方法 |
JP6231003B2 (ja) * | 2011-09-06 | 2017-11-15 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 導電性材料およびプロセス |
WO2013036519A1 (en) | 2011-09-06 | 2013-03-14 | Henkel Corporation | Conductive material and process |
JP6037494B2 (ja) * | 2012-01-11 | 2016-12-07 | 国立大学法人山形大学 | 銀ナノ粒子の製造方法及び銀ナノ粒子、並びに銀塗料組成物 |
TWI592234B (zh) * | 2012-08-07 | 2017-07-21 | Daicel Corp | Method for producing silver nano-particles, silver nano-particles and silver paint composition |
TWI635918B (zh) * | 2012-08-07 | 2018-09-21 | 大賽璐股份有限公司 | 銀奈米粒子之製造方法及銀奈米粒子 |
US10040960B2 (en) | 2012-09-28 | 2018-08-07 | Toppan Forms Co., Ltd. | Silver ink composition, conductor and communication device |
JP6099472B2 (ja) * | 2013-04-26 | 2017-03-22 | Dowaエレクトロニクス株式会社 | 金属ナノ粒子分散体、金属ナノ粒子分散体の製造方法および接合方法 |
CN105579533B (zh) | 2013-08-16 | 2020-04-14 | 汉高知识产权控股有限责任公司 | 亚微米银颗粒油墨组合物、方法和用途 |
EP3061547B1 (en) * | 2013-10-24 | 2019-12-04 | Daicel Corporation | Method for producing dispersion liquid containing silver nanoparticles, and dispersion liquid containing silver nanoparticles |
JP5732520B1 (ja) * | 2013-12-11 | 2015-06-10 | 田中貴金属工業株式会社 | 銀粒子の製造方法及び当該方法により製造される銀粒子 |
JP6599891B2 (ja) | 2014-04-17 | 2019-10-30 | エレクトロニンクス インコーポレイテッド | 導電性インク組成物 |
JP5813839B1 (ja) * | 2014-09-10 | 2015-11-17 | 日本航空電子工業株式会社 | 被覆金属微粒子の組成物を含む複合体 |
KR20220145418A (ko) | 2014-10-02 | 2022-10-28 | 주식회사 다이셀 | 은 입자 도료 조성물 |
GB2535214A (en) * | 2015-02-13 | 2016-08-17 | Dst Innovation Ltd | Printable conductive ink and method of forming transparent printed electrodes |
JP6664373B2 (ja) | 2015-02-19 | 2020-03-13 | 株式会社ダイセル | 銀粒子塗料組成物 |
WO2016152017A1 (ja) * | 2015-03-23 | 2016-09-29 | バンドー化学株式会社 | 導電性被膜複合体及びその製造方法 |
JP2017132048A (ja) * | 2016-01-25 | 2017-08-03 | セイコーエプソン株式会社 | 前処理液、油性インクジェット記録用インクセット及び油性インクジェット記録方法 |
US10563079B2 (en) * | 2016-03-04 | 2020-02-18 | Xerox Corporation | Silver nanoparticle ink |
JP6758059B2 (ja) * | 2016-03-09 | 2020-09-23 | 株式会社アルバック | 凸版反転印刷用導電性金属インク及びそれを用いた金属配線の形成方法 |
JP6949827B2 (ja) * | 2016-04-04 | 2021-10-13 | 株式会社ダイセル | スクリーン印刷用インク |
CN105665747A (zh) * | 2016-04-22 | 2016-06-15 | 广东南海启明光大科技有限公司 | 一种油性纳米银粒子的制备方法 |
JP6962321B2 (ja) * | 2016-05-26 | 2021-11-05 | 株式会社大阪ソーダ | 導電性接着剤 |
WO2018030174A1 (ja) * | 2016-08-10 | 2018-02-15 | バンドー化学株式会社 | 金属銀微粒子の製造方法 |
US11081253B2 (en) * | 2016-11-08 | 2021-08-03 | Dowa Electronics Materials Co., Ltd. | Silver particle dispersing solution, method for producing same, and method for producing conductive film using silver particle dispersing solution |
JP6905328B2 (ja) * | 2016-11-15 | 2021-07-21 | 株式会社ダイセル | 金属メッキ層形成用組成物 |
US11441010B2 (en) * | 2017-10-04 | 2022-09-13 | Dowa Electronics Materials Co., Ltd. | Fine silver particle dispersion |
CN111433299A (zh) * | 2017-12-07 | 2020-07-17 | 株式会社大赛璐 | 喷墨印刷用油墨 |
US10752797B2 (en) * | 2018-07-24 | 2020-08-25 | Xerox Corporation | Conductive ink compositions and methods for preparation of stabilized metal-containing nanoparticles |
US10982107B2 (en) | 2018-07-24 | 2021-04-20 | Xerox Corporation | Metal nanoparticle ink composition |
JPWO2020075590A1 (ja) * | 2018-10-11 | 2021-09-02 | 株式会社ダイセル | インク、焼結体、及び装飾ガラス |
US11492547B2 (en) | 2020-06-04 | 2022-11-08 | UbiQD, Inc. | Low-PH nanoparticles and ligands |
WO2022009837A1 (ja) | 2020-07-08 | 2022-01-13 | 株式会社ダイセル | 導電性インク |
US20230249219A1 (en) | 2020-07-08 | 2023-08-10 | Daicel Corporation | Method for manufacturing conductive laminate |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1778010B1 (en) * | 2004-07-30 | 2014-06-04 | Kimberly-Clark Worldwide, Inc. | Antimicrobial silver compositions |
US7270694B2 (en) * | 2004-10-05 | 2007-09-18 | Xerox Corporation | Stabilized silver nanoparticles and their use |
JP5007020B2 (ja) * | 2004-12-20 | 2012-08-22 | 株式会社アルバック | 金属薄膜の形成方法及び金属薄膜 |
KR100690360B1 (ko) * | 2005-05-23 | 2007-03-09 | 삼성전기주식회사 | 도전성 잉크, 그 제조방법 및 도전성 기판 |
JP4674375B2 (ja) * | 2005-08-01 | 2011-04-20 | Dowaエレクトロニクス株式会社 | 銀粒子粉末の製造法 |
EP2752470A1 (en) | 2006-08-07 | 2014-07-09 | Inktec Co., Ltd. | Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same |
JP4505825B2 (ja) * | 2006-09-15 | 2010-07-21 | 国立大学法人大阪大学 | 金属ナノ粒子の焼結方法およびその焼結方法を用いた基板上に配線を形成する方法 |
JP4872663B2 (ja) * | 2006-12-28 | 2012-02-08 | 株式会社日立製作所 | 接合用材料及び接合方法 |
JP4978242B2 (ja) | 2007-03-05 | 2012-07-18 | 昭栄化学工業株式会社 | 銀超微粒子の製造方法 |
KR20090012605A (ko) * | 2007-07-30 | 2009-02-04 | 삼성전기주식회사 | 금속 나노입자의 제조방법 |
KR100935168B1 (ko) * | 2007-09-21 | 2010-01-06 | 삼성전기주식회사 | 비수계 전도성 나노잉크 조성물 |
JP2009215502A (ja) * | 2008-03-12 | 2009-09-24 | Dowa Electronics Materials Co Ltd | 脂環式・芳香族炭化水素を溶媒とする銀インク |
US8361350B2 (en) | 2008-12-10 | 2013-01-29 | Xerox Corporation | Silver nanoparticle ink composition |
JP5574761B2 (ja) | 2009-04-17 | 2014-08-20 | 国立大学法人山形大学 | 被覆銀超微粒子とその製造方法 |
JP5586364B2 (ja) * | 2010-07-28 | 2014-09-10 | ハリマ化成株式会社 | 金ナノ粒子の製造方法 |
JP5791146B2 (ja) * | 2010-08-03 | 2015-10-07 | バンドー化学株式会社 | コロイド分散液 |
DE102010042587A1 (de) | 2010-10-18 | 2012-04-19 | Robert Bosch Gmbh | Kraftstoffpumpe für ein Kraftstoffeinspritzsystem einer Brennkraftmaschine |
JP6241908B2 (ja) | 2011-02-04 | 2017-12-06 | 国立大学法人山形大学 | 被覆金属微粒子とその製造方法 |
BR112013030982A2 (pt) | 2011-06-03 | 2016-12-06 | Luiz Augusto De Siqueira Indio Da Costa | veículo |
JP6001861B2 (ja) | 2012-01-11 | 2016-10-05 | 株式会社ダイセル | 銀ナノ粒子の製造方法及び銀ナノ粒子、並びに銀塗料組成物 |
JP6037494B2 (ja) * | 2012-01-11 | 2016-12-07 | 国立大学法人山形大学 | 銀ナノ粒子の製造方法及び銀ナノ粒子、並びに銀塗料組成物 |
TWI635918B (zh) * | 2012-08-07 | 2018-09-21 | 大賽璐股份有限公司 | 銀奈米粒子之製造方法及銀奈米粒子 |
TWI592234B (zh) * | 2012-08-07 | 2017-07-21 | Daicel Corp | Method for producing silver nano-particles, silver nano-particles and silver paint composition |
US9105373B2 (en) * | 2013-06-19 | 2015-08-11 | Xerox Corporation | Safe method for manufacturing silver nanoparticle inks |
-
2013
- 2013-07-26 TW TW102126802A patent/TWI591134B/zh active
- 2013-07-29 WO PCT/JP2013/070498 patent/WO2014021270A1/ja active Application Filing
- 2013-07-29 US US14/418,816 patent/US9422443B2/en not_active Expired - Fee Related
- 2013-07-29 KR KR1020157002170A patent/KR101641472B1/ko active IP Right Grant
- 2013-07-29 NO NO13825854A patent/NO2881199T3/no unknown
- 2013-07-29 JP JP2014528148A patent/JP5923608B2/ja active Active
- 2013-07-29 EP EP13825854.6A patent/EP2881199B1/en active Active
- 2013-07-29 CN CN201380040666.3A patent/CN104520033B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN104520033A (zh) | 2015-04-15 |
EP2881199B1 (en) | 2017-07-19 |
CN104520033B (zh) | 2017-07-14 |
EP2881199A1 (en) | 2015-06-10 |
US20150225588A1 (en) | 2015-08-13 |
US9422443B2 (en) | 2016-08-23 |
EP2881199A4 (en) | 2016-04-27 |
KR101641472B1 (ko) | 2016-07-20 |
JPWO2014021270A1 (ja) | 2016-07-21 |
WO2014021270A1 (ja) | 2014-02-06 |
TW201410803A (zh) | 2014-03-16 |
KR20150040278A (ko) | 2015-04-14 |
TWI591134B (zh) | 2017-07-11 |
JP5923608B2 (ja) | 2016-05-24 |