NO20050075L - Mikroelektronikkrengjoring og antireflektive beleggfjernersammensetninger - Google Patents

Mikroelektronikkrengjoring og antireflektive beleggfjernersammensetninger

Info

Publication number
NO20050075L
NO20050075L NO20050075A NO20050075A NO20050075L NO 20050075 L NO20050075 L NO 20050075L NO 20050075 A NO20050075 A NO 20050075A NO 20050075 A NO20050075 A NO 20050075A NO 20050075 L NO20050075 L NO 20050075L
Authority
NO
Norway
Prior art keywords
reflective coating
cleaning
coating remover
remover compositions
microelectronics
Prior art date
Application number
NO20050075A
Other languages
English (en)
Norwegian (no)
Inventor
Chien-Pin Sherman Hsu
Original Assignee
Mallinckrodt Baker Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mallinckrodt Baker Inc filed Critical Mallinckrodt Baker Inc
Publication of NO20050075L publication Critical patent/NO20050075L/no

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
    • C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
    • C23G1/061—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors nitrogen-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
NO20050075A 2002-06-07 2005-01-06 Mikroelektronikkrengjoring og antireflektive beleggfjernersammensetninger NO20050075L (no)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US38680002P 2002-06-07 2002-06-07
US40168802P 2002-08-07 2002-08-07
PCT/US2003/016829 WO2003104901A2 (en) 2002-06-07 2003-05-27 Microelectronic cleaning and arc remover compositions

Publications (1)

Publication Number Publication Date
NO20050075L true NO20050075L (no) 2005-01-06

Family

ID=29739917

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20050075A NO20050075L (no) 2002-06-07 2005-01-06 Mikroelektronikkrengjoring og antireflektive beleggfjernersammensetninger

Country Status (17)

Country Link
US (1) US8906838B2 (cg-RX-API-DMAC10.html)
EP (1) EP1512050A2 (cg-RX-API-DMAC10.html)
JP (1) JP4330529B2 (cg-RX-API-DMAC10.html)
KR (1) KR100958068B1 (cg-RX-API-DMAC10.html)
CN (2) CN102135735A (cg-RX-API-DMAC10.html)
AU (1) AU2003240827A1 (cg-RX-API-DMAC10.html)
BR (1) BR0311830A (cg-RX-API-DMAC10.html)
CA (1) CA2488737A1 (cg-RX-API-DMAC10.html)
IL (1) IL165581A (cg-RX-API-DMAC10.html)
IN (2) IN2004CH02744A (cg-RX-API-DMAC10.html)
MY (1) MY142745A (cg-RX-API-DMAC10.html)
NO (1) NO20050075L (cg-RX-API-DMAC10.html)
PL (1) PL207297B1 (cg-RX-API-DMAC10.html)
RS (1) RS106104A (cg-RX-API-DMAC10.html)
TW (1) TWI330766B (cg-RX-API-DMAC10.html)
WO (1) WO2003104901A2 (cg-RX-API-DMAC10.html)
ZA (1) ZA200409622B (cg-RX-API-DMAC10.html)

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US20080149884A1 (en) * 2006-12-21 2008-06-26 Junaid Ahmed Siddiqui Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing
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CN101901784B (zh) * 2010-07-21 2012-05-30 河北工业大学 钽化学机械抛光工序中的表面清洗方法
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CN103958640B (zh) * 2011-10-21 2016-05-18 安格斯公司 无胺cmp后组合物及其使用方法
CN103809394B (zh) * 2012-11-12 2019-12-31 安集微电子科技（上海）股份有限公司 一种去除光阻蚀刻残留物的清洗液
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EP3719105B1 (en) 2013-12-06 2023-09-27 Fujifilm Electronic Materials USA, Inc. Cleaning formulation for removing residues on surfaces
CN105210176B (zh) 2014-04-10 2016-09-28 三菱瓦斯化学株式会社 半导体元件的清洗用液体组合物、和半导体元件的清洗方法
US9570285B2 (en) * 2015-04-17 2017-02-14 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning composition and methods thereof
TWI705132B (zh) 2015-10-08 2020-09-21 日商三菱瓦斯化學股份有限公司 半導體元件之洗淨用液體組成物、半導體元件之洗淨方法及半導體元件之製造方法
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Also Published As

Publication number Publication date
US8906838B2 (en) 2014-12-09
JP4330529B2 (ja) 2009-09-16
IL165581A0 (en) 2006-01-15
AU2003240827A8 (en) 2003-12-22
IN2004CH02762A (cg-RX-API-DMAC10.html) 2006-02-10
CN102135735A (zh) 2011-07-27
RS106104A (sr) 2007-04-10
ZA200409622B (en) 2006-05-31
WO2003104901A2 (en) 2003-12-18
KR20050012770A (ko) 2005-02-02
BR0311830A (pt) 2005-03-29
PL207297B1 (pl) 2010-11-30
TWI330766B (en) 2010-09-21
EP1512050A2 (en) 2005-03-09
CN1659480A (zh) 2005-08-24
US20050176602A1 (en) 2005-08-11
WO2003104901A3 (en) 2004-03-18
MY142745A (en) 2010-12-31
AU2003240827A1 (en) 2003-12-22
IL165581A (en) 2009-06-15
IN2004CH02744A (cg-RX-API-DMAC10.html) 2006-02-10
KR100958068B1 (ko) 2010-05-14
JP2005529363A (ja) 2005-09-29
PL374021A1 (en) 2005-09-19
TW200401958A (en) 2004-02-01
CA2488737A1 (en) 2003-12-18

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