NL8601567A - Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat. - Google Patents
Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat. Download PDFInfo
- Publication number
- NL8601567A NL8601567A NL8601567A NL8601567A NL8601567A NL 8601567 A NL8601567 A NL 8601567A NL 8601567 A NL8601567 A NL 8601567A NL 8601567 A NL8601567 A NL 8601567A NL 8601567 A NL8601567 A NL 8601567A
- Authority
- NL
- Netherlands
- Prior art keywords
- substrate
- contact
- contact surfaces
- edge
- solder
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
- Y10T29/49213—Metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Weting (AREA)
- Manufacture Of Switches (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8601567A NL8601567A (nl) | 1986-06-17 | 1986-06-17 | Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat. |
CA000546246A CA1295461C (en) | 1986-06-17 | 1987-06-11 | Method of mounting refined contact surfaces on a substrate, and substrate provided with such contact surfaces |
EP87201127A EP0250045B1 (de) | 1986-06-17 | 1987-06-15 | Verfahren zum Montieren veredelter Kontaktflächen auf einem Substrat sowie mit diesen Kontaktflächen versehenes Substrat |
AT87201127T ATE80513T1 (de) | 1986-06-17 | 1987-06-15 | Verfahren zum montieren veredelter kontaktflaechen auf einem substrat sowie mit diesen kontaktflaechen versehenes substrat. |
US07/061,514 US4843190A (en) | 1986-06-17 | 1987-06-15 | Circuit board substrate with gold plated contact elements and a method for mounting gold plated contact elements to the substrate |
DE8787201127T DE3781596T2 (de) | 1986-06-17 | 1987-06-15 | Verfahren zum montieren veredelter kontaktflaechen auf einem substrat sowie mit diesen kontaktflaechen versehenes substrat. |
KR1019870006087A KR880001183A (ko) | 1986-06-17 | 1987-06-16 | 기판 표면에 접촉면들을 붙이는 방법과 그 기관 |
BR8703027A BR8703027A (pt) | 1986-06-17 | 1987-06-16 | Processo para montar superficies de contacto sobre uma superficie de um substrato;e substrato tendo uma pluralidade de componentes montados |
JP62148140A JP2980608B2 (ja) | 1986-06-17 | 1987-06-16 | 回路基板の表面上にコンタクト部材を装着する方法およびその回路基板 |
AU74419/87A AU592880B2 (en) | 1986-06-17 | 1987-06-17 | Method of mounting refined contact surfaces on a substrate, and substrate, provided with such contact surfaces |
SG1062/92A SG106292G (en) | 1986-06-17 | 1992-10-13 | Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces |
HK1051/92A HK105192A (en) | 1986-06-17 | 1992-12-24 | Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8601567 | 1986-06-17 | ||
NL8601567A NL8601567A (nl) | 1986-06-17 | 1986-06-17 | Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat. |
Publications (1)
Publication Number | Publication Date |
---|---|
NL8601567A true NL8601567A (nl) | 1988-01-18 |
Family
ID=19848178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL8601567A NL8601567A (nl) | 1986-06-17 | 1986-06-17 | Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat. |
Country Status (12)
Country | Link |
---|---|
US (1) | US4843190A (de) |
EP (1) | EP0250045B1 (de) |
JP (1) | JP2980608B2 (de) |
KR (1) | KR880001183A (de) |
AT (1) | ATE80513T1 (de) |
AU (1) | AU592880B2 (de) |
BR (1) | BR8703027A (de) |
CA (1) | CA1295461C (de) |
DE (1) | DE3781596T2 (de) |
HK (1) | HK105192A (de) |
NL (1) | NL8601567A (de) |
SG (1) | SG106292G (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3843528C1 (de) * | 1988-12-23 | 1990-05-23 | Schoeller & Co Elektronik Gmbh, 3552 Wetter, De | |
GB2236217A (en) * | 1989-08-23 | 1991-03-27 | Itt Ind Ltd | Improvement relating to electrical connectors |
EP0443275B1 (de) * | 1990-01-19 | 1994-09-28 | The Whitaker Corporation | Elektrisches Kantenkontaktelement und Verfahren zur Herstellung |
KR100253171B1 (ko) * | 1992-06-02 | 2000-04-15 | 구자홍 | 데이타 오류정정 방법 및 회로 |
DE19621001A1 (de) * | 1996-05-24 | 1997-11-27 | Heraeus Sensor Nite Gmbh | Sensoranordnung zur Temperaturmessung und Verfahren zur Herstellung der Anordnung |
WO1997046060A1 (fr) * | 1996-05-31 | 1997-12-04 | Rohm Co., Ltd. | Procede de montage d'une borne sur une plaquette de circuit et plaquette de circuit |
ES2177447B1 (es) * | 2000-12-29 | 2004-08-16 | Lear Automotive (Eeds) Spain, S.L. | Circuito electronico con terminales de conexion integrados y metodo para su fabricacion. |
US10653440B2 (en) * | 2005-04-15 | 2020-05-19 | Cook Medical Technologies Llc | Tip for lead extraction device |
JP2006047325A (ja) * | 2005-10-24 | 2006-02-16 | Toshiba Corp | 自動分析装置 |
DE102010010331A1 (de) * | 2010-03-04 | 2011-09-08 | Phoenix Contact Gmbh & Co. Kg | Elektrische Kontaktanordnung |
US8677617B2 (en) * | 2010-04-28 | 2014-03-25 | International Business Machines Corporation | Printed circuit board edge connector |
JP4620179B2 (ja) * | 2010-06-30 | 2011-01-26 | 株式会社東芝 | 自動分析装置 |
CN203056159U (zh) * | 2012-12-13 | 2013-07-10 | 富士康(昆山)电脑接插件有限公司 | 卡缘连接器 |
KR101522367B1 (ko) * | 2014-12-24 | 2015-05-22 | (주) 메가테크 | 테이프 제조 장치 |
US11674976B2 (en) * | 2018-12-14 | 2023-06-13 | Alcatera Inc. | Scanning probe microscope with a sample holder fed with electromagnetic wave signals |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3396461A (en) * | 1962-12-04 | 1968-08-13 | Engelhard Ind Inc | Printed circuit board and method of manufacture thereof |
GB1375997A (de) * | 1970-12-31 | 1974-12-04 | ||
US3869787A (en) * | 1973-01-02 | 1975-03-11 | Honeywell Inf Systems | Method for precisely aligning circuit devices coarsely positioned on a substrate |
JPS50140885A (de) * | 1974-05-02 | 1975-11-12 | ||
US3964666A (en) * | 1975-03-31 | 1976-06-22 | Western Electric Company, Inc. | Bonding contact members to circuit boards |
US4132341A (en) * | 1977-01-31 | 1979-01-02 | Zenith Radio Corporation | Hybrid circuit connector assembly |
JPS5921854B2 (ja) * | 1978-09-06 | 1984-05-22 | 大塚製薬株式会社 | 11−メチル−シス−9−12−トリデカジエニルアセテ−ト |
JPS5951672B2 (ja) * | 1978-09-26 | 1984-12-15 | 三菱電機株式会社 | 点火制御装置 |
JPS5819472U (ja) * | 1981-07-30 | 1983-02-05 | 東光株式会社 | 電子回路モジユ−ル |
GB2110204A (en) * | 1981-11-26 | 1983-06-15 | Isc Chemicals Ltd | Perfluoro(alkylcyclohexane) mixtures for use in vapour soldering |
GB2134338B (en) * | 1983-01-26 | 1986-07-16 | Int Computers Ltd | Soldering integrated-circuit package to p.c.b |
JPS6135593A (ja) * | 1984-07-28 | 1986-02-20 | 有限会社 インタ−フエイス技術研究所 | プリント配線基板の接合方法 |
US4728023A (en) * | 1986-01-22 | 1988-03-01 | Mcdonnell Douglas Corporation | Rosin-free solder composition |
-
1986
- 1986-06-17 NL NL8601567A patent/NL8601567A/nl not_active Application Discontinuation
-
1987
- 1987-06-11 CA CA000546246A patent/CA1295461C/en not_active Expired - Lifetime
- 1987-06-15 AT AT87201127T patent/ATE80513T1/de not_active IP Right Cessation
- 1987-06-15 DE DE8787201127T patent/DE3781596T2/de not_active Expired - Fee Related
- 1987-06-15 EP EP87201127A patent/EP0250045B1/de not_active Expired - Lifetime
- 1987-06-15 US US07/061,514 patent/US4843190A/en not_active Expired - Fee Related
- 1987-06-16 KR KR1019870006087A patent/KR880001183A/ko not_active Application Discontinuation
- 1987-06-16 BR BR8703027A patent/BR8703027A/pt unknown
- 1987-06-16 JP JP62148140A patent/JP2980608B2/ja not_active Expired - Lifetime
- 1987-06-17 AU AU74419/87A patent/AU592880B2/en not_active Ceased
-
1992
- 1992-10-13 SG SG1062/92A patent/SG106292G/en unknown
- 1992-12-24 HK HK1051/92A patent/HK105192A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
JPS63114085A (ja) | 1988-05-18 |
JP2980608B2 (ja) | 1999-11-22 |
EP0250045A1 (de) | 1987-12-23 |
AU7441987A (en) | 1987-12-24 |
AU592880B2 (en) | 1990-01-25 |
ATE80513T1 (de) | 1992-09-15 |
SG106292G (en) | 1992-12-24 |
BR8703027A (pt) | 1988-03-08 |
US4843190A (en) | 1989-06-27 |
DE3781596T2 (de) | 1993-04-15 |
HK105192A (en) | 1992-12-31 |
KR880001183A (ko) | 1988-03-31 |
CA1295461C (en) | 1992-02-11 |
DE3781596D1 (de) | 1992-10-15 |
EP0250045B1 (de) | 1992-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A1B | A search report has been drawn up | ||
BV | The patent application has lapsed |