NL8601567A - Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat. - Google Patents

Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat. Download PDF

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Publication number
NL8601567A
NL8601567A NL8601567A NL8601567A NL8601567A NL 8601567 A NL8601567 A NL 8601567A NL 8601567 A NL8601567 A NL 8601567A NL 8601567 A NL8601567 A NL 8601567A NL 8601567 A NL8601567 A NL 8601567A
Authority
NL
Netherlands
Prior art keywords
substrate
contact
contact surfaces
edge
solder
Prior art date
Application number
NL8601567A
Other languages
English (en)
Dutch (nl)
Original Assignee
Du Pont Nederland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont Nederland filed Critical Du Pont Nederland
Priority to NL8601567A priority Critical patent/NL8601567A/nl
Priority to CA000546246A priority patent/CA1295461C/en
Priority to DE8787201127T priority patent/DE3781596T2/de
Priority to AT87201127T priority patent/ATE80513T1/de
Priority to US07/061,514 priority patent/US4843190A/en
Priority to EP87201127A priority patent/EP0250045B1/de
Priority to KR1019870006087A priority patent/KR880001183A/ko
Priority to BR8703027A priority patent/BR8703027A/pt
Priority to JP62148140A priority patent/JP2980608B2/ja
Priority to AU74419/87A priority patent/AU592880B2/en
Publication of NL8601567A publication Critical patent/NL8601567A/nl
Priority to SG1062/92A priority patent/SG106292G/en
Priority to HK1051/92A priority patent/HK105192A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
    • Y10T29/49213—Metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Weting (AREA)
  • Manufacture Of Switches (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
NL8601567A 1986-06-17 1986-06-17 Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat. NL8601567A (nl)

Priority Applications (12)

Application Number Priority Date Filing Date Title
NL8601567A NL8601567A (nl) 1986-06-17 1986-06-17 Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat.
CA000546246A CA1295461C (en) 1986-06-17 1987-06-11 Method of mounting refined contact surfaces on a substrate, and substrate provided with such contact surfaces
EP87201127A EP0250045B1 (de) 1986-06-17 1987-06-15 Verfahren zum Montieren veredelter Kontaktflächen auf einem Substrat sowie mit diesen Kontaktflächen versehenes Substrat
AT87201127T ATE80513T1 (de) 1986-06-17 1987-06-15 Verfahren zum montieren veredelter kontaktflaechen auf einem substrat sowie mit diesen kontaktflaechen versehenes substrat.
US07/061,514 US4843190A (en) 1986-06-17 1987-06-15 Circuit board substrate with gold plated contact elements and a method for mounting gold plated contact elements to the substrate
DE8787201127T DE3781596T2 (de) 1986-06-17 1987-06-15 Verfahren zum montieren veredelter kontaktflaechen auf einem substrat sowie mit diesen kontaktflaechen versehenes substrat.
KR1019870006087A KR880001183A (ko) 1986-06-17 1987-06-16 기판 표면에 접촉면들을 붙이는 방법과 그 기관
BR8703027A BR8703027A (pt) 1986-06-17 1987-06-16 Processo para montar superficies de contacto sobre uma superficie de um substrato;e substrato tendo uma pluralidade de componentes montados
JP62148140A JP2980608B2 (ja) 1986-06-17 1987-06-16 回路基板の表面上にコンタクト部材を装着する方法およびその回路基板
AU74419/87A AU592880B2 (en) 1986-06-17 1987-06-17 Method of mounting refined contact surfaces on a substrate, and substrate, provided with such contact surfaces
SG1062/92A SG106292G (en) 1986-06-17 1992-10-13 Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces
HK1051/92A HK105192A (en) 1986-06-17 1992-12-24 Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8601567 1986-06-17
NL8601567A NL8601567A (nl) 1986-06-17 1986-06-17 Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat.

Publications (1)

Publication Number Publication Date
NL8601567A true NL8601567A (nl) 1988-01-18

Family

ID=19848178

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8601567A NL8601567A (nl) 1986-06-17 1986-06-17 Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat.

Country Status (12)

Country Link
US (1) US4843190A (de)
EP (1) EP0250045B1 (de)
JP (1) JP2980608B2 (de)
KR (1) KR880001183A (de)
AT (1) ATE80513T1 (de)
AU (1) AU592880B2 (de)
BR (1) BR8703027A (de)
CA (1) CA1295461C (de)
DE (1) DE3781596T2 (de)
HK (1) HK105192A (de)
NL (1) NL8601567A (de)
SG (1) SG106292G (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3843528C1 (de) * 1988-12-23 1990-05-23 Schoeller & Co Elektronik Gmbh, 3552 Wetter, De
GB2236217A (en) * 1989-08-23 1991-03-27 Itt Ind Ltd Improvement relating to electrical connectors
EP0443275B1 (de) * 1990-01-19 1994-09-28 The Whitaker Corporation Elektrisches Kantenkontaktelement und Verfahren zur Herstellung
KR100253171B1 (ko) * 1992-06-02 2000-04-15 구자홍 데이타 오류정정 방법 및 회로
DE19621001A1 (de) * 1996-05-24 1997-11-27 Heraeus Sensor Nite Gmbh Sensoranordnung zur Temperaturmessung und Verfahren zur Herstellung der Anordnung
WO1997046060A1 (fr) * 1996-05-31 1997-12-04 Rohm Co., Ltd. Procede de montage d'une borne sur une plaquette de circuit et plaquette de circuit
ES2177447B1 (es) * 2000-12-29 2004-08-16 Lear Automotive (Eeds) Spain, S.L. Circuito electronico con terminales de conexion integrados y metodo para su fabricacion.
US10653440B2 (en) * 2005-04-15 2020-05-19 Cook Medical Technologies Llc Tip for lead extraction device
JP2006047325A (ja) * 2005-10-24 2006-02-16 Toshiba Corp 自動分析装置
DE102010010331A1 (de) * 2010-03-04 2011-09-08 Phoenix Contact Gmbh & Co. Kg Elektrische Kontaktanordnung
US8677617B2 (en) * 2010-04-28 2014-03-25 International Business Machines Corporation Printed circuit board edge connector
JP4620179B2 (ja) * 2010-06-30 2011-01-26 株式会社東芝 自動分析装置
CN203056159U (zh) * 2012-12-13 2013-07-10 富士康(昆山)电脑接插件有限公司 卡缘连接器
KR101522367B1 (ko) * 2014-12-24 2015-05-22 (주) 메가테크 테이프 제조 장치
US11674976B2 (en) * 2018-12-14 2023-06-13 Alcatera Inc. Scanning probe microscope with a sample holder fed with electromagnetic wave signals

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3396461A (en) * 1962-12-04 1968-08-13 Engelhard Ind Inc Printed circuit board and method of manufacture thereof
GB1375997A (de) * 1970-12-31 1974-12-04
US3869787A (en) * 1973-01-02 1975-03-11 Honeywell Inf Systems Method for precisely aligning circuit devices coarsely positioned on a substrate
JPS50140885A (de) * 1974-05-02 1975-11-12
US3964666A (en) * 1975-03-31 1976-06-22 Western Electric Company, Inc. Bonding contact members to circuit boards
US4132341A (en) * 1977-01-31 1979-01-02 Zenith Radio Corporation Hybrid circuit connector assembly
JPS5921854B2 (ja) * 1978-09-06 1984-05-22 大塚製薬株式会社 １１−メチル−シス−９−１２−トリデカジエニルアセテ−ト
JPS5951672B2 (ja) * 1978-09-26 1984-12-15 三菱電機株式会社 点火制御装置
JPS5819472U (ja) * 1981-07-30 1983-02-05 東光株式会社 電子回路モジユ−ル
GB2110204A (en) * 1981-11-26 1983-06-15 Isc Chemicals Ltd Perfluoro(alkylcyclohexane) mixtures for use in vapour soldering
GB2134338B (en) * 1983-01-26 1986-07-16 Int Computers Ltd Soldering integrated-circuit package to p.c.b
JPS6135593A (ja) * 1984-07-28 1986-02-20 有限会社　インタ−フエイス技術研究所 プリント配線基板の接合方法
US4728023A (en) * 1986-01-22 1988-03-01 Mcdonnell Douglas Corporation Rosin-free solder composition

Also Published As

Publication number Publication date
JPS63114085A (ja) 1988-05-18
JP2980608B2 (ja) 1999-11-22
EP0250045A1 (de) 1987-12-23
AU7441987A (en) 1987-12-24
AU592880B2 (en) 1990-01-25
ATE80513T1 (de) 1992-09-15
SG106292G (en) 1992-12-24
BR8703027A (pt) 1988-03-08
US4843190A (en) 1989-06-27
DE3781596T2 (de) 1993-04-15
HK105192A (en) 1992-12-31
KR880001183A (ko) 1988-03-31
CA1295461C (en) 1992-02-11
DE3781596D1 (de) 1992-10-15
EP0250045B1 (de) 1992-09-09

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A1B A search report has been drawn up
BV The patent application has lapsed