GB2134338B - Soldering integrated-circuit package to p.c.b - Google Patents

Soldering integrated-circuit package to p.c.b

Info

Publication number
GB2134338B
GB2134338B GB08401803A GB8401803A GB2134338B GB 2134338 B GB2134338 B GB 2134338B GB 08401803 A GB08401803 A GB 08401803A GB 8401803 A GB8401803 A GB 8401803A GB 2134338 B GB2134338 B GB 2134338B
Authority
GB
United Kingdom
Prior art keywords
circuit package
soldering integrated
soldering
integrated
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08401803A
Other versions
GB8401803D0 (en
GB2134338A (en
Inventor
Gordon Leslie Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB838302095A external-priority patent/GB8302095D0/en
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Priority to GB08401803A priority Critical patent/GB2134338B/en
Publication of GB8401803D0 publication Critical patent/GB8401803D0/en
Publication of GB2134338A publication Critical patent/GB2134338A/en
Application granted granted Critical
Publication of GB2134338B publication Critical patent/GB2134338B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63D—BOWLING GAMES, e.g. SKITTLES, BOCCE OR BOWLS; INSTALLATIONS THEREFOR; BAGATELLE OR SIMILAR GAMES; BILLIARDS
    • A63D15/00—Billiards, e.g. carom billiards or pocket billiards; Billiard tables
    • A63D2015/001—Billiards, e.g. carom billiards or pocket billiards; Billiard tables with inclination indicating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB08401803A 1983-01-26 1984-01-24 Soldering integrated-circuit package to p.c.b Expired GB2134338B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08401803A GB2134338B (en) 1983-01-26 1984-01-24 Soldering integrated-circuit package to p.c.b

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB838302095A GB8302095D0 (en) 1983-01-26 1983-01-26 Circuit assemblies
GB08401803A GB2134338B (en) 1983-01-26 1984-01-24 Soldering integrated-circuit package to p.c.b

Publications (3)

Publication Number Publication Date
GB8401803D0 GB8401803D0 (en) 1984-02-29
GB2134338A GB2134338A (en) 1984-08-08
GB2134338B true GB2134338B (en) 1986-07-16

Family

ID=26285023

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08401803A Expired GB2134338B (en) 1983-01-26 1984-01-24 Soldering integrated-circuit package to p.c.b

Country Status (1)

Country Link
GB (1) GB2134338B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8601567A (en) * 1986-06-17 1988-01-18 Du Pont Nederland METHOD FOR APPLYING REFERRED CONTACT SURFACES TO A SUBSTRATE AND SO SUBSTRATE WITH CONTACT PLATES.
GB8720352D0 (en) * 1987-08-28 1987-10-07 Polyhitech Electrical connection pin
FR2653601B1 (en) * 1989-10-20 1993-10-22 Sgs Thomson Microelectronics Sa PORTABLE ELECTRONICS CONNECTABLE TO CHIPS.
US5435060A (en) * 1993-05-20 1995-07-25 Compaq Computer Corporation Method of manufacturing a single side drive system interconnectable ink jet printhead
CN1067508C (en) * 1996-08-22 2001-06-20 英群企业股份有限公司 Method and device for fixing chip protection layer on circuit board

Also Published As

Publication number Publication date
GB8401803D0 (en) 1984-02-29
GB2134338A (en) 1984-08-08

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee