GB2134338B - Soldering integrated-circuit package to p.c.b - Google Patents
Soldering integrated-circuit package to p.c.bInfo
- Publication number
- GB2134338B GB2134338B GB08401803A GB8401803A GB2134338B GB 2134338 B GB2134338 B GB 2134338B GB 08401803 A GB08401803 A GB 08401803A GB 8401803 A GB8401803 A GB 8401803A GB 2134338 B GB2134338 B GB 2134338B
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit package
- soldering integrated
- soldering
- integrated
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- A—HUMAN NECESSITIES
- A63—SPORTS; GAMES; AMUSEMENTS
- A63D—BOWLING GAMES, e.g. SKITTLES, BOCCE OR BOWLS; INSTALLATIONS THEREFOR; BAGATELLE OR SIMILAR GAMES; BILLIARDS
- A63D15/00—Billiards, e.g. carom billiards or pocket billiards; Billiard tables
- A63D2015/001—Billiards, e.g. carom billiards or pocket billiards; Billiard tables with inclination indicating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10704—Pin grid array [PGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10871—Leads having an integral insert stop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08401803A GB2134338B (en) | 1983-01-26 | 1984-01-24 | Soldering integrated-circuit package to p.c.b |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB838302095A GB8302095D0 (en) | 1983-01-26 | 1983-01-26 | Circuit assemblies |
GB08401803A GB2134338B (en) | 1983-01-26 | 1984-01-24 | Soldering integrated-circuit package to p.c.b |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8401803D0 GB8401803D0 (en) | 1984-02-29 |
GB2134338A GB2134338A (en) | 1984-08-08 |
GB2134338B true GB2134338B (en) | 1986-07-16 |
Family
ID=26285023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08401803A Expired GB2134338B (en) | 1983-01-26 | 1984-01-24 | Soldering integrated-circuit package to p.c.b |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2134338B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8601567A (en) * | 1986-06-17 | 1988-01-18 | Du Pont Nederland | METHOD FOR APPLYING REFERRED CONTACT SURFACES TO A SUBSTRATE AND SO SUBSTRATE WITH CONTACT PLATES. |
GB8720352D0 (en) * | 1987-08-28 | 1987-10-07 | Polyhitech | Electrical connection pin |
FR2653601B1 (en) * | 1989-10-20 | 1993-10-22 | Sgs Thomson Microelectronics Sa | PORTABLE ELECTRONICS CONNECTABLE TO CHIPS. |
US5435060A (en) * | 1993-05-20 | 1995-07-25 | Compaq Computer Corporation | Method of manufacturing a single side drive system interconnectable ink jet printhead |
CN1067508C (en) * | 1996-08-22 | 2001-06-20 | 英群企业股份有限公司 | Method and device for fixing chip protection layer on circuit board |
-
1984
- 1984-01-24 GB GB08401803A patent/GB2134338B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2134338A (en) | 1984-08-08 |
GB8401803D0 (en) | 1984-02-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |