GB2134338A - Soldering integrated-circuit package to p.c.b - Google Patents

Soldering integrated-circuit package to p.c.b Download PDF

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Publication number
GB2134338A
GB2134338A GB08401803A GB8401803A GB2134338A GB 2134338 A GB2134338 A GB 2134338A GB 08401803 A GB08401803 A GB 08401803A GB 8401803 A GB8401803 A GB 8401803A GB 2134338 A GB2134338 A GB 2134338A
Authority
GB
United Kingdom
Prior art keywords
plated
holes
package
pin
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB08401803A
Other versions
GB8401803D0 (en
GB2134338B (en
Inventor
Gordon Leslie Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB838302095A external-priority patent/GB8302095D0/en
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Priority to GB08401803A priority Critical patent/GB2134338B/en
Publication of GB8401803D0 publication Critical patent/GB8401803D0/en
Publication of GB2134338A publication Critical patent/GB2134338A/en
Application granted granted Critical
Publication of GB2134338B publication Critical patent/GB2134338B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63D—BOWLING GAMES, e.g. SKITTLES, BOCCE OR BOWLS; INSTALLATIONS THEREFOR; BAGATELLE OR SIMILAR GAMES; BILLIARDS
    • A63D15/00—Billiards, e.g. carom billiards or pocket billiards; Billiard tables
    • A63D2015/001—Billiards, e.g. carom billiards or pocket billiards; Billiard tables with inclination indicating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

An integrated circuit package including a pin grid array is soldered to a printed circuit board (6). The tips (11) of the connection pins (5) of the circuit packages (1) protrude into plated- through holes (7) in the printed circuit board (6) and are soldered to the plated- through holes (7) at the side of the printed circuit board (6) adjacent the circuit package (2). The outer surface of the package (6) is preferably heated to melt solder positioned around the tips (11). <IMAGE>

Description

SPECIFICATION Improvements in or relating to circuit assemblies The present invention relates to circuit assemblies in which integrated circuit packages are mounted on to a printed circuit board.
One form of integrated circuit package comprises a body structure carrying an integrated circuit chip and having a matrix or grid of connection pins extending from a bottom surface. Such a package is known as a pin grid array package.
Pin grid array packages are conventionally connected to a printed circuit board by passing the connecting pins right through corresponding platedthrough holes in the printed circuit board and soldering the protruding parts of the pins to the holes and their associated conductive pads at the opposite face of the circuit board by applying molten soldertotheface of the board.
It is sometimes necessary to remove and replace a pin grid array package, for example, due to damage to the package incurred during the assembly of components to the printed circuit board or, at a later stage, due to malfunction of the package in use.
Difficulty has previously been experienced in removing and replacing the packages without damaging the circuit board which is usually made from an epoxy resin/glass material. The amount of heat necessary to simultaneously unsolder a plurality of pins can cause expansion of the resin resulting in circuit board damage. For example, the expansion of the resin may cause the circuit board to delaminate causing damage to the plated-through holes and their associated conductive pads. Furthermore any additional wiring on the opposite face of the circuit board which may, for example, constitute circuit modifications, is likely to be disturbed.
Attempts have previously been made to melt the solder around each connection pin individually using a heating tool and to remove the molten solder by suction. Such a technique, however, is slow, labour intensive and therefore costly and the mechanical action on the pad of the heating tool may easily cause the pad to separate due to reduced adhesion at high temperature.
It has also been proposed to alleviate damage to the circuit board by making the board from a material having a higher resistance to heat. However, such materials suffer the disadvantage of higher cost.
According to one aspect of the present invention a circuit assembly includes; a printed circuit board having a first face, a second opposite face and a pattern of plated-through holes therein extending between the first and second faces; and an integrated circuit package having a plurality of connection pins corresponding one with each of said plated-through holes, each pin having a tip at an end remote from said package, the arrangement being such that only the tip of each pin is entered into the corresponding plate-through hole at said first face of the printed circuit board and is bonded to the plated-through hole by a soldered joint.
According to another aspect of the present invention a method of manufacturing a circuit assembly includes the steps of; forming a printed circuit board having a pattern of plated-through holes therein; forming an integrated circuit package having an outer structure of heat conducting material and a plurality of connection pins extending from one surface of the structure and corresponding one with each of said plated-through holes, each pin having an end remote from said surface and shaped so that only the tip of the pin can enter into a corresponding plated-through hole; placing a quantity of solder around the tip of each connection pin; positioning the integrated circuit package on said one face so that the tip of each connection pin is in a correspond- ing plated-through hole; heating the outer structure of the circuit package, the heat being conducted through the structure to the pins to cause the solder to melt; and allowing the assembly to cool whereby the connection pins are soldered to the platedthrough holes.
According to yet another aspect of the present invention a circuit package includes; an outer structure of heat conducting material; and a plurality of connection pins extending from a surface of the structure, the pins including means operative to allow only their tips to enter plated-through holes to which they are to be soldered.
It will be understood that the arrangement allows removal and replacement of the integrated circuit package without damage to the printed circuit board because heat applied to the structure of the circuit package is conducted via the connector pins directly to the soldered joints without risk of overheating the circuit board.
A circuit assembly and a method of manufacturing the circuit assembly will now be described, by way of example, with reference to the accompanying drawing, in which: Figure 1 shows a perspective view of a pin grid array package; Figure 2 shows a sectional view of a connection between a pin of the grid array and a plated-through hole in a printed circuit board in accordance with the prior art; and Figure 3 shows a sectional view of a connection between a pin and a plated-through hole in accordance with the present invention.
Referring to Figure 1 of the drawing, a pin grid array package 1 comprises an outer body structure 2 formed from ceramic material. An integrated circuit chip (not shown) is contained in a recess 3 (shown in broken lines) in the top of the structure 2 and is sealed into the recess by a lid 4. A very large number, for example more than one hundred, connection pins 5 extend from the lower surface of the body structure 2. The connection pins 5 are connected to the integrated circuit chip by internal conductive layers (not shown). The integrated circuit chip is either wire bonded to the conductive layers or connected thereto by a so called solder bump technique.
As previously stated, in prior art devices, such as is illustrated in Figure 2 the pin grid array package 1 is connected to a printed circuit board by passing the connection pins 5 through corresponding plated through holes 7 in the printed circuit board 6 and connecting the ends of the pins 5 with solder 8 to plated-through holes 7 and their associated conductive pads 9 at the opposite face of the circuit board 6.
Parts 10 of the connection pins 5 of increased diameter and known as "upsets" are provided on some or all of the pins 5 to space the circuit package from the printed circuit board. However, due to the aforementioned disadvantages with this arrangement the novel construction of the present arrangement illustrated in Figure 3 has been devised.
Referring now to Figure 3, it will be noted that the connection pins 5 of the present arrangement are shorter than those of the prior art arrangement of Figure 2. The upsets 10 are retained but the remainder of the pin consists of a short, substantially conical tip 11. The pins 5, unlike the pins of the prior art arrangement, are connected to the platedthrough holes 7 at the upper face of the printed circuit board adjacent the circuit package by solder 12. The soldering operation is carried out by placing a solder preform, in the shape of an annulus, around each of the connection pins 5. After entering the tips 11 of the connection pins 5 into their corresponding plated-through holes 7, heat is applied to the ceramic body structure 2 of the circuit package 1.
The heat, which may be applied by any one of a number of methods, such as for example, focussed infra red radiation, hot air or a soldering iron, is conducted through the body structure 2 to the pins 5 and is effective to melt the solder preforms. Finally the assembly is allowed to cool.
It has been found in practice that soldering the connection pins to the plated-through holes atthe upper or adjacent face of the printed circuit board in this manner limits the spread into the circuit board of the heat required to melt the solder. This is of particular advantage if, at a later stage when the package is in operational use, it becomes necessary to remove and replace it due to malfunction, for example.
If such action becomes necessary, the ceramic body structure of the package is reheated, the applied heat being conducted via the connection pins to the solder 12. Due to the minimal spread of heat into the printed circuit board both the removal of a defective package and its replacement by a serviceable package can be accomplished without damage to the circuit board and without disturbing other soldered joints on the opposite face of the board.
It will be realised that the amount of heat required for this operation, and therefore the spread of the heat, may be further reduced by using a solder having a lower melting point.
It has been found that the following advantages are attained by using the described arrangement: 1. Epoxy glass, which is a relatively inexpensive material, can be used for the circuit boards without risk of being damaged.
2. Any other soldered joint or modification wires on the opposite side of the circuit board are not disturbed when the package is removed and replaced.
3. The shorter connection pins of the present arrangement make it easierto maintain the tips of the pins within the positional tolerances necessary to enable satisfactory insertion into the circuit board.
4. As the connection pins do not pass through the plated-through holes, but only enter the mouths of the holes, smaller diameter holes may be used thus allowing an increased in the area in which conductors may extend in layers of the printed circuit board.
5. Thermal expansion causing an increase in thickness of the circuit board will not impose strain on the connection pins as can occur in the prior art arrangement where the circuit board abuts the upsets 10 on one face and is soldered to the connection pins on the opposite face.
Although the circuit package is described as having more than one hundred connection pins, it will be realised that the invention is equally applicable to packages having a lesser number of pins.
It will also be realised that the body of the package, although described as being made from ceramic material, could be made from any suitable heat conducting material.

Claims (9)

1. A circuit assembly including; a printed circuit board having a first face, a second opposite face and a pattern of plated-through holes therein, extending between the first and second faces; and an integrated circuit package having a plurality of connection pins corresponding one with each of said plated-through holes, each pin having a tip at an end remote from said package, the arrangement being such that only the tip of each pin is entered into the corresponding plated-through hole at said first face of the printed circuit board and is bonded to the plated-through hole by a soldered joint.
2. A circuit assembly as claimed in Claim 1, in which the integrated circuit package includes an outer structure of heat conducting material.
3. A circuit assembly as claimed in Claim 1 or 2, in which the ends of the connection pins are substantially conical in shape and at least a part of the ends is larger than the diameter of the platedthrough holes.
4. A method of manufacturing a circuit assembly including the steps of; forming a printed circuit board having a pattern of plated-through holes therein; forming an integrated circuit package having an outer structure of heat conducting material and a plurality of connection pins extending from one surface of the structure and corresponding one with each of said plated-through holes, each pin having an end remote from said surface and shaped so that only the tip of the pin can enter into a corresponding plated-through hole; placing a quantity of solder around the tip of each connection pin, positioning the integrated circuit package on said one face so that the tip of each connection pin is in a corresponding plated-through hole; heating the outer structure of the circuit package, the heat being conducted through the structure to the pins to cause the solder to melt; and allowing the assembly to cool whereby the connection pins are soldered to the plated-through holes.
5. A method of manufacturing a circuit assembly as claimed in Claim 4 in which the solder placed around each connection pin is preformed into an annular shape.
6. A circuit package including; an outer structure of heat conducting material; and a plurality of connection pins extending from a surface of the structure, the pins including means operative to allow only their tips to enter plated-through holes to which they are to be soldered.
7. A circuit assembly constructed as hereinbefore described with reference to the accompanying drawing.
8. A method of manufacturing a circuit assembly carried out as hereinbefore described with reference to the accompanying drawing.
9. A circuit package constructed as hereinbefore described with reference to the accompanying drawing.
GB08401803A 1983-01-26 1984-01-24 Soldering integrated-circuit package to p.c.b Expired GB2134338B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08401803A GB2134338B (en) 1983-01-26 1984-01-24 Soldering integrated-circuit package to p.c.b

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB838302095A GB8302095D0 (en) 1983-01-26 1983-01-26 Circuit assemblies
GB08401803A GB2134338B (en) 1983-01-26 1984-01-24 Soldering integrated-circuit package to p.c.b

Publications (3)

Publication Number Publication Date
GB8401803D0 GB8401803D0 (en) 1984-02-29
GB2134338A true GB2134338A (en) 1984-08-08
GB2134338B GB2134338B (en) 1986-07-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
GB08401803A Expired GB2134338B (en) 1983-01-26 1984-01-24 Soldering integrated-circuit package to p.c.b

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0250045A1 (en) * 1986-06-17 1987-12-23 E.I. Du Pont De Nemours And Company Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces
GB2209253A (en) * 1987-08-28 1989-05-04 Polyhitech Electrical connection pin
EP0424262A1 (en) * 1989-10-20 1991-04-24 STMicroelectronics S.A. Portable electronics with connectable components
WO1994027825A1 (en) * 1993-05-20 1994-12-08 Compaq Computer Corporation Single side drive system interconnectable ink jet printhead and method of manufacturing the same
CN1067508C (en) * 1996-08-22 2001-06-20 英群企业股份有限公司 Method and device for fixing chip protection layer on circuit board

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0250045A1 (en) * 1986-06-17 1987-12-23 E.I. Du Pont De Nemours And Company Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces
US4843190A (en) * 1986-06-17 1989-06-27 E. I. Dupont De Nemours And Company Circuit board substrate with gold plated contact elements and a method for mounting gold plated contact elements to the substrate
GB2209253A (en) * 1987-08-28 1989-05-04 Polyhitech Electrical connection pin
EP0424262A1 (en) * 1989-10-20 1991-04-24 STMicroelectronics S.A. Portable electronics with connectable components
FR2653601A1 (en) * 1989-10-20 1991-04-26 Sgs Thomson Microelectronics PORTABLE ELECTRONICS CONNECTABLE TO CHIPS.
US5311396A (en) * 1989-10-20 1994-05-10 Sgs-Thomson Microelectronics, S.A. Smart card chip-based electronic circuit
WO1994027825A1 (en) * 1993-05-20 1994-12-08 Compaq Computer Corporation Single side drive system interconnectable ink jet printhead and method of manufacturing the same
AU684797B2 (en) * 1993-05-20 1998-01-08 Compaq Computer Corporation Single side drive system interconnectable ink jet printhead and method of manufacturing the same
CN1067508C (en) * 1996-08-22 2001-06-20 英群企业股份有限公司 Method and device for fixing chip protection layer on circuit board

Also Published As

Publication number Publication date
GB8401803D0 (en) 1984-02-29
GB2134338B (en) 1986-07-16

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PCNP Patent ceased through non-payment of renewal fee