EP0250045B1 - Verfahren zum Montieren veredelter Kontaktflächen auf einem Substrat sowie mit diesen Kontaktflächen versehenes Substrat - Google Patents

Verfahren zum Montieren veredelter Kontaktflächen auf einem Substrat sowie mit diesen Kontaktflächen versehenes Substrat Download PDF

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Publication number
EP0250045B1
EP0250045B1 EP87201127A EP87201127A EP0250045B1 EP 0250045 B1 EP0250045 B1 EP 0250045B1 EP 87201127 A EP87201127 A EP 87201127A EP 87201127 A EP87201127 A EP 87201127A EP 0250045 B1 EP0250045 B1 EP 0250045B1
Authority
EP
European Patent Office
Prior art keywords
substrate
edge
contact element
plated
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP87201127A
Other languages
English (en)
French (fr)
Other versions
EP0250045A1 (de
Inventor
Laurentius Maria Verhoeven
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont de Nemours Nederland BV
EIDP Inc
Original Assignee
DuPont de Nemours Nederland BV
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DuPont de Nemours Nederland BV, EI Du Pont de Nemours and Co filed Critical DuPont de Nemours Nederland BV
Priority to AT87201127T priority Critical patent/ATE80513T1/de
Publication of EP0250045A1 publication Critical patent/EP0250045A1/de
Application granted granted Critical
Publication of EP0250045B1 publication Critical patent/EP0250045B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
    • Y10T29/49213—Metal

Definitions

  • the present invention relates to a method of mounting flat contact elements on a substrate.
  • the invention furthermore relates to such a substrate provided with said flat contact elements.
  • a substrate having components and strip connectors on one surface to form a plurality of separate contacting fingers or surfaces.
  • a contact element or overlay is bonded on each of said contacting surfaces along the edge of said substrate.
  • Said overlay has a composite structure consisting of various layers.
  • Onto the copper base layer of said contact finger a solder layer is applied.
  • First a bimetallic strip is produced respectively consisting of a copper and nickel layer.
  • a solder layer is applied to the open surface of the copper layer and thereafter the nickel layer is gold-plated with the preferred thickness of gold.
  • the resulting strip is slit into narrow ribbons from which the total overlays or contact elements are stamped and attached to the finger.
  • the substrates therefore have plug-in edges which are provided with contact surfaces.
  • these contact surfaces should be gripped by an edge connector with the smallest possible spring or clamp force. Otherwise, rapid wear may occur or excessive force will be required to make the plug-in connection.
  • the present invention solves the problems mentioned above by providing a method by which it is possible to mount noble metal plated contact elements on a plug-in edge of a substrate in such a manner that very little spring and clamp force is required to enable them to be gripped by an edge connector.
  • the invention also thereby provides a substrate with such refined contact elements.
  • solder paste mixed with adhesive is used for holding the components, mentioned in the introduction, in place for further processing.
  • the adhesive and the solder paste may be applied separately in the form of two separate substances.
  • infrared radiation is then applied in such a manner that the resulting induced heat melts the solder particles in the adhesive, thus bringing about an electrical connection between component and substrate.
  • heat inducted by infrared radiation it is also possible to use other heat sources.
  • a liquid suitable for the purpose such as an inert fluorinated compound, which has a high evaporation temperature of, for example, 210°C.
  • the resulting layer of heat of evaporation directly above the boiling liquid is used to solder the aforesaid components and/or contact elements to the appropiate adhesive surfaces on the substrates.
  • the components and contact elements intended for this purpose, which have to soldered to these soldering or adhesive surfaces, are all obviously resistant to high temperatures.
  • both the components and the noble metal plated contact elements are soldered in one process run to the appropiate adhesive surfaces with the aid of heat from infrared radiation or heat of the aforenoted evaporation method, a controlled edge contact element will be obtained.
  • the contact element has a relatively low weight, the surface tension of the solder flux, e.g. resin or tin, at the bottom side will have a predominant action in the soldering process.
  • the contact element or tag will thus center itself, with a resultant equilibrium of forces, during this fastening.
  • the contact element includes a bent inserting edge, which engages the substrate edge and through which a self-centering action, directed away from the substrate edge, comes about resulting from the surface tension of the solder flux.
  • the prefabricated contact elements and also the other components for the substrate are fed in a carrier band to the substrate units, which are likewise moved along on a carrier band.
  • the contact element is taken from the band and then placed on the appropriate soldering surface on the substrate.
  • the substrate is then moved into an infrared radiation area or into the layer of the heat of evaporation of the liquid boiling beneath it.
  • Figure 1 is a cross-sectional view of a substrate 1 which is provided with contact elements 2, each having a bent inserting side 13, and which cooperates with a corresponding edge connector 3.
  • the engagement between the edge connector 3 and the substrate 1 must be made with the least possible clamp or spring force in order to avoid wear and unnecessary plug-in force, while still achieving an excellent electrical connection.
  • Figure 2 shows a view in perspective of the manner in which a pick-up and positioning machine 4 picks up a contact element 2 from a band 6, which runs over a roller 11. Prefabricated contact elements 2 are embedded in band 6 at regular intervals. A protective band 7 is unwound from band 6 by means of a roller 12, so that the contact elements 2 are exposed. The pick-up and positioning machine 4 then picks up and places each contact element 2 on an adhesive or soldering surface 10 near the edge of the substrate 1.
  • each of the contact elements 2 embedded in band 6 consists of a small, tight tag, which has a bent inserting side 13.
  • Each contact element 2 is plated with a noble metal, f.i. gold plated, on its contact or upper side 8 and is activated at its bottom side 9, f.i. tin plated, etched, or provided with a solder flux.
  • solder paste mixed with adhesive is applied onto the soldering or adhesive surfaces 10 along the edge of substrate 1.
  • the solder and adhesive may be applied separately on each adhesive surface 10. It is also possible for the above-noted components to be placed on the substrate 1 by means of another or the same pick-up and positioning machine.
  • the substrate 1 is then subjected to infrared radiation or it is passed along the layer of heat of evaporation of a liquid boiling underneath it. Since the weight of the contact element 2 is very slight, the surface tension of the liquid tin on the bottom side 9 of the contact element is predominant. The contact element, therefore, will have a self-centering action during soldering.
  • the bent inserting side 13, which engages the substrate edge, plays an important role as indicated in figure 5.
  • Figures 5a, 5b and 5c give a cross-sectional view, a front view and a plan view respectively of a contact element 2 having a bent inserting side 13 on a soldering pad 10 of the substrate 1.
  • the contact element floats on the liquid solder, f.i. tin.
  • the forces F1, F2, F3, F4 come about.
  • a centering force component directed away from the substrate edge, develops which component urges the bent inserting side 13 against the substrate edge and which centers the contact element 2 onto the soldering pad 10.
  • the numeral 14 indicates a portion of the solder joint.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Weting (AREA)
  • Manufacture Of Switches (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Claims (7)

  1. Verfahren zum Anbringen von flachen Kontaktelementen (2) auf einem Substrat (1), welches darin eingebettete Bandverbinder umfaßt, um eine Mehrzahl von gesonderten Kontaktflächen zu bilden, wobei ein vorgefertigtes Kontaktelement auf die jeweiligen Kontaktflächen gelegt wird, jedes Kontaktelement eine obere Fläche (8), die mit einem Edelmetall plattiert ist, und eine Bodenfläche (9) hat, welche mit einer Kontaktfläche (10) zu verbinden ist, und wobei Wärme zur Herstellung der Verbindung aufgebracht wird, bei dem vor der Verbindung eine Lötmittelpaste und ein Klebstoff auf die jeweilige Kontaktfläche aufgebracht wird, welche am Rand des Substrats zur Bildung einer Steckverbindung liegt, und bei dem jedes Kontaktelement auf der Bodenfläche aktiviert wird, beispielsweise mit Zinn plattiert wird, bei dem jedes Kontaktelement einen gebogenen Einschubrand (13), welcher mit dem Substratrand zusammenarbeitet und ein geringes Gewicht hat, aufweist, so daß auf das Kontaktelement wirkende Kräfte infolge der Oberflächenspannung der Lötmittelpaste eine Selbstzentrierung bewirken, und der gebogene Einschubrand gegen den Substratrand gedrückt wird.
  2. Verfahren nach Anspruch 1, bei dem das Lötmittel und der Klebstoff vermischt werden, bevor sie auf die jeweilige Kontaktfläche aufgebracht werden.
  3. Verfahren nach Anspruch 1, bei dem das Lötmittel und der Klebstoff gesondert auf die jeweilige Kontaktfläche aufgebracht werden.
  4. Verfahren nach Anspruch 1, bei dem man die aufgebrachte Wärme dadurch erhält, daß man das Substrat einer Infrarotbestrahlung aussetzt.
  5. Verfahren nach Anspruch 1, bei dem die aufgebrachte Wärme dadurch erhalten wird, daß das Substrat über einer siedenden Flüssigkeit, wie einer inerten fluorierten Verbindung geführt wird, welche eine Wärmeverdampfungsschicht oberhalb der Flüssigkeit bereitstellt, durch die das Substrat geht.
  6. Substrat (1), welches eine Mehrzahl von Komponenten hat, die auf einer Seite des Substrats angebracht sind, wobei die Komponenten durch eine Mehrzahl von darin eingebetteten Streifenleitern verbunden sind, um eine Mehrzahl von gesonderten Kontaktflächen auf wenigstens einer Fläche des Substrats zu bilden, welche sich längs eines Randes des Substrats erstrecken, wobei das Substrat ferner eine Mehrzahl von Kontaktelementen (2) aufweist, welche jeweils gesondert an einer Kontaktfläche angelötet sind und eine obere Fläche (8) haben, die mit einem Edelmetall plattiert ist, bei dem jedes Kontaktelement eine aktivierte (beispielsweise mit Zinn plattierte) Bodenfläche (9) und ein geringes Gewicht hat, und einen gebogenen Einschubrand (13) umfaßt, welcher mit dem Rand des Substrats zusammenarbeitet.
  7. Substrat nach Anspruch 6, bei dem die obere Fläche des jeweiligen Kontaktelements mit Gold plattiert ist und bei dem die Bodenfläche des jeweiligen Kontaktelements mit Zinn plattiert ist.
EP87201127A 1986-06-17 1987-06-15 Verfahren zum Montieren veredelter Kontaktflächen auf einem Substrat sowie mit diesen Kontaktflächen versehenes Substrat Expired - Lifetime EP0250045B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT87201127T ATE80513T1 (de) 1986-06-17 1987-06-15 Verfahren zum montieren veredelter kontaktflaechen auf einem substrat sowie mit diesen kontaktflaechen versehenes substrat.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8601567 1986-06-17
NL8601567A NL8601567A (nl) 1986-06-17 1986-06-17 Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat.

Publications (2)

Publication Number Publication Date
EP0250045A1 EP0250045A1 (de) 1987-12-23
EP0250045B1 true EP0250045B1 (de) 1992-09-09

Family

ID=19848178

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87201127A Expired - Lifetime EP0250045B1 (de) 1986-06-17 1987-06-15 Verfahren zum Montieren veredelter Kontaktflächen auf einem Substrat sowie mit diesen Kontaktflächen versehenes Substrat

Country Status (12)

Country Link
US (1) US4843190A (de)
EP (1) EP0250045B1 (de)
JP (1) JP2980608B2 (de)
KR (1) KR880001183A (de)
AT (1) ATE80513T1 (de)
AU (1) AU592880B2 (de)
BR (1) BR8703027A (de)
CA (1) CA1295461C (de)
DE (1) DE3781596T2 (de)
HK (1) HK105192A (de)
NL (1) NL8601567A (de)
SG (1) SG106292G (de)

Families Citing this family (15)

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Publication number Priority date Publication date Assignee Title
DE3843528C1 (de) * 1988-12-23 1990-05-23 Schoeller & Co Elektronik Gmbh, 3552 Wetter, De
GB2236217A (en) * 1989-08-23 1991-03-27 Itt Ind Ltd Improvement relating to electrical connectors
EP0443275B1 (de) * 1990-01-19 1994-09-28 The Whitaker Corporation Elektrisches Kantenkontaktelement und Verfahren zur Herstellung
KR100253171B1 (ko) * 1992-06-02 2000-04-15 구자홍 데이타 오류정정 방법 및 회로
DE19621001A1 (de) * 1996-05-24 1997-11-27 Heraeus Sensor Nite Gmbh Sensoranordnung zur Temperaturmessung und Verfahren zur Herstellung der Anordnung
WO1997046060A1 (fr) * 1996-05-31 1997-12-04 Rohm Co., Ltd. Procede de montage d'une borne sur une plaquette de circuit et plaquette de circuit
ES2177447B1 (es) * 2000-12-29 2004-08-16 Lear Automotive (Eeds) Spain, S.L. Circuito electronico con terminales de conexion integrados y metodo para su fabricacion.
US10653440B2 (en) * 2005-04-15 2020-05-19 Cook Medical Technologies Llc Tip for lead extraction device
JP2006047325A (ja) * 2005-10-24 2006-02-16 Toshiba Corp 自動分析装置
DE102010010331A1 (de) * 2010-03-04 2011-09-08 Phoenix Contact Gmbh & Co. Kg Elektrische Kontaktanordnung
US8677617B2 (en) * 2010-04-28 2014-03-25 International Business Machines Corporation Printed circuit board edge connector
JP4620179B2 (ja) * 2010-06-30 2011-01-26 株式会社東芝 自動分析装置
CN203056159U (zh) * 2012-12-13 2013-07-10 富士康(昆山)电脑接插件有限公司 卡缘连接器
KR101522367B1 (ko) * 2014-12-24 2015-05-22 (주) 메가테크 테이프 제조 장치
US11674976B2 (en) * 2018-12-14 2023-06-13 Alcatera Inc. Scanning probe microscope with a sample holder fed with electromagnetic wave signals

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US3396461A (en) * 1962-12-04 1968-08-13 Engelhard Ind Inc Printed circuit board and method of manufacture thereof
GB1375997A (de) * 1970-12-31 1974-12-04
US3869787A (en) * 1973-01-02 1975-03-11 Honeywell Inf Systems Method for precisely aligning circuit devices coarsely positioned on a substrate
JPS50140885A (de) * 1974-05-02 1975-11-12
US3964666A (en) * 1975-03-31 1976-06-22 Western Electric Company, Inc. Bonding contact members to circuit boards
US4132341A (en) * 1977-01-31 1979-01-02 Zenith Radio Corporation Hybrid circuit connector assembly
JPS5921854B2 (ja) * 1978-09-06 1984-05-22 大塚製薬株式会社 １１−メチル−シス−９−１２−トリデカジエニルアセテ−ト
JPS5951672B2 (ja) * 1978-09-26 1984-12-15 三菱電機株式会社 点火制御装置
JPS5819472U (ja) * 1981-07-30 1983-02-05 東光株式会社 電子回路モジユ−ル
GB2110204A (en) * 1981-11-26 1983-06-15 Isc Chemicals Ltd Perfluoro(alkylcyclohexane) mixtures for use in vapour soldering
GB2134338B (en) * 1983-01-26 1986-07-16 Int Computers Ltd Soldering integrated-circuit package to p.c.b
JPS6135593A (ja) * 1984-07-28 1986-02-20 有限会社　インタ−フエイス技術研究所 プリント配線基板の接合方法
US4728023A (en) * 1986-01-22 1988-03-01 Mcdonnell Douglas Corporation Rosin-free solder composition

Also Published As

Publication number Publication date
JPS63114085A (ja) 1988-05-18
JP2980608B2 (ja) 1999-11-22
EP0250045A1 (de) 1987-12-23
AU7441987A (en) 1987-12-24
AU592880B2 (en) 1990-01-25
ATE80513T1 (de) 1992-09-15
SG106292G (en) 1992-12-24
BR8703027A (pt) 1988-03-08
US4843190A (en) 1989-06-27
NL8601567A (nl) 1988-01-18
DE3781596T2 (de) 1993-04-15
HK105192A (en) 1992-12-31
KR880001183A (ko) 1988-03-31
CA1295461C (en) 1992-02-11
DE3781596D1 (de) 1992-10-15

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