KR880001183A - 기판 표면에 접촉면들을 붙이는 방법과 그 기관 - Google Patents

기판 표면에 접촉면들을 붙이는 방법과 그 기관 Download PDF

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Publication number
KR880001183A
KR880001183A KR1019870006087A KR870006087A KR880001183A KR 880001183 A KR880001183 A KR 880001183A KR 1019870006087 A KR1019870006087 A KR 1019870006087A KR 870006087 A KR870006087 A KR 870006087A KR 880001183 A KR880001183 A KR 880001183A
Authority
KR
South Korea
Prior art keywords
substrate
solder
contact element
edge
adhesive
Prior art date
Application number
KR1019870006087A
Other languages
English (en)
Inventor
마리아 패르회벤 라우렌티우스
Original Assignee
원본미기재
이 아이 듀우판 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 원본미기재, 이 아이 듀우판 디 네모아 앤드 캄파니 filed Critical 원본미기재
Publication of KR880001183A publication Critical patent/KR880001183A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
    • Y10T29/49213—Metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Weting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Switches (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

내용 없음

Description

기판 표면에 접촉면들을 붙이는 방법과 그 기관
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 연부에 접촉면들이 있는 기판과 그 반대쪽에 있는 연부 커넥터의 단면도. 제2도는 픽업 및 위치 고정 장치가 접촉면을 집어 원하는 기판 위에 놓는 방식을 나타내는 사시도. 제3도는 밴드 지지면의 일부를 확대한 사시도.

Claims (9)

  1. 기판에 매립된 스트립 도체들에 땜납 페이스트 및 접착제를 발라 다수의 별도 납땜 표면들을 형성하는 단계, 윗면이 정려되어 있고 밑면이 활성화되어 있으며 활성화된 밑면이 상기 납땜 표면과 접촉하고 있는 각각의 조립식 접촉 요소를 상기 각 납땜 표면위에 놓는 단계. 접착제 내의 땜납 입자들을 녹이도록 열을 가해 각 접촉요소와 그 각자의 스트립 도체 사이에 전기접속을 제공하는 단계로 구성되는, 기판의 표면에 접촉면들을 붙이는 방법.
  2. 제1항에 있어서, 땜납과 접착제가 각 납땜 표면에 발라지기 전에 함께 혼합되는 방법.
  3. 제1항에 있어서, 땜납과 접착제가 각 납땜 표면에 별도로 발라지는 방법.
  4. 제1항에 있어서, 기판이 적외방사선을 받음으로써 상기 가해진 열이 얻어지는 방법.
  5. 제1항에 있어서, 불활성 불소와 화합물과 같은 비등하는 액체위로 기판을 통과시킴으로써 상기 가해진 열이 얻어지고, 기판이 통과하는 비등 액체위에는 증발열 층이 제공되는 방법.
  6. 제1항에 있어서, 매립된 스트립 도체들의 끝에는 다수의 납땜 표면들이 기판의 연부를 따라 배치되고, 납땜 표면위에 납땜된 접촉요소들이 연부 커넥터와 결합하기 위한 플러그 - 인(plug-in)연부를 제공하도록 되어 있는 방법.
  7. 다수의 스트립 도체들로 상호연결된 다수의 부품들이 한쪽면에 붙어있는 기판으로서, 기판의 한 연부를 따라 다수의 접촉요소들이 있고, 각 접촉요소가 한 스트립 도체의 끝에 따라 납땜되고, 각 접촉요소의 윗면이 정련되고 밑면이 활성화되고, 각 접촉요소의 활성화된 밑면이 접착제와 혼합된 땜납과 열의 적용에 의해 각 스트립 도체의 상기 끝에 납땜되는 기판.
  8. 제7항에 있어서, 각 접촉 요소의 정련된 윗면이 금으로 도금되고, 각 접촉요소의 활성화된 밑면의 주석으로 도금되는 기판.
  9. 제7항에 있어서, 각 접촉요소에는 기판의 연부와 결합하는 구부러진 삽입측이 있는 기판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870006087A 1986-06-17 1987-06-16 기판 표면에 접촉면들을 붙이는 방법과 그 기관 KR880001183A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8601567A NL8601567A (nl) 1986-06-17 1986-06-17 Werkwijze voor het aanbrengen van veredelde contactvlakken op een substraat, en aldus van contactvlakken voorzien substraat.
NL8601567 1986-06-17

Publications (1)

Publication Number Publication Date
KR880001183A true KR880001183A (ko) 1988-03-31

Family

ID=19848178

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870006087A KR880001183A (ko) 1986-06-17 1987-06-16 기판 표면에 접촉면들을 붙이는 방법과 그 기관

Country Status (12)

Country Link
US (1) US4843190A (ko)
EP (1) EP0250045B1 (ko)
JP (1) JP2980608B2 (ko)
KR (1) KR880001183A (ko)
AT (1) ATE80513T1 (ko)
AU (1) AU592880B2 (ko)
BR (1) BR8703027A (ko)
CA (1) CA1295461C (ko)
DE (1) DE3781596T2 (ko)
HK (1) HK105192A (ko)
NL (1) NL8601567A (ko)
SG (1) SG106292G (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100253171B1 (ko) * 1992-06-02 2000-04-15 구자홍 데이타 오류정정 방법 및 회로
KR101522367B1 (ko) * 2014-12-24 2015-05-22 (주) 메가테크 테이프 제조 장치

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* Cited by examiner, † Cited by third party
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DE3843528C1 (ko) * 1988-12-23 1990-05-23 Schoeller & Co Elektronik Gmbh, 3552 Wetter, De
GB2236217A (en) * 1989-08-23 1991-03-27 Itt Ind Ltd Improvement relating to electrical connectors
DE69012980T2 (de) * 1990-01-19 1995-05-11 Whitaker Corp Elektrisches Kantenkontaktelement und Verfahren zur Herstellung.
DE19621001A1 (de) * 1996-05-24 1997-11-27 Heraeus Sensor Nite Gmbh Sensoranordnung zur Temperaturmessung und Verfahren zur Herstellung der Anordnung
US6225573B1 (en) * 1996-05-31 2001-05-01 Rohm Co., Ltd. Method for mounting terminal on circuit board and circuit board
ES2177447B1 (es) * 2000-12-29 2004-08-16 Lear Automotive (Eeds) Spain, S.L. Circuito electronico con terminales de conexion integrados y metodo para su fabricacion.
US10653440B2 (en) * 2005-04-15 2020-05-19 Cook Medical Technologies Llc Tip for lead extraction device
JP2006047325A (ja) * 2005-10-24 2006-02-16 Toshiba Corp 自動分析装置
DE102010010331A1 (de) * 2010-03-04 2011-09-08 Phoenix Contact Gmbh & Co. Kg Elektrische Kontaktanordnung
US8677617B2 (en) 2010-04-28 2014-03-25 International Business Machines Corporation Printed circuit board edge connector
JP4620179B2 (ja) * 2010-06-30 2011-01-26 株式会社東芝 自動分析装置
CN203056159U (zh) * 2012-12-13 2013-07-10 富士康(昆山)电脑接插件有限公司 卡缘连接器
US11674976B2 (en) * 2018-12-14 2023-06-13 Alcatera Inc. Scanning probe microscope with a sample holder fed with electromagnetic wave signals
US11605608B2 (en) * 2019-11-11 2023-03-14 Infineon Technologies Austria Ag Preform diffusion soldering

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US3396461A (en) * 1962-12-04 1968-08-13 Engelhard Ind Inc Printed circuit board and method of manufacture thereof
GB1375997A (ko) * 1970-12-31 1974-12-04
US3869787A (en) * 1973-01-02 1975-03-11 Honeywell Inf Systems Method for precisely aligning circuit devices coarsely positioned on a substrate
JPS50140885A (ko) * 1974-05-02 1975-11-12
US3964666A (en) * 1975-03-31 1976-06-22 Western Electric Company, Inc. Bonding contact members to circuit boards
US4132341A (en) * 1977-01-31 1979-01-02 Zenith Radio Corporation Hybrid circuit connector assembly
JPS5921854B2 (ja) * 1978-09-06 1984-05-22 大塚製薬株式会社 １１−メチル−シス−９−１２−トリデカジエニルアセテ−ト
JPS5951672B2 (ja) * 1978-09-26 1984-12-15 三菱電機株式会社 点火制御装置
JPS5819472U (ja) * 1981-07-30 1983-02-05 東光株式会社 電子回路モジユ−ル
GB2110204A (en) * 1981-11-26 1983-06-15 Isc Chemicals Ltd Perfluoro(alkylcyclohexane) mixtures for use in vapour soldering
GB2134338B (en) * 1983-01-26 1986-07-16 Int Computers Ltd Soldering integrated-circuit package to p.c.b
JPS6135593A (ja) * 1984-07-28 1986-02-20 有限会社　インタ−フエイス技術研究所 プリント配線基板の接合方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100253171B1 (ko) * 1992-06-02 2000-04-15 구자홍 데이타 오류정정 방법 및 회로
KR101522367B1 (ko) * 2014-12-24 2015-05-22 (주) 메가테크 테이프 제조 장치

Also Published As

Publication number Publication date
CA1295461C (en) 1992-02-11
SG106292G (en) 1992-12-24
DE3781596T2 (de) 1993-04-15
EP0250045A1 (en) 1987-12-23
US4843190A (en) 1989-06-27
JPS63114085A (ja) 1988-05-18
ATE80513T1 (de) 1992-09-15
JP2980608B2 (ja) 1999-11-22
AU592880B2 (en) 1990-01-25
HK105192A (en) 1992-12-31
DE3781596D1 (de) 1992-10-15
BR8703027A (pt) 1988-03-08
NL8601567A (nl) 1988-01-18
AU7441987A (en) 1987-12-24
EP0250045B1 (en) 1992-09-09

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