DK163465C - Kontaktering af en paa et substrat optaget mikroboelgekobling - Google Patents

Kontaktering af en paa et substrat optaget mikroboelgekobling

Info

Publication number
DK163465C
DK163465C DK559685A DK559685A DK163465C DK 163465 C DK163465 C DK 163465C DK 559685 A DK559685 A DK 559685A DK 559685 A DK559685 A DK 559685A DK 163465 C DK163465 C DK 163465C
Authority
DK
Denmark
Prior art keywords
substrate
microwave
contacting
metal frame
substrates
Prior art date
Application number
DK559685A
Other languages
English (en)
Other versions
DK559685A (da
DK163465B (da
DK559685D0 (da
Inventor
Wolfgang Schiller
Original Assignee
Ant Nachrichtentech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ant Nachrichtentech filed Critical Ant Nachrichtentech
Publication of DK559685D0 publication Critical patent/DK559685D0/da
Publication of DK559685A publication Critical patent/DK559685A/da
Publication of DK163465B publication Critical patent/DK163465B/da
Application granted granted Critical
Publication of DK163465C publication Critical patent/DK163465C/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides
DK559685A 1984-12-04 1985-12-03 Kontaktering af en paa et substrat optaget mikroboelgekobling DK163465C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19843444076 DE3444076A1 (de) 1984-12-04 1984-12-04 Kontaktierung einer auf einem substrat angeordneten mikrowellenschaltung
DE3444076 1984-12-04

Publications (4)

Publication Number Publication Date
DK559685D0 DK559685D0 (da) 1985-12-03
DK559685A DK559685A (da) 1986-06-05
DK163465B DK163465B (da) 1992-03-02
DK163465C true DK163465C (da) 1992-07-20

Family

ID=6251787

Family Applications (1)

Application Number Title Priority Date Filing Date
DK559685A DK163465C (da) 1984-12-04 1985-12-03 Kontaktering af en paa et substrat optaget mikroboelgekobling

Country Status (4)

Country Link
EP (1) EP0183916B1 (da)
AT (1) ATE42431T1 (da)
DE (2) DE3444076A1 (da)
DK (1) DK163465C (da)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5402088A (en) * 1992-12-03 1995-03-28 Ail Systems, Inc. Apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2456367A1 (de) * 1971-05-10 1976-08-12 Siemens Ag Traegerplatte mit einer gedruckten schaltung
US4042952A (en) * 1976-06-09 1977-08-16 Motorola, Inc. R. F. power transistor device with controlled common lead inductance
US4242157A (en) * 1979-04-20 1980-12-30 Rockwell International Corporation Method of assembly of microwave integrated circuits having a structurally continuous ground plane
US4326180A (en) * 1979-11-05 1982-04-20 Microphase Corporation Microwave backdiode microcircuits and method of making

Also Published As

Publication number Publication date
ATE42431T1 (de) 1989-05-15
DE3569638D1 (en) 1989-05-24
DK559685A (da) 1986-06-05
EP0183916A1 (de) 1986-06-11
DE3444076A1 (de) 1986-06-05
DK163465B (da) 1992-03-02
DK559685D0 (da) 1985-12-03
EP0183916B1 (de) 1989-04-19

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Legal Events

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