DK559685A - Kontaktering af en paa et substrat optaget mikroboelgekobling - Google Patents
Kontaktering af en paa et substrat optaget mikroboelgekobling Download PDFInfo
- Publication number
- DK559685A DK559685A DK559685A DK559685A DK559685A DK 559685 A DK559685 A DK 559685A DK 559685 A DK559685 A DK 559685A DK 559685 A DK559685 A DK 559685A DK 559685 A DK559685 A DK 559685A
- Authority
- DK
- Denmark
- Prior art keywords
- substrate
- microwave
- contacting
- metal frame
- substrates
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/085—Coaxial-line/strip-line transitions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6616—Vertical connections, e.g. vias
- H01L2223/6622—Coaxial feed-throughs in active or passive substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Control Of High-Frequency Heating Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19843444076 DE3444076A1 (de) | 1984-12-04 | 1984-12-04 | Kontaktierung einer auf einem substrat angeordneten mikrowellenschaltung |
DE3444076 | 1984-12-04 |
Publications (4)
Publication Number | Publication Date |
---|---|
DK559685D0 DK559685D0 (da) | 1985-12-03 |
DK559685A true DK559685A (da) | 1986-06-05 |
DK163465B DK163465B (da) | 1992-03-02 |
DK163465C DK163465C (da) | 1992-07-20 |
Family
ID=6251787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK559685A DK163465C (da) | 1984-12-04 | 1985-12-03 | Kontaktering af en paa et substrat optaget mikroboelgekobling |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0183916B1 (da) |
AT (1) | ATE42431T1 (da) |
DE (2) | DE3444076A1 (da) |
DK (1) | DK163465C (da) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5402088A (en) * | 1992-12-03 | 1995-03-28 | Ail Systems, Inc. | Apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2456367A1 (de) * | 1971-05-10 | 1976-08-12 | Siemens Ag | Traegerplatte mit einer gedruckten schaltung |
US4042952A (en) * | 1976-06-09 | 1977-08-16 | Motorola, Inc. | R. F. power transistor device with controlled common lead inductance |
US4242157A (en) * | 1979-04-20 | 1980-12-30 | Rockwell International Corporation | Method of assembly of microwave integrated circuits having a structurally continuous ground plane |
US4326180A (en) * | 1979-11-05 | 1982-04-20 | Microphase Corporation | Microwave backdiode microcircuits and method of making |
-
1984
- 1984-12-04 DE DE19843444076 patent/DE3444076A1/de not_active Withdrawn
-
1985
- 1985-08-09 EP EP85110058A patent/EP0183916B1/de not_active Expired
- 1985-08-09 DE DE8585110058T patent/DE3569638D1/de not_active Expired
- 1985-08-09 AT AT85110058T patent/ATE42431T1/de not_active IP Right Cessation
- 1985-12-03 DK DK559685A patent/DK163465C/da not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE3569638D1 (en) | 1989-05-24 |
DK163465C (da) | 1992-07-20 |
EP0183916A1 (de) | 1986-06-11 |
DK163465B (da) | 1992-03-02 |
ATE42431T1 (de) | 1989-05-15 |
DK559685D0 (da) | 1985-12-03 |
EP0183916B1 (de) | 1989-04-19 |
DE3444076A1 (de) | 1986-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PBP | Patent lapsed |