NL8105387A - Inkapseling voor een geintegreerd halfgeleiderplaatje. - Google Patents

Inkapseling voor een geintegreerd halfgeleiderplaatje. Download PDF

Info

Publication number
NL8105387A
NL8105387A NL8105387A NL8105387A NL8105387A NL 8105387 A NL8105387 A NL 8105387A NL 8105387 A NL8105387 A NL 8105387A NL 8105387 A NL8105387 A NL 8105387A NL 8105387 A NL8105387 A NL 8105387A
Authority
NL
Netherlands
Prior art keywords
members
contact
guide members
encapsulation
semiconductor wafer
Prior art date
Application number
NL8105387A
Other languages
English (en)
Dutch (nl)
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of NL8105387A publication Critical patent/NL8105387A/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Packaging Frangible Articles (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
NL8105387A 1980-11-28 1981-11-27 Inkapseling voor een geintegreerd halfgeleiderplaatje. NL8105387A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/210,776 US4331831A (en) 1980-11-28 1980-11-28 Package for semiconductor integrated circuits
US21077680 1980-11-28

Publications (1)

Publication Number Publication Date
NL8105387A true NL8105387A (nl) 1982-06-16

Family

ID=22784223

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8105387A NL8105387A (nl) 1980-11-28 1981-11-27 Inkapseling voor een geintegreerd halfgeleiderplaatje.

Country Status (11)

Country Link
US (1) US4331831A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS57117264A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
BE (1) BE891258A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA1168764A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3146796A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2495377A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB2088635B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
HK (1) HK6886A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT1139839B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (1) NL8105387A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
SE (1) SE8106859L (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4616412A (en) * 1981-01-13 1986-10-14 Schroeder Jon M Method for bonding electrical leads to electronic devices
US4438181A (en) 1981-01-13 1984-03-20 Jon M. Schroeder Electronic component bonding tape
US4399610A (en) * 1981-04-01 1983-08-23 Western Electric Company, Inc. Assembling an electronic device
US4466183A (en) * 1982-05-03 1984-08-21 National Semiconductor Corporation Integrated circuit packaging process
US4750031A (en) * 1982-06-25 1988-06-07 The United States Of America As Represented By The United States National Aeronautics And Space Administration Hermetically sealable package for hybrid solid-state electronic devices and the like
US4563811A (en) * 1983-10-28 1986-01-14 At&T Technologies, Inc. Method of making a dual-in-line package
US4751199A (en) * 1983-12-06 1988-06-14 Fairchild Semiconductor Corporation Process of forming a compliant lead frame for array-type semiconductor packages
US4754912A (en) * 1984-04-05 1988-07-05 National Semiconductor Corporation Controlled collapse thermocompression gang bonding
ATE45837T1 (de) * 1984-05-02 1989-09-15 Gte Prod Corp Verfahren zur herstellung eines leiterrahmentraegers fuer ein ic-plaettchen.
IT1213259B (it) * 1984-12-18 1989-12-14 Sgs Thomson Microelectronics Gruppo a telaio di conduttori per circuiti integrati con capacita' di termodispersione incrementata, erelativo procedimento.
CA1238119A (en) * 1985-04-18 1988-06-14 Douglas W. Phelps, Jr. Packaged semiconductor chip
US4747017A (en) * 1986-05-27 1988-05-24 General Motors Corporation Surface mountable integrated circuit package equipped with sockets
US4740868A (en) * 1986-08-22 1988-04-26 Motorola Inc. Rail bonded multi-chip leadframe, method and package
US4747483A (en) * 1986-10-08 1988-05-31 Amp Incorporated Protective chip carrier handler
JPH07120743B2 (ja) * 1988-07-07 1995-12-20 株式会社三井ハイテック 半導体装置用リードフレーム
US5084753A (en) * 1989-01-23 1992-01-28 Analog Devices, Inc. Packaging for multiple chips on a single leadframe
US5021864A (en) * 1989-09-05 1991-06-04 Micron Technology, Inc. Die-mounting paddle for mechanical stress reduction in plastic IC packages
JP2816244B2 (ja) * 1990-07-11 1998-10-27 株式会社日立製作所 積層型マルチチップ半導体装置およびこれに用いる半導体装置
JP2744685B2 (ja) * 1990-08-08 1998-04-28 三菱電機株式会社 半導体装置
JP2745933B2 (ja) * 1992-02-17 1998-04-28 日本電気株式会社 Ｔａｂ−集積回路
US5210939A (en) * 1992-04-17 1993-05-18 Intel Corporation Lead grid array integrated circuit
US5396032A (en) * 1993-05-04 1995-03-07 Alcatel Network Systems, Inc. Method and apparatus for providing electrical access to devices in a multi-chip module
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
DE19530577B4 (de) * 1995-08-19 2005-03-10 Conti Temic Microelectronic Gehäuse für mikroelektronische Bauelemente und Verfahren zu seiner Herstellung
US5585670A (en) * 1995-09-05 1996-12-17 Mitsubishi Electric Semiconductor Software Co. Semiconductor device package
JPH11145364A (ja) * 1997-11-12 1999-05-28 Denso Corp 樹脂封止型半導体装置及びその製造方法
US6141869A (en) 1998-10-26 2000-11-07 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier
US6307258B1 (en) 1998-12-22 2001-10-23 Silicon Bandwidth, Inc. Open-cavity semiconductor die package
US6437464B1 (en) 1999-07-29 2002-08-20 Encap Motor Corporation Motor and disc assembly for computer hard drive
US6753628B1 (en) 1999-07-29 2004-06-22 Encap Motor Corporation High speed spindle motor for disc drive
US6300695B1 (en) 1999-07-29 2001-10-09 Encap Motor Corporation High speed spindle motor with hydrodynamic bearings
US6362554B1 (en) 1999-07-29 2002-03-26 Encap Motor Corporation Stator assembly
US6617721B1 (en) 1999-07-29 2003-09-09 Encap Motor Corporation High speed spindle motor
US6501616B1 (en) 1999-07-29 2002-12-31 Encap Motor Corporation Hard disc drive with base incorporating a spindle motor stator
US6844636B2 (en) 1999-12-17 2005-01-18 Encap Motor Corporation Spindle motor with encapsulated stator and method of making same
US6892439B1 (en) 2001-02-01 2005-05-17 Encap Motor Corporation Motor with stator made from linear core preform
US7036207B2 (en) 2001-03-02 2006-05-02 Encap Motor Corporation Stator assembly made from a plurality of toroidal core segments and motor using same
DE10139001A1 (de) * 2001-08-15 2003-03-13 Siemens Ag Zeigerinstrument
FR3020186A1 (fr) * 2014-08-08 2015-10-23 Commissariat Energie Atomique Connecteur pour la connexion entre un composant et un support, comportant une embase munie d'un relief

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2328798A1 (de) * 1972-06-23 1974-01-17 Philips Nv Halbleiteranordnung
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
DE2253295A1 (de) * 1972-10-31 1974-05-16 Licentia Gmbh Halbleiteranordnung
US3859718A (en) * 1973-01-02 1975-01-14 Texas Instruments Inc Method and apparatus for the assembly of semiconductor devices
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
US3968563A (en) * 1975-03-27 1976-07-13 E. I. Du Pont De Nemours And Company Precision registration system for leads
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
US4210926A (en) * 1977-12-07 1980-07-01 Siemens Aktiengesellschaft Intermediate member for mounting and contacting a semiconductor body
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
JPS55103753A (en) * 1979-02-05 1980-08-08 Hitachi Ltd Electronic component
FR2456390A1 (fr) * 1979-05-11 1980-12-05 Thomson Csf Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier
DE2931339A1 (de) * 1979-08-02 1981-02-19 Barth Sicherheitsgurt-ergaenzung in kraftfahrzeugen
JPS5694762A (en) * 1979-12-28 1981-07-31 Fujitsu Ltd Plug-in type package

Also Published As

Publication number Publication date
FR2495377B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1984-11-16
BE891258A (fr) 1982-03-16
IT1139839B (it) 1986-09-24
DE3146796A1 (de) 1982-06-16
CA1168764A (en) 1984-06-05
GB2088635B (en) 1984-08-15
IT8125264A0 (it) 1981-11-24
HK6886A (en) 1986-02-07
GB2088635A (en) 1982-06-09
FR2495377A1 (fr) 1982-06-04
US4331831A (en) 1982-05-25
JPS57117264A (en) 1982-07-21
SE8106859L (sv) 1982-05-29

Similar Documents

Publication Publication Date Title
NL8105387A (nl) Inkapseling voor een geintegreerd halfgeleiderplaatje.
US5650914A (en) Compliant thermal connectors, methods of making the same and assemblies incorporating the same
US5286679A (en) Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer
US5864173A (en) Multi-layer lead frame
US5681777A (en) Process for manufacturing a multi-layer tab tape semiconductor device
EP0071423A2 (en) Packages for enclosing semiconductor elements
US6555755B1 (en) Flexible interconnecting substrate and method of manufacturing the same, film carrier, tape-shaped semiconductor device, semiconductor device, circuit board, and electronic equipment
EP0500750A1 (en) METHOD FOR HOUSING AN ELECTRONIC DEVICE ADHESIVE BY ADHESIVE TAPE AND HOUSING USED.
WO1996016532A9 (en) Compliant thermal connectors, methods and assemblies
US4635093A (en) Electrical connection
US20090011548A1 (en) Hybrid integrated circuit device and manufacturing method thereof
US5956232A (en) Chip support arrangement and chip support for the manufacture of a chip casing
US6078104A (en) Carrier film and integrated circuit device using the same and method of making the same
US5854085A (en) Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
US6171888B1 (en) Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
US7199455B2 (en) Molded resin semiconductor device having exposed semiconductor chip electrodes
EP0474224B1 (en) Semiconductor device comprising a plurality of semiconductor chips
JPS61279141A (ja) 可撓性テ−パリ−ドを有したリ−ドフレ−ムと機械的ダイ支持体の直接接続装置及び方法
EP0723293A1 (en) Semiconductor device with a heat sink and method of producing the heat sink
JP2725694B2 (ja) 半導体装置用パッケージ
EP0526147B1 (en) Film-carrier type semiconductor device and process for fabricating the same
KR102531703B1 (ko) 반도체 패키지 기판 및 반도체 패키지 기판의 제조방법, 반도체 패키지
JPS5827354A (ja) 集積回路用キャリア
JPS6366959A (ja) 多重リ−ドフレ−ム
JP3214507B2 (ja) 電子部品、電子回路素子搭載用基板及びその製造方法

Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
A85 Still pending on 85-01-01
BV The patent application has lapsed