HK6886A - Encapsulation for semiconductor integrated circuit chip - Google Patents

Encapsulation for semiconductor integrated circuit chip

Info

Publication number
HK6886A
HK6886A HK68/86A HK6886A HK6886A HK 6886 A HK6886 A HK 6886A HK 68/86 A HK68/86 A HK 68/86A HK 6886 A HK6886 A HK 6886A HK 6886 A HK6886 A HK 6886A
Authority
HK
Hong Kong
Prior art keywords
encapsulation
integrated circuit
semiconductor integrated
circuit chip
chip
Prior art date
Application number
HK68/86A
Other languages
English (en)
Inventor
Arthur James Ingram
Irving Weingrod
Original Assignee
At & T Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Technologies Inc filed Critical At & T Technologies Inc
Publication of HK6886A publication Critical patent/HK6886A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Packaging Frangible Articles (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
HK68/86A 1980-11-28 1986-01-30 Encapsulation for semiconductor integrated circuit chip HK6886A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/210,776 US4331831A (en) 1980-11-28 1980-11-28 Package for semiconductor integrated circuits

Publications (1)

Publication Number Publication Date
HK6886A true HK6886A (en) 1986-02-07

Family

ID=22784223

Family Applications (1)

Application Number Title Priority Date Filing Date
HK68/86A HK6886A (en) 1980-11-28 1986-01-30 Encapsulation for semiconductor integrated circuit chip

Country Status (11)

Country Link
US (1) US4331831A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS57117264A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
BE (1) BE891258A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA1168764A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3146796A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2495377A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB2088635B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
HK (1) HK6886A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT1139839B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (1) NL8105387A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
SE (1) SE8106859L (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (41)

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US4438181A (en) 1981-01-13 1984-03-20 Jon M. Schroeder Electronic component bonding tape
US4399610A (en) * 1981-04-01 1983-08-23 Western Electric Company, Inc. Assembling an electronic device
US4466183A (en) * 1982-05-03 1984-08-21 National Semiconductor Corporation Integrated circuit packaging process
US4750031A (en) * 1982-06-25 1988-06-07 The United States Of America As Represented By The United States National Aeronautics And Space Administration Hermetically sealable package for hybrid solid-state electronic devices and the like
US4563811A (en) * 1983-10-28 1986-01-14 At&T Technologies, Inc. Method of making a dual-in-line package
US4751199A (en) * 1983-12-06 1988-06-14 Fairchild Semiconductor Corporation Process of forming a compliant lead frame for array-type semiconductor packages
US4754912A (en) * 1984-04-05 1988-07-05 National Semiconductor Corporation Controlled collapse thermocompression gang bonding
ATE45837T1 (de) * 1984-05-02 1989-09-15 Gte Prod Corp Verfahren zur herstellung eines leiterrahmentraegers fuer ein ic-plaettchen.
IT1213259B (it) * 1984-12-18 1989-12-14 Sgs Thomson Microelectronics Gruppo a telaio di conduttori per circuiti integrati con capacita' di termodispersione incrementata, erelativo procedimento.
CA1238119A (en) * 1985-04-18 1988-06-14 Douglas W. Phelps, Jr. Packaged semiconductor chip
US4747017A (en) * 1986-05-27 1988-05-24 General Motors Corporation Surface mountable integrated circuit package equipped with sockets
US4740868A (en) * 1986-08-22 1988-04-26 Motorola Inc. Rail bonded multi-chip leadframe, method and package
US4747483A (en) * 1986-10-08 1988-05-31 Amp Incorporated Protective chip carrier handler
JPH07120743B2 (ja) * 1988-07-07 1995-12-20 株式会社三井ハイテック 半導体装置用リードフレーム
US5084753A (en) * 1989-01-23 1992-01-28 Analog Devices, Inc. Packaging for multiple chips on a single leadframe
US5021864A (en) * 1989-09-05 1991-06-04 Micron Technology, Inc. Die-mounting paddle for mechanical stress reduction in plastic IC packages
JP2816244B2 (ja) * 1990-07-11 1998-10-27 株式会社日立製作所 積層型マルチチップ半導体装置およびこれに用いる半導体装置
JP2744685B2 (ja) * 1990-08-08 1998-04-28 三菱電機株式会社 半導体装置
JP2745933B2 (ja) * 1992-02-17 1998-04-28 日本電気株式会社 Ｔａｂ−集積回路
US5210939A (en) * 1992-04-17 1993-05-18 Intel Corporation Lead grid array integrated circuit
US5396032A (en) * 1993-05-04 1995-03-07 Alcatel Network Systems, Inc. Method and apparatus for providing electrical access to devices in a multi-chip module
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
DE19530577B4 (de) * 1995-08-19 2005-03-10 Conti Temic Microelectronic Gehäuse für mikroelektronische Bauelemente und Verfahren zu seiner Herstellung
US5585670A (en) * 1995-09-05 1996-12-17 Mitsubishi Electric Semiconductor Software Co. Semiconductor device package
JPH11145364A (ja) * 1997-11-12 1999-05-28 Denso Corp 樹脂封止型半導体装置及びその製造方法
US6141869A (en) 1998-10-26 2000-11-07 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier
US6307258B1 (en) 1998-12-22 2001-10-23 Silicon Bandwidth, Inc. Open-cavity semiconductor die package
US6437464B1 (en) 1999-07-29 2002-08-20 Encap Motor Corporation Motor and disc assembly for computer hard drive
US6753628B1 (en) 1999-07-29 2004-06-22 Encap Motor Corporation High speed spindle motor for disc drive
US6300695B1 (en) 1999-07-29 2001-10-09 Encap Motor Corporation High speed spindle motor with hydrodynamic bearings
US6362554B1 (en) 1999-07-29 2002-03-26 Encap Motor Corporation Stator assembly
US6617721B1 (en) 1999-07-29 2003-09-09 Encap Motor Corporation High speed spindle motor
US6501616B1 (en) 1999-07-29 2002-12-31 Encap Motor Corporation Hard disc drive with base incorporating a spindle motor stator
US6844636B2 (en) 1999-12-17 2005-01-18 Encap Motor Corporation Spindle motor with encapsulated stator and method of making same
US6892439B1 (en) 2001-02-01 2005-05-17 Encap Motor Corporation Motor with stator made from linear core preform
US7036207B2 (en) 2001-03-02 2006-05-02 Encap Motor Corporation Stator assembly made from a plurality of toroidal core segments and motor using same
DE10139001A1 (de) * 2001-08-15 2003-03-13 Siemens Ag Zeigerinstrument
FR3020186A1 (fr) * 2014-08-08 2015-10-23 Commissariat Energie Atomique Connecteur pour la connexion entre un composant et un support, comportant une embase munie d'un relief

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2328798A1 (de) * 1972-06-23 1974-01-17 Philips Nv Halbleiteranordnung
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
DE2253295A1 (de) * 1972-10-31 1974-05-16 Licentia Gmbh Halbleiteranordnung
US3859718A (en) * 1973-01-02 1975-01-14 Texas Instruments Inc Method and apparatus for the assembly of semiconductor devices
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
US3968563A (en) * 1975-03-27 1976-07-13 E. I. Du Pont De Nemours And Company Precision registration system for leads
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
US4210926A (en) * 1977-12-07 1980-07-01 Siemens Aktiengesellschaft Intermediate member for mounting and contacting a semiconductor body
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
JPS55103753A (en) * 1979-02-05 1980-08-08 Hitachi Ltd Electronic component
FR2456390A1 (fr) * 1979-05-11 1980-12-05 Thomson Csf Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier
DE2931339A1 (de) * 1979-08-02 1981-02-19 Barth Sicherheitsgurt-ergaenzung in kraftfahrzeugen
JPS5694762A (en) * 1979-12-28 1981-07-31 Fujitsu Ltd Plug-in type package

Also Published As

Publication number Publication date
FR2495377B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1984-11-16
BE891258A (fr) 1982-03-16
IT1139839B (it) 1986-09-24
DE3146796A1 (de) 1982-06-16
CA1168764A (en) 1984-06-05
GB2088635B (en) 1984-08-15
NL8105387A (nl) 1982-06-16
IT8125264A0 (it) 1981-11-24
GB2088635A (en) 1982-06-09
FR2495377A1 (fr) 1982-06-04
US4331831A (en) 1982-05-25
JPS57117264A (en) 1982-07-21
SE8106859L (sv) 1982-05-29

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