NL8102402A - Werkwijze voor de eindpuntdetectie bij een fysisch etsproces. - Google Patents

Werkwijze voor de eindpuntdetectie bij een fysisch etsproces. Download PDF

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Publication number
NL8102402A
NL8102402A NL8102402A NL8102402A NL8102402A NL 8102402 A NL8102402 A NL 8102402A NL 8102402 A NL8102402 A NL 8102402A NL 8102402 A NL8102402 A NL 8102402A NL 8102402 A NL8102402 A NL 8102402A
Authority
NL
Netherlands
Prior art keywords
current
etching
changes
measured
semiconductor wafer
Prior art date
Application number
NL8102402A
Other languages
English (en)
Dutch (nl)
Original Assignee
Varian Associates
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates filed Critical Varian Associates
Publication of NL8102402A publication Critical patent/NL8102402A/nl

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/20—Investigating the presence of flaws
    • G01N27/205—Investigating the presence of flaws in insulating materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Biochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Drying Of Semiconductors (AREA)
  • Electron Sources, Ion Sources (AREA)
  • ing And Chemical Polishing (AREA)
NL8102402A 1980-05-16 1981-05-15 Werkwijze voor de eindpuntdetectie bij een fysisch etsproces. NL8102402A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15053380 1980-05-16
US06/150,533 US4358338A (en) 1980-05-16 1980-05-16 End point detection method for physical etching process

Publications (1)

Publication Number Publication Date
NL8102402A true NL8102402A (nl) 1981-12-16

Family

ID=22534978

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8102402A NL8102402A (nl) 1980-05-16 1981-05-15 Werkwijze voor de eindpuntdetectie bij een fysisch etsproces.

Country Status (7)

Country Link
US (1) US4358338A (de)
JP (1) JPS579877A (de)
CH (1) CH652237A5 (de)
DE (1) DE3118834A1 (de)
FR (1) FR2482783A1 (de)
GB (1) GB2076330B (de)
NL (1) NL8102402A (de)

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US4564585A (en) * 1983-11-28 1986-01-14 Magnetic Peripherals, Inc. Process for fabricating negative pressure sliders
GB2150317A (en) * 1983-11-28 1985-06-26 Magnetic Peripherals Inc Process for producing negative pressure sliders using a photoresist
JPS60129181A (ja) * 1983-12-16 1985-07-10 Matsubishi Kinzoku Kogyo Kk 廃水浄化装置
JPS60243960A (ja) * 1984-05-18 1985-12-03 Hitachi Ltd イオンマイクロビ−ム装置
JP2539359B2 (ja) * 1985-03-27 1996-10-02 株式会社日立製作所 半導体装置へのイオンビ−ム加工方法およびその装置
US4602981A (en) * 1985-05-06 1986-07-29 International Business Machines Corporation Monitoring technique for plasma etching
JPH0451474Y2 (de) * 1986-05-15 1992-12-03
US4767496A (en) * 1986-12-11 1988-08-30 Siemens Aktiengesellschaft Method for controlling and supervising etching processes
CH669609A5 (de) * 1986-12-23 1989-03-31 Balzers Hochvakuum
US4810335A (en) * 1987-01-20 1989-03-07 Siemens Aktiengesellschaft Method for monitoring etching processes
JPH0630351B2 (ja) * 1987-03-31 1994-04-20 株式会社東芝 半導体製造装置のクリ−ニング終点判定方法
US5169407A (en) * 1987-03-31 1992-12-08 Kabushiki Kaisha Toshiba Method of determining end of cleaning of semiconductor manufacturing apparatus
US4793895A (en) * 1988-01-25 1988-12-27 Ibm Corporation In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection
US4879258A (en) * 1988-08-31 1989-11-07 Texas Instruments Incorporated Integrated circuit planarization by mechanical polishing
US4978626A (en) * 1988-09-02 1990-12-18 Motorola, Inc. LDD transistor process having doping sensitive endpoint etching
US4902631A (en) * 1988-10-28 1990-02-20 At&T Bell Laboratories Monitoring the fabrication of semiconductor devices by photon induced electron emission
US4980018A (en) * 1989-11-14 1990-12-25 Intel Corporation Plasma etching process for refractory metal vias
US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
US5069002A (en) * 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
US5245794A (en) * 1992-04-09 1993-09-21 Advanced Micro Devices, Inc. Audio end point detector for chemical-mechanical polishing and method therefor
KR940009496B1 (ko) * 1992-06-09 1994-10-14 주식회사금성사 다색 전계발광소자 및 제조방법
EP0616362A3 (de) * 1993-03-15 1995-06-21 Tokyo Shibaura Electric Co Verfahren zum Polieren von Werkstücken und Vorrichtung dafür.
US5793195A (en) * 1995-08-30 1998-08-11 Kaufman & Robinson, Inc. Angular distribution probe
US5609718A (en) * 1995-09-29 1997-03-11 Micron Technology, Inc. Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
US5655951A (en) * 1995-09-29 1997-08-12 Micron Technology, Inc. Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
US5777739A (en) * 1996-02-16 1998-07-07 Micron Technology, Inc. Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers
US6075606A (en) 1996-02-16 2000-06-13 Doan; Trung T. Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates
KR0179281B1 (ko) * 1996-02-28 1999-10-01 문정환 챔버를 갖는 베이퍼-에치 장치의 에치-종말점 측정방법
US6022807A (en) * 1996-04-24 2000-02-08 Micro Processing Technology, Inc. Method for fabricating an integrated circuit
US6007408A (en) * 1997-08-21 1999-12-28 Micron Technology, Inc. Method and apparatus for endpointing mechanical and chemical-mechanical polishing of substrates
US6127237A (en) * 1998-03-04 2000-10-03 Kabushiki Kaisha Toshiba Etching end point detecting method based on junction current measurement and etching apparatus
JPH11354509A (ja) 1998-04-07 1999-12-24 Seiko Epson Corp プラズマエッチングの終点検出方法及びプラズマエッチング装置
JP2000031072A (ja) * 1998-07-10 2000-01-28 Seiko Epson Corp プラズマモニタ方法及び半導体製造装置
US6287977B1 (en) 1998-07-31 2001-09-11 Applied Materials, Inc. Method and apparatus for forming improved metal interconnects
US6046111A (en) * 1998-09-02 2000-04-04 Micron Technology, Inc. Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates
US6517669B2 (en) * 1999-02-26 2003-02-11 Micron Technology, Inc. Apparatus and method of detecting endpoint of a dielectric etch
US6707540B1 (en) 1999-12-23 2004-03-16 Kla-Tencor Corporation In-situ metalization monitoring using eddy current and optical measurements
US6433541B1 (en) 1999-12-23 2002-08-13 Kla-Tencor Corporation In-situ metalization monitoring using eddy current measurements during the process for removing the film
US6340326B1 (en) 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
US6705930B2 (en) * 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6290572B1 (en) 2000-03-23 2001-09-18 Micron Technology, Inc. Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6612901B1 (en) 2000-06-07 2003-09-02 Micron Technology, Inc. Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6428386B1 (en) 2000-06-16 2002-08-06 Micron Technology, Inc. Planarizing pads, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6640155B2 (en) 2000-08-22 2003-10-28 Lam Research Corporation Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
US7481695B2 (en) 2000-08-22 2009-01-27 Lam Research Corporation Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US6585572B1 (en) 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
US6447369B1 (en) 2000-08-30 2002-09-10 Micron Technology, Inc. Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates
US6609947B1 (en) 2000-08-30 2003-08-26 Micron Technology, Inc. Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates
US6471566B1 (en) 2000-09-18 2002-10-29 Lam Research Corporation Sacrificial retaining ring CMP system and methods for implementing the same
US6443815B1 (en) 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
JP3807295B2 (ja) * 2001-11-30 2006-08-09 ソニー株式会社 研磨方法
US7341502B2 (en) 2002-07-18 2008-03-11 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US7415400B2 (en) * 2002-10-15 2008-08-19 Livermore Software Technology Corporation System, method, and device for designing a die to stamp metal parts to an exact final dimension
US7494596B2 (en) * 2003-03-21 2009-02-24 Hewlett-Packard Development Company, L.P. Measurement of etching
KR20040094560A (ko) * 2003-05-03 2004-11-10 삼성전자주식회사 반도체 소자 금속배선층의 전해 연마 방법 및 장치
US7662648B2 (en) * 2005-08-31 2010-02-16 Micron Technology, Inc. Integrated circuit inspection system
CA3125346A1 (en) * 2019-01-22 2020-07-30 Techinsights Inc. Ion beam delayering system and method, and endpoint monitoring system and method therefor
US11158786B2 (en) 2019-09-25 2021-10-26 International Business Machines Corporation MRAM device formation with controlled ion beam etch of MTJ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5258476A (en) * 1975-11-10 1977-05-13 Hitachi Ltd Method and device for etching
DE2603675A1 (de) * 1976-01-31 1977-08-04 Leybold Heraeus Gmbh & Co Kg Verfahren zur kontrolle des abtragens einer duennen schicht oder durch masken bestimmter schichtbereiche mit hilfe des ionen-aetzens
DE2651187A1 (de) * 1976-11-10 1978-05-18 Kuhlmann Schaefer Wilhelm Verfahren und vorrichtung zum abtragen von schichten
JPS5914548B2 (ja) * 1977-04-30 1984-04-05 富士通株式会社 イオンエツチング法
JPS5562169A (en) * 1978-11-01 1980-05-10 Toshiba Corp Ion-etching method

Also Published As

Publication number Publication date
US4358338A (en) 1982-11-09
CH652237A5 (de) 1985-10-31
JPS579877A (en) 1982-01-19
GB2076330B (en) 1984-09-26
DE3118834A1 (de) 1982-01-28
FR2482783A1 (fr) 1981-11-20
GB2076330A (en) 1981-12-02

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Legal Events

Date Code Title Description
A85 Still pending on 85-01-01
BV The patent application has lapsed