NL8005922A - Werkwijze voor het vormen van een draadverbinding. - Google Patents

Werkwijze voor het vormen van een draadverbinding. Download PDF

Info

Publication number
NL8005922A
NL8005922A NL8005922A NL8005922A NL8005922A NL 8005922 A NL8005922 A NL 8005922A NL 8005922 A NL8005922 A NL 8005922A NL 8005922 A NL8005922 A NL 8005922A NL 8005922 A NL8005922 A NL 8005922A
Authority
NL
Netherlands
Prior art keywords
wire
spark discharge
electrode
sphere
voltage
Prior art date
Application number
NL8005922A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8005922A priority Critical patent/NL8005922A/nl
Priority to CA000388476A priority patent/CA1178664A/en
Priority to DE3141842A priority patent/DE3141842A1/de
Priority to FR8120025A priority patent/FR2493044B1/fr
Priority to GB8132183A priority patent/GB2086297B/en
Priority to JP56170252A priority patent/JPS5916409B2/ja
Priority to BR8106902A priority patent/BR8106902A/pt
Priority to PL1981233586A priority patent/PL133893B1/pl
Priority to CH6815/81A priority patent/CH654142A5/de
Priority to DD81234387A priority patent/DD205294A5/de
Priority to ES506580A priority patent/ES8301390A1/es
Priority to BE0/206365A priority patent/BE890887A/fr
Priority to IT24731/81A priority patent/IT1139570B/it
Priority to AU76893/81A priority patent/AU546818B2/en
Priority to KR1019810004107A priority patent/KR890000585B1/ko
Publication of NL8005922A publication Critical patent/NL8005922A/nl
Priority to SG219/84A priority patent/SG21984G/en
Priority to HK408/85A priority patent/HK40885A/xx
Priority to MY623/85A priority patent/MY8500623A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
NL8005922A 1980-10-29 1980-10-29 Werkwijze voor het vormen van een draadverbinding. NL8005922A (nl)

Priority Applications (18)

Application Number Priority Date Filing Date Title
NL8005922A NL8005922A (nl) 1980-10-29 1980-10-29 Werkwijze voor het vormen van een draadverbinding.
CA000388476A CA1178664A (en) 1980-10-29 1981-10-22 Method of welding of connection wires to microcircuit contacts
DE3141842A DE3141842A1 (de) 1980-10-29 1981-10-22 Verfahren zur herstellung einer drahtverbindung
FR8120025A FR2493044B1 (fr) 1980-10-29 1981-10-26 Procede permettant de fournir une liaison par fil
GB8132183A GB2086297B (en) 1980-10-29 1981-10-26 Method of forming a wire bond
JP56170252A JPS5916409B2 (ja) 1980-10-29 1981-10-26 ワイヤボンド形成方法
BR8106902A BR8106902A (pt) 1980-10-29 1981-10-26 Processo para formar uma conexao de fio
PL1981233586A PL133893B1 (en) 1980-10-29 1981-10-26 Method of connecting with wire an electronic microcircuit to its connection conductor
CH6815/81A CH654142A5 (de) 1980-10-29 1981-10-26 Verfahren zur herstellung einer drahtverbindung.
DD81234387A DD205294A5 (de) 1980-10-29 1981-10-27 Verfahren zur herstellung einer drahtverbindung
ES506580A ES8301390A1 (es) 1980-10-29 1981-10-27 Un metodo de formar una union de alambre entre un lugar de contacto en un microcircuito electronico y un conductor de conexion
BE0/206365A BE890887A (fr) 1980-10-29 1981-10-27 Procede permettant de former une liaison par fil
IT24731/81A IT1139570B (it) 1980-10-29 1981-10-27 Metodo per formare un collegamento mediante un filo metallico
AU76893/81A AU546818B2 (en) 1980-10-29 1981-10-28 Method of forming a wire bond
KR1019810004107A KR890000585B1 (ko) 1980-10-29 1981-10-28 도선 접착법
SG219/84A SG21984G (en) 1980-10-29 1984-03-12 Method of forming a wire bond
HK408/85A HK40885A (en) 1980-10-29 1985-05-23 Method of forming a wire bond
MY623/85A MY8500623A (en) 1980-10-29 1985-12-30 Method of forming a wire bond

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8005922 1980-10-29
NL8005922A NL8005922A (nl) 1980-10-29 1980-10-29 Werkwijze voor het vormen van een draadverbinding.

Publications (1)

Publication Number Publication Date
NL8005922A true NL8005922A (nl) 1982-05-17

Family

ID=19836074

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8005922A NL8005922A (nl) 1980-10-29 1980-10-29 Werkwijze voor het vormen van een draadverbinding.

Country Status (18)

Country Link
JP (1) JPS5916409B2 (https=)
KR (1) KR890000585B1 (https=)
AU (1) AU546818B2 (https=)
BE (1) BE890887A (https=)
BR (1) BR8106902A (https=)
CA (1) CA1178664A (https=)
CH (1) CH654142A5 (https=)
DD (1) DD205294A5 (https=)
DE (1) DE3141842A1 (https=)
ES (1) ES8301390A1 (https=)
FR (1) FR2493044B1 (https=)
GB (1) GB2086297B (https=)
HK (1) HK40885A (https=)
IT (1) IT1139570B (https=)
MY (1) MY8500623A (https=)
NL (1) NL8005922A (https=)
PL (1) PL133893B1 (https=)
SG (1) SG21984G (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation
US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
US4476366A (en) * 1983-02-01 1984-10-09 Fairchild Camera & Instrument Corp. Controlled bonding wire ball formation
US4594493A (en) * 1983-07-25 1986-06-10 Fairchild Camera & Instrument Corp. Method and apparatus for forming ball bonds
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
US5628922A (en) * 1995-07-14 1997-05-13 Motorola, Inc. Electrical flame-off wand
DE29608277U1 (de) * 1996-04-30 1996-09-19 F&K Delvotec Bondtechnik GmbH, 85521 Ottobrunn Vorrichtung zum Ball-Bonden
JP2003163235A (ja) * 2001-11-29 2003-06-06 Shinkawa Ltd ワイヤボンディング装置
TWI229022B (en) * 2002-06-20 2005-03-11 Esec Trading Sa Device with electrodes for the formation of a ball at the end of a wire
CN104335338B (zh) * 2012-10-05 2017-09-26 株式会社新川 氧化防止气体吹出单元

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH568656A5 (en) * 1974-03-20 1975-10-31 Transistor Ag Welding of contact blobs to semiconductor lead wires - uses electric DC light arc of preset current strength for melting lead wire end
NL7406783A (nl) * 1974-05-21 1975-11-25 Philips Nv Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.
GB1536872A (en) * 1975-05-15 1978-12-20 Welding Inst Electrical inter-connection method and apparatus
GB1468974A (en) * 1975-05-23 1977-03-30 Ferranti Ltd Manufacture of semiconductor devices
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus

Also Published As

Publication number Publication date
BR8106902A (pt) 1982-07-13
DE3141842C2 (https=) 1990-09-20
IT8124731A0 (it) 1981-10-27
SG21984G (en) 1985-01-04
BE890887A (fr) 1982-04-27
ES506580A0 (es) 1982-11-16
ES8301390A1 (es) 1982-11-16
FR2493044B1 (fr) 1986-03-28
GB2086297A (en) 1982-05-12
JPS57102036A (en) 1982-06-24
FR2493044A1 (fr) 1982-04-30
DD205294A5 (de) 1983-12-21
MY8500623A (en) 1985-12-31
CA1178664A (en) 1984-11-27
AU7689381A (en) 1982-05-06
DE3141842A1 (de) 1982-10-21
GB2086297B (en) 1983-12-21
AU546818B2 (en) 1985-09-19
PL233586A1 (https=) 1982-05-10
CH654142A5 (de) 1986-01-31
KR830008394A (ko) 1983-11-18
KR890000585B1 (ko) 1989-03-21
IT1139570B (it) 1986-09-24
HK40885A (en) 1985-05-31
PL133893B1 (en) 1985-07-31
JPS5916409B2 (ja) 1984-04-16

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Legal Events

Date Code Title Description
A1B A search report has been drawn up
A85 Still pending on 85-01-01
BC A request for examination has been filed
BV The patent application has lapsed