NL7702814A - Halfgeleiderinrichting en werkwijze ter ver- vaardiging daarvan. - Google Patents

Halfgeleiderinrichting en werkwijze ter ver- vaardiging daarvan.

Info

Publication number
NL7702814A
NL7702814A NL7702814A NL7702814A NL7702814A NL 7702814 A NL7702814 A NL 7702814A NL 7702814 A NL7702814 A NL 7702814A NL 7702814 A NL7702814 A NL 7702814A NL 7702814 A NL7702814 A NL 7702814A
Authority
NL
Netherlands
Prior art keywords
semi
manufacturing
conductor device
conductor
Prior art date
Application number
NL7702814A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL7702814A priority Critical patent/NL7702814A/nl
Priority to DE19782809411 priority patent/DE2809411A1/de
Priority to CA298,553A priority patent/CA1102923A/en
Priority to JP2781578A priority patent/JPS53114686A/ja
Priority to GB976878A priority patent/GB1594067A/en
Priority to FR7807297A priority patent/FR2384355A1/fr
Publication of NL7702814A publication Critical patent/NL7702814A/nl
Priority to US06/126,235 priority patent/US4360823A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H01L21/7688—Filling of holes, grooves or trenches, e.g. vias, with conductive material by deposition over sacrificial masking layer, e.g. lift-off
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5283—Cross-sectional geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
NL7702814A 1977-03-16 1977-03-16 Halfgeleiderinrichting en werkwijze ter ver- vaardiging daarvan. NL7702814A (nl)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL7702814A NL7702814A (nl) 1977-03-16 1977-03-16 Halfgeleiderinrichting en werkwijze ter ver- vaardiging daarvan.
DE19782809411 DE2809411A1 (de) 1977-03-16 1978-03-04 Halbleiteranordnung und verfahren zu deren herstellung
CA298,553A CA1102923A (en) 1977-03-16 1978-03-09 Semiconductor metallisation system
JP2781578A JPS53114686A (en) 1977-03-16 1978-03-13 Semiconductor and method of producing same
GB976878A GB1594067A (en) 1977-03-16 1978-03-13 Semiconductor devices and their manufacture
FR7807297A FR2384355A1 (fr) 1977-03-16 1978-03-14 Dispositif semi-conducteur et son procede de fabrication
US06/126,235 US4360823A (en) 1977-03-16 1980-03-03 Semiconductor device having an improved multilayer wiring system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7702814A NL7702814A (nl) 1977-03-16 1977-03-16 Halfgeleiderinrichting en werkwijze ter ver- vaardiging daarvan.

Publications (1)

Publication Number Publication Date
NL7702814A true NL7702814A (nl) 1978-09-19

Family

ID=19828174

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7702814A NL7702814A (nl) 1977-03-16 1977-03-16 Halfgeleiderinrichting en werkwijze ter ver- vaardiging daarvan.

Country Status (6)

Country Link
JP (1) JPS53114686A (nl)
CA (1) CA1102923A (nl)
DE (1) DE2809411A1 (nl)
FR (1) FR2384355A1 (nl)
GB (1) GB1594067A (nl)
NL (1) NL7702814A (nl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3214991A1 (de) * 1982-04-22 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Halbleiterbaustein mit diskretem kondensator
FR2634318B1 (fr) * 1988-07-13 1992-02-21 Commissariat Energie Atomique Procede de fabrication d'une cellule de memoire integree

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL161617C (nl) * 1968-06-17 1980-02-15 Nippon Electric Co Halfgeleiderinrichting met vlak oppervlak en werkwijze voor het vervaardigen daarvan.
GB1364677A (en) * 1970-07-10 1974-08-29 Philips Electronic Associated Semiconductor devices and methods of making semiconductor devices
JPS5088980A (nl) * 1973-12-10 1975-07-17

Also Published As

Publication number Publication date
JPS53114686A (en) 1978-10-06
DE2809411A1 (de) 1978-09-21
GB1594067A (en) 1981-07-30
CA1102923A (en) 1981-06-09
FR2384355A1 (fr) 1978-10-13

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Legal Events

Date Code Title Description
BC A request for examination has been filed
BI The patent application has been withdrawn