NL1008697C2 - Testinrichting, testsamenstel, werkwijze voor testen en werkwijze voor kalibreren van een testinrichting. - Google Patents

Testinrichting, testsamenstel, werkwijze voor testen en werkwijze voor kalibreren van een testinrichting. Download PDF

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Publication number
NL1008697C2
NL1008697C2 NL1008697A NL1008697A NL1008697C2 NL 1008697 C2 NL1008697 C2 NL 1008697C2 NL 1008697 A NL1008697 A NL 1008697A NL 1008697 A NL1008697 A NL 1008697A NL 1008697 C2 NL1008697 C2 NL 1008697C2
Authority
NL
Netherlands
Prior art keywords
carrier
test
test device
tested
testing
Prior art date
Application number
NL1008697A
Other languages
English (en)
Dutch (nl)
Inventor
Willem Antonie Hennekes
Antoon Willem Pothoven
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Priority to NL1008697A priority Critical patent/NL1008697C2/nl
Priority to TW087104818A priority patent/TW363131B/zh
Priority to DE69912589T priority patent/DE69912589T2/de
Priority to EP99914799A priority patent/EP1066535B1/en
Priority to JP2000538246A priority patent/JP2002507753A/ja
Priority to KR1020007010579A priority patent/KR20010042154A/ko
Priority to PCT/NL1999/000166 priority patent/WO1999049328A1/en
Priority to US09/646,822 priority patent/US6507185B1/en
Application granted granted Critical
Publication of NL1008697C2 publication Critical patent/NL1008697C2/nl
Priority to HK01100284A priority patent/HK1030987A1/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
NL1008697A 1998-03-25 1998-03-25 Testinrichting, testsamenstel, werkwijze voor testen en werkwijze voor kalibreren van een testinrichting. NL1008697C2 (nl)

Priority Applications (9)

Application Number Priority Date Filing Date Title
NL1008697A NL1008697C2 (nl) 1998-03-25 1998-03-25 Testinrichting, testsamenstel, werkwijze voor testen en werkwijze voor kalibreren van een testinrichting.
TW087104818A TW363131B (en) 1998-03-25 1998-03-31 Test device, test assembly, method for testing and method for calibrating a test device
DE69912589T DE69912589T2 (de) 1998-03-25 1999-03-24 Gerät und geräteaufbau zur prüfung von elektronischen bausteinen
EP99914799A EP1066535B1 (en) 1998-03-25 1999-03-24 Device and assembly for testing electronic components
JP2000538246A JP2002507753A (ja) 1998-03-25 1999-03-24 電子部品を試験するための装置、アセンブリ及び方法と、試験装置の較正方法
KR1020007010579A KR20010042154A (ko) 1998-03-25 1999-03-24 전자 부품 시험용 장치, 조립체 및 방법과 상기 시험장치용 보정 방법
PCT/NL1999/000166 WO1999049328A1 (en) 1998-03-25 1999-03-24 Device, assembly and method for testing electronic components, and calibrating method therefor
US09/646,822 US6507185B1 (en) 1998-03-25 1999-03-24 Device, assembly and method for testing electronic components, and calibrating method therefor
HK01100284A HK1030987A1 (en) 1998-03-25 2001-01-11 Device and assembly for testing electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1008697 1998-03-25
NL1008697A NL1008697C2 (nl) 1998-03-25 1998-03-25 Testinrichting, testsamenstel, werkwijze voor testen en werkwijze voor kalibreren van een testinrichting.

Publications (1)

Publication Number Publication Date
NL1008697C2 true NL1008697C2 (nl) 1999-09-28

Family

ID=19766811

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1008697A NL1008697C2 (nl) 1998-03-25 1998-03-25 Testinrichting, testsamenstel, werkwijze voor testen en werkwijze voor kalibreren van een testinrichting.

Country Status (9)

Country Link
US (1) US6507185B1 (ja)
EP (1) EP1066535B1 (ja)
JP (1) JP2002507753A (ja)
KR (1) KR20010042154A (ja)
DE (1) DE69912589T2 (ja)
HK (1) HK1030987A1 (ja)
NL (1) NL1008697C2 (ja)
TW (1) TW363131B (ja)
WO (1) WO1999049328A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6734694B2 (en) * 2001-03-19 2004-05-11 Juki Corporation Method and apparatus for automatically testing semiconductor device
NL1017656C2 (nl) * 2001-03-20 2002-09-23 Rentec B V Inrichting en werkwijze voor het testen van circuit modules.
US6783316B2 (en) * 2001-06-26 2004-08-31 Asm Assembly Automation Limited Apparatus and method for testing semiconductor devices
DE10131712B4 (de) * 2001-06-29 2009-04-09 Qimonda Ag Elektronisches Bauelement, Testereinrichtung und Verfahren zur Kalibrierung einer Testereinrichtung
US6756800B2 (en) * 2002-04-16 2004-06-29 Teradyne, Inc. Semiconductor test system with easily changed interface unit
KR100941674B1 (ko) * 2008-01-29 2010-02-12 (주)테크윙 전자부품 검사 지원을 위한 핸들러용 캐리어보드이송시스템 및 전자부품 검사 지원을 위한 핸들러의 챔버내에서의 캐리어보드 이송방법
US7924033B2 (en) * 2008-03-21 2011-04-12 Electro Scientific Industries, Inc. Compensation tool for calibrating an electronic component testing machine to a standardized value
CN101923150B (zh) * 2009-06-12 2013-01-30 郑州三晖电气股份有限公司 一种电能表定位接线机构
CN101923149B (zh) * 2009-06-12 2013-03-13 郑州三晖电气股份有限公司 电能表定位接线机构
CN101923151B (zh) * 2009-06-12 2013-01-09 河南电力试验研究院 流水线型电能表定位接线系统
KR101033992B1 (ko) * 2009-12-29 2011-05-11 주식회사 이엔씨 테크놀로지 Ｌｅｄ 검사장치
DE102011112532B4 (de) * 2011-09-05 2019-03-21 Audi Ag Prüfeinrichtung und Verfahren zum Prüfen von Batteriezellen
US20130200915A1 (en) * 2012-02-06 2013-08-08 Peter G. Panagas Test System with Test Trays and Automated Test Tray Handling
DE102017003683A1 (de) * 2017-04-18 2018-10-18 Franka Emika Gmbh Verfahren zum Überführen eines zu prüfenden Bauteils und Roboter zur Durchführung dieses Verfahrens
DE102017118980B4 (de) 2017-04-23 2018-11-08 Franka Emika Gmbh Vorrichtung und Verfahren zur elektrischen Prüfung eines elektrischen Bauteils
DE102017118978A1 (de) * 2017-04-23 2018-10-25 Franka Emika Gmbh Vorrichtung und Verfahren zur elektrischen Prüfung eines elektrischen Bauteils
DE202018100762U1 (de) * 2018-02-13 2019-05-14 topometric GmbH Prüfstation
TWI676031B (zh) * 2018-09-06 2019-11-01 致茂電子股份有限公司 滑移式電子元件測試裝置
CN109188159A (zh) * 2018-09-25 2019-01-11 珠海格力智能装备有限公司 检测装置及产品安全性能参数检测的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992004989A1 (en) * 1990-09-24 1992-04-02 Sym-Tek Systems, Inc. Electronic device test handler
US5151650A (en) * 1991-09-03 1992-09-29 Motorola, Inc. Packaged semiconductor device handler
GB2285139A (en) * 1993-11-25 1995-06-28 Motorola Inc Testing electronic devices
WO1997029383A1 (de) * 1996-02-09 1997-08-14 Mci Computer Gmbh Verfahren zum handhaben von elektronischen bauelementen
US5686834A (en) * 1995-09-28 1997-11-11 Ando Electric Co., Ltd. Handling system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6008636A (en) * 1997-09-30 1999-12-28 Motorola, Inc. Test system with robot arm for delivering a device under test

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992004989A1 (en) * 1990-09-24 1992-04-02 Sym-Tek Systems, Inc. Electronic device test handler
US5151650A (en) * 1991-09-03 1992-09-29 Motorola, Inc. Packaged semiconductor device handler
GB2285139A (en) * 1993-11-25 1995-06-28 Motorola Inc Testing electronic devices
US5686834A (en) * 1995-09-28 1997-11-11 Ando Electric Co., Ltd. Handling system
WO1997029383A1 (de) * 1996-02-09 1997-08-14 Mci Computer Gmbh Verfahren zum handhaben von elektronischen bauelementen

Also Published As

Publication number Publication date
TW363131B (en) 1999-07-01
WO1999049328A1 (en) 1999-09-30
KR20010042154A (ko) 2001-05-25
DE69912589D1 (de) 2003-12-11
DE69912589T2 (de) 2004-09-16
US6507185B1 (en) 2003-01-14
JP2002507753A (ja) 2002-03-12
EP1066535B1 (en) 2003-11-05
HK1030987A1 (en) 2001-05-25
EP1066535A1 (en) 2001-01-10

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Effective date: 20041001