MY8500667A - Manufacturing system - Google Patents

Manufacturing system

Info

Publication number
MY8500667A
MY8500667A MY667/85A MY8500667A MY8500667A MY 8500667 A MY8500667 A MY 8500667A MY 667/85 A MY667/85 A MY 667/85A MY 8500667 A MY8500667 A MY 8500667A MY 8500667 A MY8500667 A MY 8500667A
Authority
MY
Malaysia
Prior art keywords
manufacturing system
manufacturing
Prior art date
Application number
MY667/85A
Other languages
English (en)
Inventor
Hiroshi Nagatomo
Keishin Fujikawa
Jun Suzuki
Hisashi Maejima
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of MY8500667A publication Critical patent/MY8500667A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5196—Multiple station with conveyor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
MY667/85A 1979-07-27 1985-12-30 Manufacturing system MY8500667A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9500479A JPS5619635A (en) 1979-07-27 1979-07-27 Manufacturing apparatus

Publications (1)

Publication Number Publication Date
MY8500667A true MY8500667A (en) 1985-12-31

Family

ID=14125760

Family Applications (1)

Application Number Title Priority Date Filing Date
MY667/85A MY8500667A (en) 1979-07-27 1985-12-30 Manufacturing system

Country Status (7)

Country Link
US (1) US4544318A (fr)
JP (1) JPS5619635A (fr)
DE (1) DE3028283A1 (fr)
GB (1) GB2056169B (fr)
HK (1) HK35985A (fr)
MY (1) MY8500667A (fr)
SG (1) SG41484G (fr)

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JPS58134441A (ja) * 1982-02-04 1983-08-10 Fujitsu Ltd ウエハ処理装置
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JPS5981034U (ja) * 1982-11-22 1984-05-31 日立プラント建設株式会社 ウエハ搬送装置
JPS60186572A (ja) * 1984-03-06 1985-09-24 Hinode Eng Kk 塗料の製造方法
JPS61283337A (ja) * 1985-06-06 1986-12-13 Mitsui Eng & Shipbuild Co Ltd 少量多品種化学製品の生産方法
US4943457A (en) * 1985-10-24 1990-07-24 Texas Instruments Incorporated Vacuum slice carrier
JPS63229836A (ja) * 1987-03-19 1988-09-26 Nikon Corp ウエハ検査装置
JPS63283141A (ja) * 1987-05-15 1988-11-21 Tokyo Electron Ltd 全自動プロ−バ遠隔操作システム
JP2559617B2 (ja) * 1988-03-24 1996-12-04 キヤノン株式会社 基板処理装置
JPH0756879B2 (ja) * 1988-03-31 1995-06-14 日鉄セミコンダクター株式会社 半導体の無塵化製造装置
JPH07101706B2 (ja) * 1988-09-14 1995-11-01 富士通株式会社 ウェーハの連続処理装置及び連続処理方法
US5024570A (en) * 1988-09-14 1991-06-18 Fujitsu Limited Continuous semiconductor substrate processing system
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
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JPH0313837A (ja) * 1989-06-12 1991-01-22 Mitsubishi Heavy Ind Ltd 排気弁の故障診断装置
JP2941308B2 (ja) 1989-07-12 1999-08-25 株式会社日立製作所 検査システムおよび電子デバイスの製造方法
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JP2565786B2 (ja) * 1990-03-09 1996-12-18 三菱電機株式会社 自動搬送装置及び方法
DE9004208U1 (de) * 1990-04-11 1990-06-13 Groninger & Co Gmbh, 74564 Crailsheim Einrichtung zur Verarbeitung pharamzeutischer, kosmetischer o.dgl. Medien
JP2525284B2 (ja) * 1990-10-22 1996-08-14 ティーディーケイ株式会社 クリ―ン搬送方法及び装置
US5668056A (en) * 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system
JP3351802B2 (ja) * 1991-01-01 2002-12-03 忠弘 大見 薄膜形成装置
ES2078718T3 (es) * 1992-08-04 1995-12-16 Ibm Estructuras de cadenas de fabricacion a base de transportadores totalmente automatizados e informatizados adaptados a recipientes transportables estancos a presion.
US5865319A (en) * 1994-12-28 1999-02-02 Advantest Corp. Automatic test handler system for IC tester
JPH0936198A (ja) 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
US6672819B1 (en) 1995-07-19 2004-01-06 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
KR100487590B1 (ko) * 1995-08-21 2005-08-04 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
JPH08227925A (ja) * 1995-12-27 1996-09-03 Tokyo Electron Ltd プロービィング方法
WO1998014370A2 (fr) 1996-10-03 1998-04-09 Machinery Developments Limited Dispositif et procede pour emballer la viande
JP2883596B2 (ja) * 1997-06-23 1999-04-19 株式会社日立製作所 真空処理装置及び基板の処理方法
GB9713390D0 (en) 1997-06-26 1997-08-27 Trikon Equip Ltd Apparatus for processing workpieces
US6647303B1 (en) 1999-10-15 2003-11-11 Data I/O Corporation Feeder/programming/buffer control system and control method
NL1013569C2 (nl) * 1999-11-12 2001-05-15 Fico Bv Transportinrichting en werkwijze voor het verplaatsen van productdragers voor elektronische componenten.
US6711798B2 (en) 2000-01-18 2004-03-30 Dell Products L.P. Method for manufacturing products according to customer orders
US7096468B1 (en) * 2000-01-18 2006-08-22 Data I/O Corporation Programmer/feeder system task linking program
US6631606B2 (en) 2000-01-18 2003-10-14 Dell Products L.P. System and method for accommodating atypical customer requirements in a mass customization manufacturing facility
US6892104B2 (en) * 2000-01-18 2005-05-10 Dell Products L.P. System and method for manufacturing products according to customer orders
JP4915033B2 (ja) * 2000-06-15 2012-04-11 株式会社ニコン 露光装置、基板処理装置及びリソグラフィシステム、並びにデバイス製造方法
US6560509B2 (en) 2001-03-05 2003-05-06 Dell Products L.P. System and method for automated management of a distribution facility
US6529797B2 (en) 2001-03-05 2003-03-04 Dell Products L.P. System and method for automatically releasing collections of goods for shipment
US6816746B2 (en) 2001-03-05 2004-11-09 Dell Products L.P. Method and system for monitoring resources within a manufacturing environment
US6615092B2 (en) 2001-03-05 2003-09-02 Dell Products L.P. Method, system and facility for controlling resource allocation within a manufacturing environment
US6611727B2 (en) 2001-03-05 2003-08-26 Dell Products L.P. Method and system for simulating production within a manufacturing environment
US6505094B2 (en) 2001-03-05 2003-01-07 Dell Products L.P. System and method for shipping items from a distribution facility
US6634506B2 (en) 2001-03-05 2003-10-21 Dell Products L.P. Reusable container management system and method
JPWO2002103763A1 (ja) * 2001-06-14 2004-10-07 株式会社ルネサステクノロジ 半導体装置の製造方法
US6847858B2 (en) 2001-12-05 2005-01-25 Dell Products L.P. System and method for managing release of goods for packaging
US6726429B2 (en) 2002-02-19 2004-04-27 Vertical Solutions, Inc. Local store for a wafer processing station
JP3966211B2 (ja) * 2002-05-08 2007-08-29 株式会社ニコン 露光方法、露光装置及びデバイス製造方法
US6962306B2 (en) * 2002-07-15 2005-11-08 West Ronald R Units for storing flexible elongated objects
US7221993B2 (en) 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US7778721B2 (en) 2003-01-27 2010-08-17 Applied Materials, Inc. Small lot size lithography bays
US6840367B2 (en) * 2003-06-16 2005-01-11 Richard R. Tucker Material handling and manufacturing system and method
US7239930B2 (en) 2005-05-24 2007-07-03 International Business Machines Corporation Method, system, and computer program product for improved flow of development lots in a manufacturing facility
US7305276B2 (en) 2005-10-31 2007-12-04 International Business Machines Corporation Method, system, and computer program product for controlling the flow of material in a manufacturing facility using an extended zone of control
JP5035423B2 (ja) * 2008-09-30 2012-09-26 株式会社Ｓｕｍｃｏ 半導体製造工場
DE202012011690U1 (de) 2012-03-09 2013-03-13 Schneider Gmbh & Co. Kg Anlage zum Bearbeiten optischer Linsen
DE102015015040A1 (de) 2015-11-12 2017-05-18 Schneider Gmbh & Co. Kg Verfahren, Anlage und System zur Bearbeitung optischer Linsen
DE102016007837A1 (de) 2016-05-25 2017-11-30 Schneider Gmbh & Co. Kg Verfahren und System zur Bearbeitung optischer Linsen
DE102017001680A1 (de) 2017-02-22 2018-08-23 Schneider Gmbh & Co. Kg Anlage und Verfahren zur Bearbeitung optischer Linsen

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Also Published As

Publication number Publication date
HK35985A (en) 1985-05-17
US4544318A (en) 1985-10-01
DE3028283C2 (fr) 1987-11-26
SG41484G (en) 1985-03-08
GB2056169A (en) 1981-03-11
JPS5619635A (en) 1981-02-24
JPS646540B2 (fr) 1989-02-03
DE3028283A1 (de) 1981-02-19
GB2056169B (en) 1983-04-27

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