MY195223A - Resin Composition, Insulating Layer for Wiring Board, and Laminate - Google Patents

Resin Composition, Insulating Layer for Wiring Board, and Laminate

Info

Publication number
MY195223A
MY195223A MYPI2020000925A MYPI2020000925A MY195223A MY 195223 A MY195223 A MY 195223A MY PI2020000925 A MYPI2020000925 A MY PI2020000925A MY PI2020000925 A MYPI2020000925 A MY PI2020000925A MY 195223 A MY195223 A MY 195223A
Authority
MY
Malaysia
Prior art keywords
resin composition
viscosity
laminate
insulating layer
wiring board
Prior art date
Application number
MYPI2020000925A
Other languages
English (en)
Inventor
Toshifumi Matsushima
Kazuhiro Oosawa
Takahiro Hongo
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY195223A publication Critical patent/MY195223A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
MYPI2020000925A 2017-07-27 2018-07-13 Resin Composition, Insulating Layer for Wiring Board, and Laminate MY195223A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017145841 2017-07-27
PCT/JP2018/026513 WO2019021862A1 (ja) 2017-07-27 2018-07-13 樹脂組成物、配線板用絶縁層及び積層体

Publications (1)

Publication Number Publication Date
MY195223A true MY195223A (en) 2023-01-11

Family

ID=65039633

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020000925A MY195223A (en) 2017-07-27 2018-07-13 Resin Composition, Insulating Layer for Wiring Board, and Laminate

Country Status (6)

Country Link
JP (1) JP7219216B2 (ko)
KR (1) KR102254544B1 (ko)
CN (1) CN110709476A (ko)
MY (1) MY195223A (ko)
TW (1) TWI739017B (ko)
WO (1) WO2019021862A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022054303A1 (ko) * 2020-09-11 2022-03-17
JP2022099778A (ja) * 2020-12-23 2022-07-05 日鉄ケミカル＆マテリアル株式会社 ポリイミド組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
CN112795169B (zh) * 2020-12-31 2022-07-19 广东生益科技股份有限公司 一种树脂组合物及包含其的树脂膜、预浸料、层压板、覆铜板和印刷电路板

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002114981A (ja) 1997-02-14 2002-04-16 Otsuka Chem Co Ltd 難燃剤、難燃性樹脂組成物及び難燃性樹脂成形体
JP2005112981A (ja) 2003-10-07 2005-04-28 Hitachi Chem Co Ltd 低誘電率樹脂組成物およびそれを用いたプリプレグ、金属張積層板、印刷配線板
JP2007030326A (ja) 2005-07-26 2007-02-08 Matsushita Electric Works Ltd 樹脂付銅箔、プリント配線板製造用積層体及び多層プリント配線板
JP2007224162A (ja) 2006-02-23 2007-09-06 Matsushita Electric Works Ltd 難燃性樹脂組成物、プリプレグ、樹脂シート、成形品
JP2009078209A (ja) 2007-09-25 2009-04-16 Panasonic Electric Works Co Ltd 樹脂付き金属箔とその製造方法、並びに金属張りフレキシブル積層板
JP5493347B2 (ja) 2008-01-17 2014-05-14 東洋インキＳｃホールディングス株式会社 難燃性樹脂組成物
JP5233710B2 (ja) * 2008-02-12 2013-07-10 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび金属箔張り積層板
JP5093059B2 (ja) 2008-11-06 2012-12-05 日立化成工業株式会社 樹脂組成物、プリプレグ、積層板及びプリント基板
JP2010168487A (ja) 2009-01-23 2010-08-05 Nippon Zeon Co Ltd 重合性組成物、架橋体および架橋樹脂複合体
WO2011093079A1 (ja) 2010-01-28 2011-08-04 三井化学株式会社 金属樹脂複合体
JP2011162615A (ja) 2010-02-05 2011-08-25 Kyocera Chemical Corp プリプレグおよび金属張り積層板
JP5791983B2 (ja) 2011-07-07 2015-10-07 三井化学株式会社 樹脂組成物、これを用いたポリイミド金属積層体、及び電子回路用基板
CN110087405B (zh) 2012-01-11 2022-08-12 三井金属矿业株式会社 带有粘合剂层的铜箔、覆铜层压板及印刷布线板
JP5901066B2 (ja) 2012-04-27 2016-04-06 三井金属鉱業株式会社 樹脂組成物、樹脂層付金属箔、金属張積層板及びプリント配線板
JP6062667B2 (ja) * 2012-06-15 2017-01-18 旭化成株式会社 硬化性樹脂組成物
JP6364202B2 (ja) 2014-02-24 2018-07-25 矢崎総業株式会社 成形機及び成形方法
EP3115418B1 (en) 2014-03-06 2018-05-23 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, resin sheet, metal-foil-clad laminated plate, and printed wiring board
JP6379675B2 (ja) 2014-05-28 2018-08-29 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ
SG11201609003XA (en) 2014-06-03 2016-12-29 Mitsui Mining & Smelting Co Metal foil with releasing resin layer, and printed wiring board
WO2016147984A1 (ja) 2015-03-13 2016-09-22 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
JP2016191029A (ja) 2015-03-31 2016-11-10 新日鉄住金化学株式会社 ポリアミド酸組成物、ポリイミド、樹脂フィルム及び金属張積層体
CN107849429B (zh) * 2015-08-19 2021-06-25 东洋纺株式会社 低介电粘合剂组合物
JP6675183B2 (ja) * 2015-11-30 2020-04-01 ナミックス株式会社 熱硬化性樹脂組成物、熱硬化性樹脂フィルム、プリント配線板、および半導体装置
JP6832868B2 (ja) 2015-12-07 2021-02-24 三井金属鉱業株式会社 積層体の製造方法及び樹脂層付金属箔

Also Published As

Publication number Publication date
WO2019021862A1 (ja) 2019-01-31
CN110709476A (zh) 2020-01-17
KR20190133787A (ko) 2019-12-03
TW201910411A (zh) 2019-03-16
TWI739017B (zh) 2021-09-11
JP7219216B2 (ja) 2023-02-07
KR102254544B1 (ko) 2021-05-24
JPWO2019021862A1 (ja) 2020-05-28

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