MY194777A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
MY194777A
MY194777A MYPI2019004665A MYPI2019004665A MY194777A MY 194777 A MY194777 A MY 194777A MY PI2019004665 A MYPI2019004665 A MY PI2019004665A MY PI2019004665 A MYPI2019004665 A MY PI2019004665A MY 194777 A MY194777 A MY 194777A
Authority
MY
Malaysia
Prior art keywords
resin composition
photosensitive resin
photosensitizer
integer
general formula
Prior art date
Application number
MYPI2019004665A
Other languages
English (en)
Inventor
Junya Kosaka
Kazuya Naito
Masahiko Ochiai
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY194777A publication Critical patent/MY194777A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Laminated Bodies (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
MYPI2019004665A 2017-03-29 2018-03-28 Photosensitive resin composition MY194777A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017065241 2017-03-29
JP2017188751 2017-09-28
PCT/JP2018/012941 WO2018181556A1 (ja) 2017-03-29 2018-03-28 感光性樹脂組成物

Publications (1)

Publication Number Publication Date
MY194777A true MY194777A (en) 2022-12-15

Family

ID=63677968

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019004665A MY194777A (en) 2017-03-29 2018-03-28 Photosensitive resin composition

Country Status (6)

Country Link
JP (2) JP6783381B2 (zh)
KR (1) KR102295744B1 (zh)
CN (2) CN110325913B (zh)
MY (1) MY194777A (zh)
TW (1) TWI676639B (zh)
WO (1) WO2018181556A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112574184B (zh) * 2020-12-25 2022-12-20 同济大学 环氧化物取代的吡唑啉衍生物、光固化组合物以及制备方法
KR20220098410A (ko) 2021-01-04 2022-07-12 주식회사 뷰메진 드론을 통한 클라우드 환경 기반의 실시간 영상 정보 송신 및 수신을 위한 통신 회로 차단기법 응용 시스템 및 방법
WO2022190208A1 (ja) * 2021-03-09 2022-09-15 昭和電工マテリアルズ株式会社 感光性フィルム、感光性エレメント、及び、積層体の製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
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DE1469821B2 (de) * 1959-06-24 1972-03-23 Badische Anilin & Soda Fabrik AG, 6700 Ludwigshafen Optische Aufheller für makromolekulare organische Stoffe
US5275909A (en) * 1992-06-01 1994-01-04 Ocg Microelectronic Materials, Inc. Positive-working radiation sensitive mixtures and articles containing alkali-soluble binder, o-quinonediazide photoactive compound and BLANKOPHOR FBW acting dye
EP0709226A1 (de) * 1994-09-30 1996-05-01 Ciba-Geigy Ag Streichformulierungen für Thermopapiere
GB9605712D0 (en) * 1996-03-19 1996-05-22 Minnesota Mining & Mfg Novel uv-curable compositions
CN1058978C (zh) * 1996-12-31 2000-11-29 中国科学院感光化学研究所 含有高分子分散剂的荧光染料分散液及其制法和用途
JPH11199609A (ja) * 1998-01-16 1999-07-27 Tokuyama Sekiyu Kagaku Kk 光重合性組成物
CN1332266C (zh) * 1999-03-03 2007-08-15 日立化成工业株式会社 光敏树脂组合物、使用光敏树脂组合物的感光性元件、蚀刻图形的制法及印刷线路板的制法
US7265161B2 (en) * 2002-10-02 2007-09-04 3M Innovative Properties Company Multi-photon reactive compositions with inorganic particles and method for fabricating structures
JP2003313208A (ja) * 2002-04-19 2003-11-06 Meiko:Kk 光硬化性樹脂組成物
EP1631616B1 (en) * 2003-06-06 2011-10-05 Basf Se Novel surface-active polysiloxane photoinitiators
JP4337485B2 (ja) 2003-09-16 2009-09-30 三菱化学株式会社 青紫色レーザー感光性組成物、並びにそれを用いた画像形成材料、画像形成材、及び画像形成方法
EP1657286B1 (en) * 2004-11-12 2018-07-04 FUJIFILM Corporation Radiation curable ink jet ink, comprising a polymerisation initiation sensitising dye
JP2007178459A (ja) * 2005-12-26 2007-07-12 Fujifilm Corp パターン形成材料、並びにパターン形成装置及びパターン形成方法
CN1908698B (zh) * 2006-08-23 2010-10-06 黄则煌 丙烯基二甘醇碳酸酯护目镜片及其制造方法
JPWO2008084599A1 (ja) * 2007-01-10 2010-04-30 コニカミノルタエムジー株式会社 感光性平版印刷版材料
WO2008126526A1 (ja) * 2007-04-04 2008-10-23 Asahi Kasei E-Materials Corporation 感光性樹脂組成物および積層体
WO2011037182A1 (ja) * 2009-09-25 2011-03-31 旭化成イーマテリアルズ株式会社 レジスト材料用感光性樹脂組成物及び感光性樹脂積層体
US9222024B2 (en) * 2010-04-20 2015-12-29 Basf Se Polymerized films with line texture or fingerprint texture
CN103608726B (zh) * 2011-06-08 2016-11-09 3M创新有限公司 包含聚合物系留的纳米颗粒的光致抗蚀剂
CN103509454B (zh) * 2013-09-12 2016-02-24 苏州金海薄膜科技发展有限公司 一种涂布液、带有涂布液的薄膜及其制作方法
JP2015219336A (ja) * 2014-05-16 2015-12-07 旭化成イーマテリアルズ株式会社 レジスト材料用感光性樹脂組成物及び感光性樹脂積層体
TWI620017B (zh) * 2015-04-08 2018-04-01 Asahi Chemical Ind Photosensitive resin composition
CN107759715A (zh) * 2017-09-20 2018-03-06 苏州瑞红电子化学品有限公司 琥珀酰亚胺改性的环氧丙烯酸树脂及其制备方法、负性光刻胶组合物

Also Published As

Publication number Publication date
JP6783381B2 (ja) 2020-11-11
KR20190100968A (ko) 2019-08-29
KR102295744B1 (ko) 2021-08-30
CN115524922A (zh) 2022-12-27
JPWO2018181556A1 (ja) 2019-08-08
WO2018181556A1 (ja) 2018-10-04
JP2020184076A (ja) 2020-11-12
TW201840603A (zh) 2018-11-16
TWI676639B (zh) 2019-11-11
JP6936898B2 (ja) 2021-09-22
CN110325913B (zh) 2022-11-01
CN110325913A (zh) 2019-10-11

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