MY194777A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
MY194777A
MY194777A MYPI2019004665A MYPI2019004665A MY194777A MY 194777 A MY194777 A MY 194777A MY PI2019004665 A MYPI2019004665 A MY PI2019004665A MY PI2019004665 A MYPI2019004665 A MY PI2019004665A MY 194777 A MY194777 A MY 194777A
Authority
MY
Malaysia
Prior art keywords
resin composition
photosensitive resin
photosensitizer
integer
general formula
Prior art date
Application number
MYPI2019004665A
Inventor
Junya Kosaka
Kazuya Naito
Masahiko Ochiai
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY194777A publication Critical patent/MY194777A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Laminated Bodies (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

Provided is a photosensitive resin composition which exhibits more excellent sensitivity (productivity), resolution and adhesiveness than conventionally used sensitizers in laser direct imaging exposure systems, or the like. A photosensitive resin composition according to the present invention contains the following components: (A) an alkali-soluble polymer; (B) a compound having an ethylenically unsaturated double bond; (C) a photopolymerization initiator; and (D) a photosensitizer. The photosensitizer (D) contains a distyrylbenzene derivative represented by general formula (2). In general formula (2), each of R3, R4 and R5 represents a cyano group; each of c and e independently represents an integer of 1-5; and d represents an integer of 0-4.
MYPI2019004665A 2017-03-29 2018-03-28 Photosensitive resin composition MY194777A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017065241 2017-03-29
JP2017188751 2017-09-28
PCT/JP2018/012941 WO2018181556A1 (en) 2017-03-29 2018-03-28 Photosensitive resin composition

Publications (1)

Publication Number Publication Date
MY194777A true MY194777A (en) 2022-12-15

Family

ID=63677968

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019004665A MY194777A (en) 2017-03-29 2018-03-28 Photosensitive resin composition

Country Status (6)

Country Link
JP (2) JP6783381B2 (en)
KR (1) KR102295744B1 (en)
CN (2) CN110325913B (en)
MY (1) MY194777A (en)
TW (1) TWI676639B (en)
WO (1) WO2018181556A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112574184B (en) * 2020-12-25 2022-12-20 同济大学 Epoxide-substituted pyrazoline derivative, photocuring composition and preparation method
KR20220098410A (en) 2021-01-04 2022-07-12 주식회사 뷰메진 Cloud-based Circuit Braking System and Approach for Real-time Video Streaming Network of Unmanned Aerial Vehicles
WO2022190208A1 (en) * 2021-03-09 2022-09-15 昭和電工マテリアルズ株式会社 Photosensitive film, photosensitive element and method for producing multilayer body

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1469821B2 (en) * 1959-06-24 1972-03-23 Badische Anilin & Soda Fabrik AG, 6700 Ludwigshafen Optical brighteners for macromolecular organic substances
US5275909A (en) * 1992-06-01 1994-01-04 Ocg Microelectronic Materials, Inc. Positive-working radiation sensitive mixtures and articles containing alkali-soluble binder, o-quinonediazide photoactive compound and BLANKOPHOR FBW acting dye
EP0709226A1 (en) * 1994-09-30 1996-05-01 Ciba-Geigy Ag Coating formulations for thermal papers
GB9605712D0 (en) * 1996-03-19 1996-05-22 Minnesota Mining & Mfg Novel uv-curable compositions
CN1058978C (en) * 1996-12-31 2000-11-29 中国科学院感光化学研究所 Fluorescent dye dispersion containing high molecular dispersing agent and its preparing method and its use
JPH11199609A (en) * 1998-01-16 1999-07-27 Tokuyama Sekiyu Kagaku Kk Photopolymerizable composition
CN1332266C (en) * 1999-03-03 2007-08-15 日立化成工业株式会社 Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board
US7265161B2 (en) * 2002-10-02 2007-09-04 3M Innovative Properties Company Multi-photon reactive compositions with inorganic particles and method for fabricating structures
JP2003313208A (en) * 2002-04-19 2003-11-06 Meiko:Kk Photocurable resin composition
EP1631616B1 (en) * 2003-06-06 2011-10-05 Basf Se Novel surface-active polysiloxane photoinitiators
JP4337485B2 (en) 2003-09-16 2009-09-30 三菱化学株式会社 Blue-violet laser photosensitive composition, and image forming material, image forming material, and image forming method using the same
EP1657286B1 (en) * 2004-11-12 2018-07-04 FUJIFILM Corporation Radiation curable ink jet ink, comprising a polymerisation initiation sensitising dye
JP2007178459A (en) * 2005-12-26 2007-07-12 Fujifilm Corp Pattern-forming material, pattern-forming device, and pattern forming method
CN1908698B (en) * 2006-08-23 2010-10-06 黄则煌 Acrylic diglycol carbonic acid ester eye-protection lens and method for producing the same
JPWO2008084599A1 (en) * 2007-01-10 2010-04-30 コニカミノルタエムジー株式会社 Photosensitive lithographic printing plate material
WO2008126526A1 (en) * 2007-04-04 2008-10-23 Asahi Kasei E-Materials Corporation Photosensitive resin composition and layered product
WO2011037182A1 (en) * 2009-09-25 2011-03-31 旭化成イーマテリアルズ株式会社 Photosensitive resin composition for resist material, and photosensitive resin laminate
US9222024B2 (en) * 2010-04-20 2015-12-29 Basf Se Polymerized films with line texture or fingerprint texture
CN103608726B (en) * 2011-06-08 2016-11-09 3M创新有限公司 Comprise the photoresist of the nano-particle of polymer mooring
CN103509454B (en) * 2013-09-12 2016-02-24 苏州金海薄膜科技发展有限公司 A kind of coating fluid, film and preparation method thereof with coating fluid
JP2015219336A (en) * 2014-05-16 2015-12-07 旭化成イーマテリアルズ株式会社 Photosensitive resin composition for resist material, and photosensitive resin laminate
TWI620017B (en) * 2015-04-08 2018-04-01 Asahi Chemical Ind Photosensitive resin composition
CN107759715A (en) * 2017-09-20 2018-03-06 苏州瑞红电子化学品有限公司 Epoxy acrylic resin that succinimide is modified and preparation method thereof, negative photo glue composition

Also Published As

Publication number Publication date
JP6783381B2 (en) 2020-11-11
KR20190100968A (en) 2019-08-29
KR102295744B1 (en) 2021-08-30
CN115524922A (en) 2022-12-27
JPWO2018181556A1 (en) 2019-08-08
WO2018181556A1 (en) 2018-10-04
JP2020184076A (en) 2020-11-12
TW201840603A (en) 2018-11-16
TWI676639B (en) 2019-11-11
JP6936898B2 (en) 2021-09-22
CN110325913B (en) 2022-11-01
CN110325913A (en) 2019-10-11

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