MY187285A - Copper foil provided with carrier foil, copper clad laminate and printed wiring board - Google Patents
Copper foil provided with carrier foil, copper clad laminate and printed wiring boardInfo
- Publication number
- MY187285A MY187285A MYPI2016701883A MYPI2016701883A MY187285A MY 187285 A MY187285 A MY 187285A MY PI2016701883 A MYPI2016701883 A MY PI2016701883A MY PI2016701883 A MYPI2016701883 A MY PI2016701883A MY 187285 A MY187285 A MY 187285A
- Authority
- MY
- Malaysia
- Prior art keywords
- foil
- copper
- carrier
- copper foil
- wiring board
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013245256 | 2013-11-27 | ||
PCT/JP2014/080921 WO2015080052A1 (ja) | 2013-11-27 | 2014-11-21 | キャリア箔付銅箔及び銅張積層板 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY187285A true MY187285A (en) | 2021-09-19 |
Family
ID=53198993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2016701883A MY187285A (en) | 2013-11-27 | 2014-11-21 | Copper foil provided with carrier foil, copper clad laminate and printed wiring board |
Country Status (6)
Country | Link |
---|---|
JP (2) | JP6855164B2 (zh) |
KR (2) | KR102272762B1 (zh) |
CN (1) | CN105745360B (zh) |
MY (1) | MY187285A (zh) |
TW (1) | TWI644995B (zh) |
WO (1) | WO2015080052A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6546526B2 (ja) * | 2015-12-25 | 2019-07-17 | 三井金属鉱業株式会社 | キャリア付銅箔及びコアレス支持体用積層板、並びに配線層付コアレス支持体及びプリント配線板の製造方法 |
CN107248591A (zh) * | 2017-06-14 | 2017-10-13 | 深圳先进技术研究院 | 柔性全固态薄膜锂电池及其制备方法 |
JP7032578B2 (ja) * | 2019-01-11 | 2022-03-08 | 三井金属鉱業株式会社 | 積層体 |
US10697082B1 (en) * | 2019-08-12 | 2020-06-30 | Chang Chun Petrochemical Co., Ltd. | Surface-treated copper foil |
KR102137068B1 (ko) * | 2019-11-27 | 2020-07-23 | 와이엠티 주식회사 | 캐리어박 부착 금속박, 이의 제조방법 및 이를 포함하는 적층체 |
CN113684506B (zh) * | 2021-08-30 | 2022-02-11 | 广东嘉元科技股份有限公司 | 一种具有撕边在线收卷装置的生箔机 |
WO2023189566A1 (ja) * | 2022-03-29 | 2023-10-05 | 三井金属鉱業株式会社 | キャリア付金属箔、金属張積層板及びプリント配線板 |
WO2023189565A1 (ja) * | 2022-03-29 | 2023-10-05 | 三井金属鉱業株式会社 | キャリア付金属箔、金属張積層板及びプリント配線板 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3466506B2 (ja) | 1999-04-23 | 2003-11-10 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板 |
JP3370624B2 (ja) * | 1999-08-24 | 2003-01-27 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔及びその電解銅箔を使用した銅張積層板 |
JP2001068804A (ja) | 1999-08-31 | 2001-03-16 | Mitsui Mining & Smelting Co Ltd | キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板 |
JP3670179B2 (ja) * | 1999-11-11 | 2005-07-13 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いた銅張積層板 |
JP4073248B2 (ja) | 2002-05-14 | 2008-04-09 | 三井金属鉱業株式会社 | 高温耐熱用キャリア箔付電解銅箔の製造方法及びその製造方法で得られる高温耐熱用キャリア箔付電解銅箔 |
JP2005288856A (ja) * | 2004-03-31 | 2005-10-20 | Mitsui Mining & Smelting Co Ltd | キャリア箔付電解銅箔及びその製造方法並びにそのキャリア箔付電解銅箔を用いた銅張積層板 |
JP2005307270A (ja) * | 2004-04-21 | 2005-11-04 | Mitsui Mining & Smelting Co Ltd | キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法 |
CN101851769B (zh) * | 2005-03-31 | 2012-07-04 | 三井金属矿业株式会社 | 电解铜箔及其制造方法、表面处理电解铜箔、覆铜层压板及印刷电路板 |
JP4065004B2 (ja) * | 2005-03-31 | 2008-03-19 | 三井金属鉱業株式会社 | 電解銅箔、その電解銅箔を用いて得られた表面処理電解銅箔、その表面処理電解銅箔を用いた銅張積層板及びプリント配線板 |
TWI394659B (zh) * | 2005-07-27 | 2013-05-01 | Nippon Steel Chemical Co | 高屈曲性可撓性覆銅積層板之製造方法 |
JP2007294923A (ja) * | 2006-03-31 | 2007-11-08 | Nikko Kinzoku Kk | 強度、導電率、曲げ加工性に優れた銅条又は銅箔の製造方法、銅条又は銅箔、並びにそれを用いた電子部品 |
TW200804626A (en) * | 2006-05-19 | 2008-01-16 | Mitsui Mining & Smelting Co | Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she |
JP4777206B2 (ja) * | 2006-09-29 | 2011-09-21 | 新日鐵化学株式会社 | フレキシブル銅張積層板の製造方法 |
JP5588607B2 (ja) * | 2007-10-31 | 2014-09-10 | 三井金属鉱業株式会社 | 電解銅箔及びその電解銅箔の製造方法 |
JP5379528B2 (ja) * | 2009-03-24 | 2013-12-25 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板 |
KR101385761B1 (ko) * | 2010-07-01 | 2014-04-17 | 미쓰이금속광업주식회사 | 전해 동박 및 그 제조 방법 |
-
2014
- 2014-11-21 WO PCT/JP2014/080921 patent/WO2015080052A1/ja active Application Filing
- 2014-11-21 CN CN201480063573.7A patent/CN105745360B/zh active Active
- 2014-11-21 KR KR1020167013705A patent/KR102272762B1/ko active IP Right Grant
- 2014-11-21 KR KR1020217009146A patent/KR102356179B1/ko active IP Right Grant
- 2014-11-21 TW TW103140380A patent/TWI644995B/zh active
- 2014-11-21 JP JP2015515308A patent/JP6855164B2/ja active Active
- 2014-11-21 MY MYPI2016701883A patent/MY187285A/en unknown
-
2019
- 2019-07-01 JP JP2019123171A patent/JP6784806B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TWI644995B (zh) | 2018-12-21 |
KR20160090818A (ko) | 2016-08-01 |
KR20210037020A (ko) | 2021-04-05 |
KR102356179B1 (ko) | 2022-02-08 |
WO2015080052A1 (ja) | 2015-06-04 |
JP6855164B2 (ja) | 2021-04-07 |
TW201536876A (zh) | 2015-10-01 |
CN105745360B (zh) | 2017-12-08 |
CN105745360A (zh) | 2016-07-06 |
KR102272762B1 (ko) | 2021-07-05 |
JPWO2015080052A1 (ja) | 2017-03-16 |
JP2019178431A (ja) | 2019-10-17 |
JP6784806B2 (ja) | 2020-11-11 |
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