MY186859A - Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same - Google Patents

Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same

Info

Publication number
MY186859A
MY186859A MYPI2018703757A MYPI2018703757A MY186859A MY 186859 A MY186859 A MY 186859A MY PI2018703757 A MYPI2018703757 A MY PI2018703757A MY PI2018703757 A MYPI2018703757 A MY PI2018703757A MY 186859 A MY186859 A MY 186859A
Authority
MY
Malaysia
Prior art keywords
copper foil
treated
treated surface
copper
carrier
Prior art date
Application number
MYPI2018703757A
Other languages
English (en)
Inventor
Tsubasa Kato
Mitsuyoshi Matsuda
Hiroto Iida
Kazuhiro Yoshikawa
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY186859A publication Critical patent/MY186859A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
MYPI2018703757A 2016-04-14 2017-03-28 Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same MY186859A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016081447 2016-04-14
PCT/JP2017/012678 WO2017179416A1 (ja) 2016-04-14 2017-03-28 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
MY186859A true MY186859A (en) 2021-08-26

Family

ID=60041506

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018703757A MY186859A (en) 2016-04-14 2017-03-28 Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same

Country Status (6)

Country Link
JP (1) JP6945523B2 (zh)
KR (1) KR102338103B1 (zh)
CN (1) CN109072472B (zh)
MY (1) MY186859A (zh)
TW (1) TWI711139B (zh)
WO (1) WO2017179416A1 (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111684869B (zh) * 2018-03-28 2021-03-19 三井金属矿业株式会社 多层布线板的制造方法
JP6606317B1 (ja) * 2018-04-25 2019-11-13 古河電気工業株式会社 表面処理銅箔、銅張積層板、及びプリント配線板
CN112154525A (zh) * 2018-05-29 2020-12-29 积水保力马科技株式会社 金属触点构件和橡胶开关构件
CN112368826A (zh) 2018-06-22 2021-02-12 积水保力马科技株式会社 热传导性片
WO2020009229A1 (ja) * 2018-07-06 2020-01-09 タツタ電線株式会社 プリント配線基板用貼付フィルム
KR102480377B1 (ko) * 2018-08-10 2022-12-23 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
JPWO2020067141A1 (ja) 2018-09-26 2021-09-30 積水ポリマテック株式会社 熱伝導性シート
JP6895936B2 (ja) 2018-09-28 2021-06-30 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及び回路基板
WO2020066074A1 (ja) * 2018-09-28 2020-04-02 三井金属鉱業株式会社 多層配線板の製造方法
JP6622443B1 (ja) * 2018-09-28 2019-12-18 三井金属鉱業株式会社 多層配線板の製造方法
TWI768213B (zh) * 2018-11-08 2022-06-21 日商拓自達電線股份有限公司 電磁波屏蔽膜、電磁波屏蔽膜之製造方法及屏蔽印刷配線板之製造方法
CN112969824A (zh) * 2018-11-19 2021-06-15 三井金属矿业株式会社 表面处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
US20220183158A1 (en) * 2019-03-26 2022-06-09 Mitsui Mining & Smelting Co., Ltd. Method of manufacturing printed wiring board
CN113811641B (zh) * 2019-05-15 2023-12-05 住友电气工业株式会社 印刷布线板
JP7300976B2 (ja) * 2019-12-13 2023-06-30 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
JP2021095596A (ja) * 2019-12-13 2021-06-24 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
JP7421208B2 (ja) 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法
JP7177956B2 (ja) * 2020-02-04 2022-11-24 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN115038819A (zh) * 2020-02-04 2022-09-09 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
KR20230160813A (ko) * 2021-03-26 2023-11-24 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
WO2022202540A1 (ja) * 2021-03-26 2022-09-29 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN115226325A (zh) * 2021-04-14 2022-10-21 鹏鼎控股(深圳)股份有限公司 电路板的制作方法以及电路板
WO2022255420A1 (ja) * 2021-06-03 2022-12-08 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5228965A (en) * 1990-10-30 1993-07-20 Gould Inc. Method and apparatus for applying surface treatment to metal foil
JP4567360B2 (ja) * 2004-04-02 2010-10-20 三井金属鉱業株式会社 銅箔の製造方法及びその製造方法で得られる銅箔
JP2011148192A (ja) * 2010-01-21 2011-08-04 Jx Nippon Mining & Metals Corp 銅張積層板の製造方法、それに用いる銅箔、及び銅張積層板のラミネート装置。
CN103125149B (zh) * 2010-09-27 2016-09-14 吉坤日矿日石金属株式会社 印刷电路板用铜箔、其制造方法、印刷电路板用树脂基板以及印刷电路板
JP5204908B1 (ja) 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP5858849B2 (ja) * 2012-03-30 2016-02-10 Jx日鉱日石金属株式会社 金属箔
JP5481577B1 (ja) * 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔
CN105102678B (zh) * 2013-02-14 2018-06-12 三井金属矿业株式会社 表面处理铜箔及用表面处理铜箔得到的覆铜层压板
WO2014133164A1 (ja) * 2013-02-28 2014-09-04 三井金属鉱業株式会社 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板
WO2014157728A1 (ja) * 2013-03-29 2014-10-02 Jx日鉱日石金属株式会社 キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
CN104120471B (zh) * 2013-04-26 2018-06-08 Jx日矿日石金属株式会社 高频电路用铜箔、覆铜板、印刷配线板、带载体的铜箔、电子设备及印刷配线板的制造方法
JP5470493B1 (ja) 2013-07-23 2014-04-16 Ｊｘ日鉱日石金属株式会社 樹脂基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
MY168616A (en) * 2013-07-23 2018-11-14 Jx Nippon Mining & Metals Corp Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
MY177676A (en) * 2015-07-03 2020-09-23 Mitsui Mining & Smelting Co Ltd Roughened copper foil, copper-clad laminate and printed wiring board
WO2017018232A1 (ja) * 2015-07-29 2017-02-02 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
JP6945523B2 (ja) 2021-10-06
CN109072472B (zh) 2020-10-16
TW201742212A (zh) 2017-12-01
TWI711139B (zh) 2020-11-21
KR20180133845A (ko) 2018-12-17
CN109072472A (zh) 2018-12-21
KR102338103B1 (ko) 2021-12-10
JPWO2017179416A1 (ja) 2019-02-21
WO2017179416A1 (ja) 2017-10-19

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