MY186859A - Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same - Google Patents
Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using sameInfo
- Publication number
- MY186859A MY186859A MYPI2018703757A MYPI2018703757A MY186859A MY 186859 A MY186859 A MY 186859A MY PI2018703757 A MYPI2018703757 A MY PI2018703757A MY PI2018703757 A MYPI2018703757 A MY PI2018703757A MY 186859 A MY186859 A MY 186859A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper foil
- treated
- treated surface
- copper
- carrier
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016081447 | 2016-04-14 | ||
PCT/JP2017/012678 WO2017179416A1 (ja) | 2016-04-14 | 2017-03-28 | 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY186859A true MY186859A (en) | 2021-08-26 |
Family
ID=60041506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018703757A MY186859A (en) | 2016-04-14 | 2017-03-28 | Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6945523B2 (zh) |
KR (1) | KR102338103B1 (zh) |
CN (1) | CN109072472B (zh) |
MY (1) | MY186859A (zh) |
TW (1) | TWI711139B (zh) |
WO (1) | WO2017179416A1 (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111684869B (zh) * | 2018-03-28 | 2021-03-19 | 三井金属矿业株式会社 | 多层布线板的制造方法 |
JP6606317B1 (ja) * | 2018-04-25 | 2019-11-13 | 古河電気工業株式会社 | 表面処理銅箔、銅張積層板、及びプリント配線板 |
CN112154525A (zh) * | 2018-05-29 | 2020-12-29 | 积水保力马科技株式会社 | 金属触点构件和橡胶开关构件 |
CN112368826A (zh) | 2018-06-22 | 2021-02-12 | 积水保力马科技株式会社 | 热传导性片 |
WO2020009229A1 (ja) * | 2018-07-06 | 2020-01-09 | タツタ電線株式会社 | プリント配線基板用貼付フィルム |
KR102480377B1 (ko) * | 2018-08-10 | 2022-12-23 | 미쓰이금속광업주식회사 | 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판 |
JPWO2020067141A1 (ja) | 2018-09-26 | 2021-09-30 | 積水ポリマテック株式会社 | 熱伝導性シート |
JP6895936B2 (ja) | 2018-09-28 | 2021-06-30 | 古河電気工業株式会社 | 表面処理銅箔、並びにこれを用いた銅張積層板及び回路基板 |
WO2020066074A1 (ja) * | 2018-09-28 | 2020-04-02 | 三井金属鉱業株式会社 | 多層配線板の製造方法 |
JP6622443B1 (ja) * | 2018-09-28 | 2019-12-18 | 三井金属鉱業株式会社 | 多層配線板の製造方法 |
TWI768213B (zh) * | 2018-11-08 | 2022-06-21 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜、電磁波屏蔽膜之製造方法及屏蔽印刷配線板之製造方法 |
CN112969824A (zh) * | 2018-11-19 | 2021-06-15 | 三井金属矿业株式会社 | 表面处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板 |
US10581081B1 (en) | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
US20220183158A1 (en) * | 2019-03-26 | 2022-06-09 | Mitsui Mining & Smelting Co., Ltd. | Method of manufacturing printed wiring board |
CN113811641B (zh) * | 2019-05-15 | 2023-12-05 | 住友电气工业株式会社 | 印刷布线板 |
JP7300976B2 (ja) * | 2019-12-13 | 2023-06-30 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
JP2021095596A (ja) * | 2019-12-13 | 2021-06-24 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
JP7421208B2 (ja) | 2019-12-24 | 2024-01-24 | 日本電解株式会社 | 表面処理銅箔及びその製造方法 |
JP7177956B2 (ja) * | 2020-02-04 | 2022-11-24 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
CN115038819A (zh) * | 2020-02-04 | 2022-09-09 | 三井金属矿业株式会社 | 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板 |
KR20230160813A (ko) * | 2021-03-26 | 2023-11-24 | 미쓰이금속광업주식회사 | 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판 |
WO2022202540A1 (ja) * | 2021-03-26 | 2022-09-29 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
CN115226325A (zh) * | 2021-04-14 | 2022-10-21 | 鹏鼎控股(深圳)股份有限公司 | 电路板的制作方法以及电路板 |
WO2022255420A1 (ja) * | 2021-06-03 | 2022-12-08 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5228965A (en) * | 1990-10-30 | 1993-07-20 | Gould Inc. | Method and apparatus for applying surface treatment to metal foil |
JP4567360B2 (ja) * | 2004-04-02 | 2010-10-20 | 三井金属鉱業株式会社 | 銅箔の製造方法及びその製造方法で得られる銅箔 |
JP2011148192A (ja) * | 2010-01-21 | 2011-08-04 | Jx Nippon Mining & Metals Corp | 銅張積層板の製造方法、それに用いる銅箔、及び銅張積層板のラミネート装置。 |
CN103125149B (zh) * | 2010-09-27 | 2016-09-14 | 吉坤日矿日石金属株式会社 | 印刷电路板用铜箔、其制造方法、印刷电路板用树脂基板以及印刷电路板 |
JP5204908B1 (ja) | 2012-03-26 | 2013-06-05 | Jx日鉱日石金属株式会社 | キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板 |
JP5858849B2 (ja) * | 2012-03-30 | 2016-02-10 | Jx日鉱日石金属株式会社 | 金属箔 |
JP5481577B1 (ja) * | 2012-09-11 | 2014-04-23 | Jx日鉱日石金属株式会社 | キャリア付き銅箔 |
CN105102678B (zh) * | 2013-02-14 | 2018-06-12 | 三井金属矿业株式会社 | 表面处理铜箔及用表面处理铜箔得到的覆铜层压板 |
WO2014133164A1 (ja) * | 2013-02-28 | 2014-09-04 | 三井金属鉱業株式会社 | 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板 |
WO2014157728A1 (ja) * | 2013-03-29 | 2014-10-02 | Jx日鉱日石金属株式会社 | キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法 |
CN104120471B (zh) * | 2013-04-26 | 2018-06-08 | Jx日矿日石金属株式会社 | 高频电路用铜箔、覆铜板、印刷配线板、带载体的铜箔、电子设备及印刷配线板的制造方法 |
JP5470493B1 (ja) | 2013-07-23 | 2014-04-16 | Jx日鉱日石金属株式会社 | 樹脂基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 |
MY168616A (en) * | 2013-07-23 | 2018-11-14 | Jx Nippon Mining & Metals Corp | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board |
MY177676A (en) * | 2015-07-03 | 2020-09-23 | Mitsui Mining & Smelting Co Ltd | Roughened copper foil, copper-clad laminate and printed wiring board |
WO2017018232A1 (ja) * | 2015-07-29 | 2017-02-02 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
-
2017
- 2017-03-28 CN CN201780023464.6A patent/CN109072472B/zh active Active
- 2017-03-28 JP JP2018511957A patent/JP6945523B2/ja active Active
- 2017-03-28 KR KR1020187024895A patent/KR102338103B1/ko active IP Right Grant
- 2017-03-28 MY MYPI2018703757A patent/MY186859A/en unknown
- 2017-03-28 WO PCT/JP2017/012678 patent/WO2017179416A1/ja active Application Filing
- 2017-04-10 TW TW106111923A patent/TWI711139B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP6945523B2 (ja) | 2021-10-06 |
CN109072472B (zh) | 2020-10-16 |
TW201742212A (zh) | 2017-12-01 |
TWI711139B (zh) | 2020-11-21 |
KR20180133845A (ko) | 2018-12-17 |
CN109072472A (zh) | 2018-12-21 |
KR102338103B1 (ko) | 2021-12-10 |
JPWO2017179416A1 (ja) | 2019-02-21 |
WO2017179416A1 (ja) | 2017-10-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY186859A (en) | Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same | |
PH12017502362A1 (en) | Roughened copper foil, copper-clad laminate and printed wiring board | |
PH12020551737A1 (en) | Surface treated copper foil, copper clad laminate, and printed circuit board | |
MY180511A (en) | Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device | |
MY186397A (en) | Roughened copper foil, copper-clad laminate, and printed wiring board | |
PH12019000429A1 (en) | Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna | |
MY177771A (en) | Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device | |
MY179112A (en) | Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device | |
MY185462A (en) | Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board | |
MY176763A (en) | Carrier-attached copper foil, laminate, method for manufacturing printed- wiring board and method for manufacturing electronic device | |
MY177723A (en) | Surface-treated copper foil, laminate using same, printed wiring board, electronic device, and method for fabricating printed wiring board | |
MY173569A (en) | Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device | |
MY186266A (en) | Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board | |
MY186451A (en) | Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board | |
MY170684A (en) | Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board | |
PH12014502509B1 (en) | Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board | |
MY168616A (en) | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board | |
MY181562A (en) | Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board | |
MY186394A (en) | Surface-treated copper foil, laminate using same, copper foil, printed wiring board, electronic device, and method for fabricating printed wiring board | |
MY176312A (en) | Surface-treated metal material, metal foil with carrier, connector, terminal, laminate, shielding tape, shielding material, printed wiring board, processed metal member, electronic device, and method for manufacturing printed wiring board | |
PH12015501174A1 (en) | Surface-treated electrolytic copper foil, laminate, and printed circuit board | |
MY176361A (en) | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board | |
MY188258A (en) | Copper foil for printed circuit board production, copper foil with carrier, and copper-clad laminate plate, and printed circuit board production method using copper foil for printed circuit board production, copper foil with carrier, and copper-clad laminate plate | |
MY185927A (en) | Copper foil provided with carrier, laminate, method for fabricating printed wiring board and method for fabricating electronic device | |
MY196755A (en) | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device |