MY182200A - Guide vane and jetting apparatus - Google Patents

Guide vane and jetting apparatus

Info

Publication number
MY182200A
MY182200A MYPI2014003017A MYPI2014003017A MY182200A MY 182200 A MY182200 A MY 182200A MY PI2014003017 A MYPI2014003017 A MY PI2014003017A MY PI2014003017 A MYPI2014003017 A MY PI2014003017A MY 182200 A MY182200 A MY 182200A
Authority
MY
Malaysia
Prior art keywords
cylindrical plate
prescribed
guide vane
stood
faced
Prior art date
Application number
MYPI2014003017A
Other languages
English (en)
Inventor
Shingo Nishida
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MY182200A publication Critical patent/MY182200A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
MYPI2014003017A 2012-04-27 2013-03-19 Guide vane and jetting apparatus MY182200A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012103249A JP5601342B2 (ja) 2012-04-27 2012-04-27 偏流板及び噴流装置
PCT/JP2013/057832 WO2013161453A1 (ja) 2012-04-27 2013-03-19 偏流板及び噴流装置

Publications (1)

Publication Number Publication Date
MY182200A true MY182200A (en) 2021-01-18

Family

ID=49482790

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014003017A MY182200A (en) 2012-04-27 2013-03-19 Guide vane and jetting apparatus

Country Status (10)

Country Link
US (1) US9622395B2 (ja)
EP (1) EP2842683B1 (ja)
JP (1) JP5601342B2 (ja)
KR (1) KR101524993B1 (ja)
CN (1) CN104254423B (ja)
IN (1) IN2014DN09117A (ja)
MY (1) MY182200A (ja)
PH (1) PH12014502409B1 (ja)
SG (1) SG11201406926XA (ja)
WO (1) WO2013161453A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5614518B1 (ja) * 2013-03-29 2014-10-29 千住金属工業株式会社 偏流板及び噴流装置
DE102013110731B3 (de) * 2013-09-27 2014-11-06 Ersa Gmbh Trennstreifen-Anordnung für Lötdüse, sowie Lötdüseneinrichtung zum selektiven Wellenlöten
CN104594990B (zh) * 2015-02-27 2017-06-23 天纳克（苏州）排放系统有限公司 混合管及其排气处理装置
CN106975816A (zh) * 2017-03-28 2017-07-25 深圳市联合超越电子设备有限公司 喷口角度可调的喷流装置
CN113262392B (zh) * 2021-04-25 2022-08-09 泰尔茂医疗产品(杭州)有限公司 连接器

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154371A (en) * 1981-03-19 1982-09-24 Tdk Corp Method and device for soldering
GB2117690B (en) * 1982-04-02 1986-01-08 Zevatron Gmbh Apparatus for soldering workpieces
JPS63137570A (ja) * 1986-11-27 1988-06-09 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPH01114165A (ja) 1987-10-27 1989-05-02 Mitsubishi Electric Corp 垂直偏向回路
JPH01143762A (ja) 1987-11-26 1989-06-06 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPH0641722Y2 (ja) 1988-01-29 1994-11-02 千住金属工業株式会社 噴流はんだ槽
JPH0314059A (ja) 1989-06-13 1991-01-22 Nec Corp バスシステム
JPH0314059U (ja) * 1989-06-20 1991-02-13
JPH10313171A (ja) * 1997-05-12 1998-11-24 Nihon Dennetsu Keiki Co Ltd はんだ付け装置
JPH1144409A (ja) * 1997-07-23 1999-02-16 Kozo Sekimoto 燃焼炉
JP4136887B2 (ja) 2003-06-17 2008-08-20 千住システムテクノロジー株式会社 半田槽用ポンプ及びそれを使用する半田槽
TWI364341B (en) * 2003-10-10 2012-05-21 Senju Metal Industry Co Wave soldering tank
CN101112139B (zh) 2005-02-07 2012-01-25 千住金属工业株式会社 喷流焊料槽
ATE524266T1 (de) * 2006-04-05 2011-09-15 Senju Metal Industry Co Wellenlötbehälter
JP2009019781A (ja) * 2007-07-10 2009-01-29 Showa Denko Kk 熱交換器
CN201089051Y (zh) * 2007-08-03 2008-07-23 陈许松 无铅波峰焊锡机
JP5332654B2 (ja) 2009-01-27 2013-11-06 千住金属工業株式会社 噴流はんだ槽
CN101698259A (zh) * 2009-09-30 2010-04-28 苏州明富自动化设备有限公司 一种焊锡喷锡装置

Also Published As

Publication number Publication date
KR101524993B1 (ko) 2015-06-01
KR20140146219A (ko) 2014-12-24
PH12014502409A1 (en) 2015-01-12
CN104254423B (zh) 2015-11-25
US20150305216A1 (en) 2015-10-22
EP2842683A4 (en) 2016-04-13
EP2842683B1 (en) 2017-10-18
SG11201406926XA (en) 2015-02-27
US9622395B2 (en) 2017-04-11
JP5601342B2 (ja) 2014-10-08
WO2013161453A1 (ja) 2013-10-31
EP2842683A1 (en) 2015-03-04
PH12014502409B1 (en) 2015-01-12
CN104254423A (zh) 2014-12-31
JP2013230481A (ja) 2013-11-14
IN2014DN09117A (ja) 2015-05-22

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