MX2017001184A - Sistema de boquilla para soldadura de onda y método de soldadura de onda. - Google Patents

Sistema de boquilla para soldadura de onda y método de soldadura de onda.

Info

Publication number
MX2017001184A
MX2017001184A MX2017001184A MX2017001184A MX2017001184A MX 2017001184 A MX2017001184 A MX 2017001184A MX 2017001184 A MX2017001184 A MX 2017001184A MX 2017001184 A MX2017001184 A MX 2017001184A MX 2017001184 A MX2017001184 A MX 2017001184A
Authority
MX
Mexico
Prior art keywords
wave soldering
nozzle
wave
housing
nozzle plate
Prior art date
Application number
MX2017001184A
Other languages
English (en)
Inventor
Leo Hueste Gregory
Original Assignee
Illinois Tool Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works filed Critical Illinois Tool Works
Publication of MX2017001184A publication Critical patent/MX2017001184A/es

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0653Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • B23K1/085Wave soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0669Solder baths with dipping means
    • B23K3/0676Conveyors therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • H05K13/0465Surface mounting by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/044Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

Una máquina de soldadura de onda incluye una carcasa y un transportador acoplado a la carcasa. El transportador esta configurado para suministrar una placa de circuito impreso a través de la carcasa. La máquina de soldadura de onda incluye además una estación de soldadura de onda acoplada a la carcasa. La estación de soldadura de onda incluye un depósito de material de soldadura, y un sistema de boquilla de soldadura de onda adaptado para crear una onda de soldadura. El sistema de boquilla de soldadura de onda tiene un armazón de boquilla, y una placa de boquilla asegurada al armazón de boquilla. La placa de boquilla incluye una primera zona de aberturas situada adyacente a un borde delantero de la placa de boquilla, una segunda zona de aberturas situada cerca de un centro de la placa de boquilla, y una tercera zona que no tiene aberturas situada adyacente a un borde posterior de la placa de boquilla.
MX2017001184A 2014-08-21 2015-07-10 Sistema de boquilla para soldadura de onda y método de soldadura de onda. MX2017001184A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/465,559 US9370838B2 (en) 2014-08-21 2014-08-21 Wave soldering nozzle system and method of wave soldering
PCT/US2015/039899 WO2016028407A1 (en) 2014-08-21 2015-07-10 Wave soldering nozzle machine, wave soldering nozzle system and method of wave soldering

Publications (1)

Publication Number Publication Date
MX2017001184A true MX2017001184A (es) 2017-05-08

Family

ID=53719987

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017001184A MX2017001184A (es) 2014-08-21 2015-07-10 Sistema de boquilla para soldadura de onda y método de soldadura de onda.

Country Status (9)

Country Link
US (1) US9370838B2 (es)
EP (1) EP3183086B1 (es)
CN (1) CN106660152B (es)
CA (1) CA2956299A1 (es)
ES (1) ES2770735T3 (es)
MX (1) MX2017001184A (es)
PL (1) PL3183086T3 (es)
TW (1) TWI644604B (es)
WO (1) WO2016028407A1 (es)

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DE102013217952B3 (de) * 2013-09-09 2014-11-06 Ersa Gmbh Vorrichtung zur Zuführung eines Heißgasstroms
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US10029326B2 (en) 2016-10-26 2018-07-24 Illinois Tool Works Inc. Wave soldering nozzle having automatic adjustable throat width
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US20190366460A1 (en) * 2018-06-01 2019-12-05 Progress Y&Y Corp. Soldering apparatus and solder nozzle module thereof
US10780516B2 (en) * 2018-06-14 2020-09-22 Illinois Tool Works Inc. Wave solder nozzle with automated adjustable sliding plate to vary solder wave width
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CN110548952A (zh) * 2019-10-14 2019-12-10 深圳市劲拓自动化设备股份有限公司 焊接装置及选择性波峰焊装置
CN110539050A (zh) * 2019-10-14 2019-12-06 深圳市劲拓自动化设备股份有限公司 焊接装置及选择性波峰焊装置
CN113333234A (zh) * 2020-03-03 2021-09-03 伊利诺斯工具制品有限公司 分配装置
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CN113927121B (zh) * 2021-10-15 2023-02-24 扬州扬杰电子科技股份有限公司 基于波峰焊机的光伏模块二极管预储锡装置

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Also Published As

Publication number Publication date
PL3183086T3 (pl) 2020-06-15
US20160052074A1 (en) 2016-02-25
EP3183086A1 (en) 2017-06-28
CN106660152B (zh) 2019-11-15
TWI644604B (zh) 2018-12-11
TW201608948A (zh) 2016-03-01
CN106660152A (zh) 2017-05-10
CA2956299A1 (en) 2016-02-25
WO2016028407A1 (en) 2016-02-25
US9370838B2 (en) 2016-06-21
EP3183086B1 (en) 2019-12-11
ES2770735T3 (es) 2020-07-02

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