MY165538A - Cmp pad with local area transparency - Google Patents

Cmp pad with local area transparency

Info

Publication number
MY165538A
MY165538A MYPI2012003162A MYPI2012003162A MY165538A MY 165538 A MY165538 A MY 165538A MY PI2012003162 A MYPI2012003162 A MY PI2012003162A MY PI2012003162 A MYPI2012003162 A MY PI2012003162A MY 165538 A MY165538 A MY 165538A
Authority
MY
Malaysia
Prior art keywords
polishing
aperture
region
polishing layer
release sheet
Prior art date
Application number
MYPI2012003162A
Other languages
English (en)
Inventor
William Allison
Ping Huang
Diane Scott
Richard Frentzel
Robert Kerprich
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of MY165538A publication Critical patent/MY165538A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
MYPI2012003162A 2010-01-13 2011-01-11 Cmp pad with local area transparency MY165538A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/657,135 US9017140B2 (en) 2010-01-13 2010-01-13 CMP pad with local area transparency

Publications (1)

Publication Number Publication Date
MY165538A true MY165538A (en) 2018-04-03

Family

ID=43896755

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012003162A MY165538A (en) 2010-01-13 2011-01-11 Cmp pad with local area transparency

Country Status (10)

Country Link
US (1) US9017140B2 (enExample)
EP (1) EP2523777B1 (enExample)
JP (3) JP5503019B2 (enExample)
KR (1) KR101495145B1 (enExample)
CN (1) CN102770239B (enExample)
IL (1) IL220649A (enExample)
MY (1) MY165538A (enExample)
SG (2) SG182327A1 (enExample)
TW (1) TWI490083B (enExample)
WO (1) WO2011088057A1 (enExample)

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IL220649A (en) 2016-10-31
WO2011088057A1 (en) 2011-07-21
US9017140B2 (en) 2015-04-28
TWI490083B (zh) 2015-07-01
KR20120135210A (ko) 2012-12-12
KR101495145B1 (ko) 2015-02-24
CN102770239A (zh) 2012-11-07
JP2014050959A (ja) 2014-03-20
JP5820869B2 (ja) 2015-11-24
JP2015096293A (ja) 2015-05-21
CN102770239B (zh) 2016-04-20
SG182327A1 (en) 2012-08-30
IL220649A0 (en) 2012-08-30
JP2013517146A (ja) 2013-05-16
JP5503019B2 (ja) 2014-05-28
TW201143985A (en) 2011-12-16
SG10201408738RA (en) 2015-02-27
US20110171883A1 (en) 2011-07-14
EP2523777B1 (en) 2015-12-02
EP2523777A1 (en) 2012-11-21

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