JP5503019B2 - 局部透明体を有するｃｍｐパッド - Google Patents

局部透明体を有するｃｍｐパッド Download PDF

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Publication number
JP5503019B2
JP5503019B2 JP2012549005A JP2012549005A JP5503019B2 JP 5503019 B2 JP5503019 B2 JP 5503019B2 JP 2012549005 A JP2012549005 A JP 2012549005A JP 2012549005 A JP2012549005 A JP 2012549005A JP 5503019 B2 JP5503019 B2 JP 5503019B2
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Prior art keywords
polishing
lat
pad
opaque
polishing pad
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Japanese (ja)
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JP2013517146A (ja
Inventor
ウィリアム アリソン，
ピン ホワン，
ダイアン スコット，
リチャード フレンツェル，
ロバート ケルプリッチ，
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ネクスプラナー コーポレイション
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2012549005A 2010-01-13 2011-01-11 局部透明体を有するｃｍｐパッド Active JP5503019B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/657,135 2010-01-13
US12/657,135 US9017140B2 (en) 2010-01-13 2010-01-13 CMP pad with local area transparency
PCT/US2011/020870 WO2011088057A1 (en) 2010-01-13 2011-01-11 Cmp pad with local area transparency

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013259788A Division JP5820869B2 (ja) 2010-01-13 2013-12-17 局部透明体を有するｃｍｐパッド

Publications (2)

Publication Number Publication Date
JP2013517146A JP2013517146A (ja) 2013-05-16
JP5503019B2 true JP5503019B2 (ja) 2014-05-28

Family

ID=43896755

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2012549005A Active JP5503019B2 (ja) 2010-01-13 2011-01-11 局部透明体を有するｃｍｐパッド
JP2013259788A Active JP5820869B2 (ja) 2010-01-13 2013-12-17 局部透明体を有するｃｍｐパッド
JP2015008413A Pending JP2015096293A (ja) 2010-01-13 2015-01-20 局部透明体を有するｃｍｐパッド

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2013259788A Active JP5820869B2 (ja) 2010-01-13 2013-12-17 局部透明体を有するｃｍｐパッド
JP2015008413A Pending JP2015096293A (ja) 2010-01-13 2015-01-20 局部透明体を有するｃｍｐパッド

Country Status (10)

Country Link
US (1) US9017140B2 (enExample)
EP (1) EP2523777B1 (enExample)
JP (3) JP5503019B2 (enExample)
KR (1) KR101495145B1 (enExample)
CN (1) CN102770239B (enExample)
IL (1) IL220649A (enExample)
MY (1) MY165538A (enExample)
SG (2) SG182327A1 (enExample)
TW (1) TWI490083B (enExample)
WO (1) WO2011088057A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102624629B1 (ko) * 2021-11-19 2024-01-15 에스케이하이닉스 주식회사 윈도우 삽입형 연마패드 및 이의 제조방법

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8628384B2 (en) * 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
US8657653B2 (en) 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
US20130205679A1 (en) * 2012-02-14 2013-08-15 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
US8986585B2 (en) * 2012-03-22 2015-03-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers having a window
US9156125B2 (en) 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US20140120802A1 (en) * 2012-10-31 2014-05-01 Wayne O. Duescher Abrasive platen wafer surface optical monitoring system
US9649742B2 (en) * 2013-01-22 2017-05-16 Nexplanar Corporation Polishing pad having polishing surface with continuous protrusions
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259820B2 (en) * 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9238294B2 (en) * 2014-06-18 2016-01-19 Nexplanar Corporation Polishing pad having porogens with liquid filler
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US20160144477A1 (en) * 2014-11-21 2016-05-26 Diane Scott Coated compressive subpad for chemical mechanical polishing
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
US9475168B2 (en) * 2015-03-26 2016-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad window
WO2017066077A1 (en) * 2015-10-16 2017-04-20 Applied Materials, Inc. Method and apparatus for forming advanced polishing pads using an additive manufacturing process
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN113146464A (zh) 2016-01-19 2021-07-23 应用材料公司 多孔化学机械抛光垫
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
TWI593511B (zh) 2016-06-08 2017-08-01 智勝科技股份有限公司 研磨墊及研磨方法
CN109641342A (zh) * 2016-08-31 2019-04-16 应用材料公司 具有环形工作台或抛光垫的抛光系统
KR102329099B1 (ko) * 2017-01-20 2021-11-19 어플라이드 머티어리얼스, 인코포레이티드 Cmp 응용들을 위한 얇은 플라스틱 연마 물품
US20180265989A1 (en) * 2017-03-17 2018-09-20 Toshiba Memory Corporation Substrate treatment apparatus and substrate treatment method
JP6360586B1 (ja) * 2017-04-13 2018-07-18 三菱電線工業株式会社 Ｃｍｐ装置のウエハ保持用の弾性膜
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
KR101966809B1 (ko) * 2017-05-18 2019-08-13 세메스 주식회사 기판 연마 장치 및 기판 연마 방법
CN110692124A (zh) * 2017-06-01 2020-01-14 东京毅力科创株式会社 吸杂层形成装置、吸杂层形成方法以及计算机存储介质
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP6948878B2 (ja) * 2017-08-22 2021-10-13 ラピスセミコンダクタ株式会社 半導体製造装置及び半導体基板の研磨方法
US10636761B2 (en) * 2017-08-29 2020-04-28 Electronics And Telecommunications Reearch Institute Method of fabricating a semiconductor package
US10465097B2 (en) * 2017-11-16 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads
US11192215B2 (en) * 2017-11-16 2021-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with pad wear indicator
US11325221B2 (en) * 2017-11-16 2022-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with multipurpose composite window
JP7373503B2 (ja) 2018-05-07 2023-11-02 アプライド マテリアルズ インコーポレイテッド 親水性及びゼータ電位の調節可能な化学機械研磨パッド
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US12138735B2 (en) * 2018-11-28 2024-11-12 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-layered windows for use in chemical-mechanical planarization systems
KR102674027B1 (ko) 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
KR102142236B1 (ko) * 2020-01-10 2020-08-06 (주)제이쓰리 초평탄화 형상제어 웨이퍼 가공장치
CN115379926A (zh) * 2020-03-31 2022-11-22 株式会社德山 Cmp抛光垫用中空微球
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US20220234167A1 (en) * 2021-01-25 2022-07-28 Cmc Materials, Inc. Endpoint window with controlled texture surface
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
WO2022186992A1 (en) * 2021-03-03 2022-09-09 Applied Materials, Inc. Acoustic monitoring and sensors for chemical mechanical polishing
CN115122232B (zh) * 2021-03-29 2024-08-20 万华化学集团电子材料有限公司 一种微孔聚氨酯抛光垫的制备方法、抛光垫及其应用
JP7696822B2 (ja) * 2021-12-28 2025-06-23 株式会社荏原製作所 研磨装置および研磨方法

Family Cites Families (139)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196353A (en) 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
US6614529B1 (en) 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5658183A (en) 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5433651A (en) 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
JP3270282B2 (ja) 1994-02-21 2002-04-02 株式会社東芝 半導体製造装置及び半導体装置の製造方法
JP3313505B2 (ja) 1994-04-14 2002-08-12 株式会社日立製作所 研磨加工法
US6676717B1 (en) 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6537133B1 (en) 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US6719818B1 (en) 1995-03-28 2004-04-13 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6876454B1 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5964643A (en) 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5838447A (en) 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5609517A (en) 1995-11-20 1997-03-11 International Business Machines Corporation Composite polishing pad
US5733176A (en) 1996-05-24 1998-03-31 Micron Technology, Inc. Polishing pad and method of use
US5872633A (en) 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
US6648733B2 (en) 1997-04-04 2003-11-18 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US6068539A (en) 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6994607B2 (en) 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US20040082271A1 (en) 1999-01-25 2004-04-29 Wiswesser Andreas Norbert Polishing pad with window
US6716085B2 (en) 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
US6832950B2 (en) 2002-10-28 2004-12-21 Applied Materials, Inc. Polishing pad with window
EP1176630B1 (en) 1999-03-31 2007-06-27 Nikon Corporation Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device
US6146242A (en) 1999-06-11 2000-11-14 Strasbaugh, Inc. Optical view port for chemical mechanical planarization endpoint detection
US6171181B1 (en) 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
WO2001015861A1 (en) 1999-08-27 2001-03-08 Asahi Kasei Kabushiki Kaisha Polishing pad and polisher
US6454630B1 (en) 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
US6524164B1 (en) 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
DE60011798T2 (de) 1999-09-29 2005-11-10 Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington Schleifkissen
US6726528B2 (en) 2002-05-14 2004-04-27 Strasbaugh Polishing pad with optical sensor
EP1257386A1 (en) 2000-02-25 2002-11-20 Rodel Holdings, Inc. Polishing pad with a transparent portion
KR100789663B1 (ko) 2000-03-15 2007-12-31 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 연마층에 투명 윈도우 부분을 갖는 연마 패드
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US7374477B2 (en) 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
US6685537B1 (en) 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
US6612901B1 (en) 2000-06-07 2003-09-02 Micron Technology, Inc. Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6485354B1 (en) 2000-06-09 2002-11-26 Strasbaugh Polishing pad with built-in optical sensor
US6428386B1 (en) 2000-06-16 2002-08-06 Micron Technology, Inc. Planarizing pads, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
JP2002001647A (ja) * 2000-06-19 2002-01-08 Rodel Nitta Co 研磨パッド
ATE496730T1 (de) 2000-09-29 2011-02-15 Strasbaugh Inc Polierkissen mit eingebautem optischem sensor
AU2001291143A1 (en) 2000-10-06 2002-04-22 Cabot Microelectronics Corporation Polishing pad comprising a filled translucent region
US20020072296A1 (en) 2000-11-29 2002-06-13 Muilenburg Michael J. Abrasive article having a window system for polishing wafers, and methods
US6623331B2 (en) 2001-02-16 2003-09-23 Cabot Microelectronics Corporation Polishing disk with end-point detection port
WO2002070200A1 (en) 2001-03-01 2002-09-12 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US20020137431A1 (en) 2001-03-23 2002-09-26 Labunsky Michael A. Methods and apparatus for polishing and planarization
US6641470B1 (en) 2001-03-30 2003-11-04 Lam Research Corporation Apparatus for accurate endpoint detection in supported polishing pads
DE60228784D1 (de) 2001-04-25 2008-10-23 Jsr Corp Lichtduchlässiges Polierkissen für eine Halbleiterschleife
JP4131632B2 (ja) 2001-06-15 2008-08-13 株式会社荏原製作所 ポリッシング装置及び研磨パッド
JP4570286B2 (ja) 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
JP2003133270A (ja) 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
US6722249B2 (en) 2001-11-06 2004-04-20 Rodel Holdings, Inc Method of fabricating a polishing pad having an optical window
US6702866B2 (en) 2002-01-10 2004-03-09 Speedfam-Ipec Corporation Homogeneous fixed abrasive polishing pad
US7030018B2 (en) 2002-02-04 2006-04-18 Kla-Tencor Technologies Corp. Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
US6875077B2 (en) 2002-03-18 2005-04-05 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making
US6524176B1 (en) 2002-03-25 2003-02-25 Macronix International Co. Ltd. Polishing pad
US20030207661A1 (en) * 2002-05-01 2003-11-06 Alexander Tregub Annealing of CMP polishing pads
US6752690B1 (en) * 2002-06-12 2004-06-22 Clinton O. Fruitman Method of making polishing pad for planarization of semiconductor wafers
KR20050059123A (ko) 2002-08-30 2005-06-17 도레이 가부시끼가이샤 연마 패드, 정반 홀 커버 및 연마장치 및 연마방법 및 반도체 디바이스의 제조방법
US20070010169A1 (en) 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
WO2004028744A1 (en) 2002-09-25 2004-04-08 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
TWI220405B (en) 2002-11-19 2004-08-21 Iv Technologies Co Ltd Method of fabricating a polishing pad having a detection window thereon
US8845852B2 (en) * 2002-11-27 2014-09-30 Toyo Tire & Rubber Co., Ltd. Polishing pad and method of producing semiconductor device
US6806100B1 (en) 2002-12-24 2004-10-19 Lam Research Corporation Molded end point detection window for chemical mechanical planarization
US6676483B1 (en) 2003-02-03 2004-01-13 Rodel Holdings, Inc. Anti-scattering layer for polishing pad windows
US6960120B2 (en) 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6832947B2 (en) * 2003-02-10 2004-12-21 Cabot Microelectronics Corporation CMP pad with composite transparent window
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7377840B2 (en) 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
SG185141A1 (en) 2003-03-25 2012-11-29 Neopad Technologies Corp Customized polish pads for chemical mechanical planarization
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
EP1466699A1 (en) 2003-04-09 2004-10-13 JSR Corporation Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method
US7238097B2 (en) 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
US20040209066A1 (en) 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
KR20040093402A (ko) 2003-04-22 2004-11-05 제이에스알 가부시끼가이샤 연마 패드 및 반도체 웨이퍼의 연마 방법
KR100532440B1 (ko) 2003-06-05 2005-11-30 삼성전자주식회사 윈도로의 유체의 침투를 막는 실링 장벽부를 가지는 화학기계적 연마 장비에 사용되는 연마 패드
KR100541545B1 (ko) 2003-06-16 2006-01-11 삼성전자주식회사 화학기계적 연마 장비의 연마 테이블
US6884156B2 (en) 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US6997777B2 (en) 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
KR100526877B1 (ko) 2003-06-23 2005-11-09 삼성전자주식회사 반도체 웨이퍼용 ｃｍｐ 설비의 폴리싱 패드
US7183213B2 (en) 2003-07-17 2007-02-27 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
US7195539B2 (en) 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7264536B2 (en) 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US8066552B2 (en) 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US20050173259A1 (en) 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US7258602B2 (en) 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
US7513818B2 (en) 2003-10-31 2009-04-07 Applied Materials, Inc. Polishing endpoint detection system and method using friction sensor
US6984163B2 (en) 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US7132033B2 (en) 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad
CN1926666A (zh) 2004-03-11 2007-03-07 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
USD559064S1 (en) 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
USD559063S1 (en) 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
US7204742B2 (en) 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US6986705B2 (en) 2004-04-05 2006-01-17 Rimpad Tech Ltd. Polishing pad and method of making same
CN2841246Y (zh) * 2004-04-21 2006-11-29 应用材料股份有限公司 研磨垫
CN100424830C (zh) 2004-04-23 2008-10-08 Jsr株式会社 用于抛光半导体晶片的抛光垫、层叠体和方法
US20050245171A1 (en) 2004-04-28 2005-11-03 Jsr Corporation Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
US7354334B1 (en) 2004-05-07 2008-04-08 Applied Materials, Inc. Reducing polishing pad deformation
US7018581B2 (en) * 2004-06-10 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad with reduced stress window
US7252871B2 (en) 2004-06-16 2007-08-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a pressure relief channel
US7182670B2 (en) 2004-09-22 2007-02-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a streamlined windowpane
USD560457S1 (en) 2004-10-05 2008-01-29 Jsr Corporation Polishing pad
USD559648S1 (en) 2004-10-05 2008-01-15 Jsr Corporation Polishing pad
USD559065S1 (en) 2004-10-05 2008-01-08 Jsr Corporation Polishing pad
US20060089094A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089095A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US7871309B2 (en) 2004-12-10 2011-01-18 Toyo Tire & Rubber Co., Ltd. Polishing pad
TWI385050B (zh) 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
EP1848569B1 (en) 2005-02-18 2016-11-23 NexPlanar Corporation Customized polishing pads for cmp and method of using the same
US7179159B2 (en) 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
US20060291530A1 (en) 2005-06-23 2006-12-28 Alexander Tregub Treatment of CMP pad window to improve transmittance
WO2007016498A2 (en) 2005-08-02 2007-02-08 Raytech Composites, Inc. Nonwoven polishing pads for chemical mechanical polishing
US7169017B1 (en) 2005-08-10 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a window with reduced surface roughness
US20070037487A1 (en) 2005-08-10 2007-02-15 Kuo Charles C Polishing pad having a sealed pressure relief channel
TW200709892A (en) 2005-08-18 2007-03-16 Rohm & Haas Elect Mat Transparent polishing pad
US7764377B2 (en) 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US7210980B2 (en) 2005-08-26 2007-05-01 Applied Materials, Inc. Sealed polishing pad, system and methods
TWI288048B (en) 2005-10-20 2007-10-11 Iv Technologies Co Ltd A polishing pad and producing method thereof
KR100882045B1 (ko) 2006-02-15 2009-02-09 어플라이드 머티어리얼스, 인코포레이티드 그루브형 서브패드를 구비한 폴리싱 장치
US7621798B1 (en) 2006-03-07 2009-11-24 Applied Materials, Inc. Reducing polishing pad deformation
US7497763B2 (en) 2006-03-27 2009-03-03 Freescale Semiconductor, Inc. Polishing pad, a polishing apparatus, and a process for using the polishing pad
US7179151B1 (en) 2006-03-27 2007-02-20 Freescale Semiconductor, Inc. Polishing pad, a polishing apparatus, and a process for using the polishing pad
JP2007260827A (ja) * 2006-03-28 2007-10-11 Toyo Tire & Rubber Co Ltd 研磨パッドの製造方法
JP2007307639A (ja) 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
JP5110677B2 (ja) 2006-05-17 2012-12-26 東洋ゴム工業株式会社 研磨パッド
US7942724B2 (en) 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
JP2008100331A (ja) * 2006-10-20 2008-05-01 Toyo Tire & Rubber Co Ltd 長尺研磨パッドの製造方法
JP2008226911A (ja) * 2007-03-08 2008-09-25 Jsr Corp 化学機械研磨用パッド、化学機械研磨用積層体パッド、および化学機械研磨方法
US8562389B2 (en) 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
US7455571B1 (en) 2007-06-20 2008-11-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Window polishing pad
EP2227350A4 (en) 2007-11-30 2011-01-12 Innopad Inc CUSHION WITH FINISHED MOUNTING WINDOW FOR CHEMICAL-MECHANICAL POLISHING
JP2009224384A (ja) 2008-03-13 2009-10-01 Toyo Tire & Rubber Co Ltd 研磨パッド及び半導体デバイスの製造方法
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US20110143539A1 (en) 2008-05-15 2011-06-16 Rajeev Bajaj Polishing pad with endpoint window and systems and methods using the same
US20090305610A1 (en) 2008-06-06 2009-12-10 Applied Materials, Inc. Multiple window pad assembly
US7967661B2 (en) 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102624629B1 (ko) * 2021-11-19 2024-01-15 에스케이하이닉스 주식회사 윈도우 삽입형 연마패드 및 이의 제조방법

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