CN102770239B - 具有局部区域透明部的化学机械抛光垫 - Google Patents

具有局部区域透明部的化学机械抛光垫 Download PDF

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Publication number
CN102770239B
CN102770239B CN201180005898.6A CN201180005898A CN102770239B CN 102770239 B CN102770239 B CN 102770239B CN 201180005898 A CN201180005898 A CN 201180005898A CN 102770239 B CN102770239 B CN 102770239B
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CN
China
Prior art keywords
polishing
polishing pad
hyalomere
polyureas
heat
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CN201180005898.6A
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English (en)
Chinese (zh)
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CN102770239A (zh
Inventor
W·阿利森
黄平
D·斯科特
R·弗伦泽尔
R·科普里希
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CMC Materials LLC
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Nexplanar Corp
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Publication date
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Publication of CN102770239A publication Critical patent/CN102770239A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201180005898.6A 2010-01-13 2011-01-11 具有局部区域透明部的化学机械抛光垫 Active CN102770239B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/657,135 2010-01-13
US12/657,135 US9017140B2 (en) 2010-01-13 2010-01-13 CMP pad with local area transparency
PCT/US2011/020870 WO2011088057A1 (en) 2010-01-13 2011-01-11 Cmp pad with local area transparency

Publications (2)

Publication Number Publication Date
CN102770239A CN102770239A (zh) 2012-11-07
CN102770239B true CN102770239B (zh) 2016-04-20

Family

ID=43896755

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180005898.6A Active CN102770239B (zh) 2010-01-13 2011-01-11 具有局部区域透明部的化学机械抛光垫

Country Status (10)

Country Link
US (1) US9017140B2 (enExample)
EP (1) EP2523777B1 (enExample)
JP (3) JP5503019B2 (enExample)
KR (1) KR101495145B1 (enExample)
CN (1) CN102770239B (enExample)
IL (1) IL220649A (enExample)
MY (1) MY165538A (enExample)
SG (2) SG182327A1 (enExample)
TW (1) TWI490083B (enExample)
WO (1) WO2011088057A1 (enExample)

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