KR101495145B1 - 국소 투명 구역을 가진 ｃｍｐ 패드 - Google Patents

국소 투명 구역을 가진 ｃｍｐ 패드 Download PDF

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Publication number
KR101495145B1
KR101495145B1 KR1020127019401A KR20127019401A KR101495145B1 KR 101495145 B1 KR101495145 B1 KR 101495145B1 KR 1020127019401 A KR1020127019401 A KR 1020127019401A KR 20127019401 A KR20127019401 A KR 20127019401A KR 101495145 B1 KR101495145 B1 KR 101495145B1
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South Korea
Prior art keywords
polishing
lat
pad
polishing pad
opaque
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Korean (ko)
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KR20120135210A (ko
Inventor
윌리엄 앨리슨
핑 후앙
다이안 스코트
리차드 프렌?
로버트 커프리치
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넥스플래너 코퍼레이션
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020127019401A 2010-01-13 2011-01-11 국소 투명 구역을 가진 ｃｍｐ 패드 Active KR101495145B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/657,135 2010-01-13
US12/657,135 US9017140B2 (en) 2010-01-13 2010-01-13 CMP pad with local area transparency
PCT/US2011/020870 WO2011088057A1 (en) 2010-01-13 2011-01-11 Cmp pad with local area transparency

Publications (2)

Publication Number Publication Date
KR20120135210A KR20120135210A (ko) 2012-12-12
KR101495145B1 true KR101495145B1 (ko) 2015-02-24

Family

ID=43896755

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127019401A Active KR101495145B1 (ko) 2010-01-13 2011-01-11 국소 투명 구역을 가진 ｃｍｐ 패드

Country Status (10)

Country Link
US (1) US9017140B2 (enExample)
EP (1) EP2523777B1 (enExample)
JP (3) JP5503019B2 (enExample)
KR (1) KR101495145B1 (enExample)
CN (1) CN102770239B (enExample)
IL (1) IL220649A (enExample)
MY (1) MY165538A (enExample)
SG (2) SG182327A1 (enExample)
TW (1) TWI490083B (enExample)
WO (1) WO2011088057A1 (enExample)

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US9017140B2 (en) 2015-04-28
TWI490083B (zh) 2015-07-01
KR20120135210A (ko) 2012-12-12
CN102770239A (zh) 2012-11-07
JP2014050959A (ja) 2014-03-20
MY165538A (en) 2018-04-03
JP5820869B2 (ja) 2015-11-24
JP2015096293A (ja) 2015-05-21
CN102770239B (zh) 2016-04-20
SG182327A1 (en) 2012-08-30
IL220649A0 (en) 2012-08-30
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