MY157634A - Silver Dust and Manufacturing Method Thereof - Google Patents

Silver Dust and Manufacturing Method Thereof

Info

Publication number
MY157634A
MY157634A MYPI2013701715A MYPI2013701715A MY157634A MY 157634 A MY157634 A MY 157634A MY PI2013701715 A MYPI2013701715 A MY PI2013701715A MY PI2013701715 A MYPI2013701715 A MY PI2013701715A MY 157634 A MY157634 A MY 157634A
Authority
MY
Malaysia
Prior art keywords
range
silver powder
paste
manufacturing
shoulder
Prior art date
Application number
MYPI2013701715A
Other languages
English (en)
Inventor
Okada Mika
Nihei Tomomichi
Kawakami Yuji
Terao Toshiaki
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of MY157634A publication Critical patent/MY157634A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05Metallic powder characterised by the size or surface area of the particles
    • B22F1/052Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/12Metallic powder containing non-metallic particles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
MYPI2013701715A 2011-06-21 2012-06-21 Silver Dust and Manufacturing Method Thereof MY157634A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011137622 2011-06-21

Publications (1)

Publication Number Publication Date
MY157634A true MY157634A (en) 2016-07-15

Family

ID=47422662

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013701715A MY157634A (en) 2011-06-21 2012-06-21 Silver Dust and Manufacturing Method Thereof

Country Status (6)

Country Link
JP (1) JP5278627B2 (ko)
KR (1) KR101883709B1 (ko)
CN (1) CN103079729B (ko)
MY (1) MY157634A (ko)
TW (1) TWI525641B (ko)
WO (1) WO2012176831A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012017542A1 (ja) * 2010-08-05 2012-02-09 トヨタ自動車株式会社 操舵制御装置
JP5500237B1 (ja) * 2012-12-05 2014-05-21 住友金属鉱山株式会社 銀粉
JP6282616B2 (ja) * 2014-07-30 2018-02-21 Dowaエレクトロニクス株式会社 銀粉およびその製造方法
WO2016129686A1 (ja) * 2015-02-13 2016-08-18 株式会社カネカ 太陽電池およびその製造方法、ならびに太陽電池モジュール
WO2020262115A1 (ja) * 2019-06-27 2020-12-30 Dowaエレクトロニクス株式会社 銀粉およびその製造方法
JP7093812B2 (ja) * 2019-06-27 2022-06-30 Dowaエレクトロニクス株式会社 銀粉およびその製造方法
WO2021193575A1 (ja) * 2020-03-24 2021-09-30 Dowaエレクトロニクス株式会社 銀粉の製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10251701A (ja) * 1997-03-10 1998-09-22 Tanaka Kikinzoku Kogyo Kk 高純度銀粉末の製造方法
JP3751154B2 (ja) 1998-10-22 2006-03-01 同和鉱業株式会社 銀粉の製造方法
JP2001226596A (ja) * 2000-02-14 2001-08-21 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト及びこれを用いて製造された半導体装置
JP3854103B2 (ja) * 2001-06-28 2006-12-06 住友ベークライト株式会社 導電性ペースト及び該ペーストを用いてなる半導体装置
JP3991218B2 (ja) 2002-12-20 2007-10-17 信越化学工業株式会社 導電性接着剤及びその製造方法
JP2004265607A (ja) 2003-01-23 2004-09-24 Matsushita Electric Ind Co Ltd 導電性ペースト、その導電性ペーストを用いた回路形成基板、およびその製造方法
JP4078990B2 (ja) * 2003-01-23 2008-04-23 松下電器産業株式会社 導電性ペースト、その導電性ペーストを用いた回路形成基板、およびその製造方法
JP4212035B2 (ja) * 2003-06-05 2009-01-21 株式会社ノリタケカンパニーリミテド 銀粉末を主体とする導体ペースト及びその製造方法
JP4248938B2 (ja) * 2003-06-06 2009-04-02 旭化成エレクトロニクス株式会社 導電性材料、導電性成形体、導電性成形体の製造方法
JP4489389B2 (ja) * 2003-07-29 2010-06-23 三井金属鉱業株式会社 微粒銀粉の製造方法
JP4976642B2 (ja) * 2004-02-10 2012-07-18 三井金属鉱業株式会社 高結晶性銀粉及びその製造方法
JP5028695B2 (ja) * 2004-11-25 2012-09-19 Dowaエレクトロニクス株式会社 銀粉およびその製造方法
JP2006196246A (ja) * 2005-01-12 2006-07-27 Sumitomo Electric Ind Ltd 導電性ペースト及びそれを用いた配線回路基板
JPWO2006098160A1 (ja) * 2005-03-14 2008-08-21 株式会社村田製作所 導電性ペーストおよびガラス構造体
JP4577515B2 (ja) * 2005-03-30 2010-11-10 三菱マテリアル株式会社 高分散性の銀微粒子とその製造方法、および用途
JP5148821B2 (ja) * 2005-09-20 2013-02-20 三井金属鉱業株式会社 フレーク銀粉の製造方法及び、その製造方法で製造されたフレーク銀粉
JP5110420B2 (ja) * 2007-03-20 2012-12-26 日立金属株式会社 Ag粉末、導体ペースト及び多層セラミック基板とその製造方法
JP2009270130A (ja) * 2008-04-30 2009-11-19 Aida Kagaku Kogyo Kk 銀粉末または銀合金粉末、銀または銀合金の造形体の製造方法並びに銀または銀合金の造形体
JP2010180471A (ja) * 2009-02-09 2010-08-19 Dowa Electronics Materials Co Ltd フレーク状銀粉及びその製造方法、並びに導電性ペースト

Also Published As

Publication number Publication date
KR101883709B1 (ko) 2018-08-01
CN103079729A (zh) 2013-05-01
KR20140024830A (ko) 2014-03-03
TWI525641B (zh) 2016-03-11
WO2012176831A1 (ja) 2012-12-27
TW201320105A (zh) 2013-05-16
JPWO2012176831A1 (ja) 2015-02-23
JP5278627B2 (ja) 2013-09-04
CN103079729B (zh) 2015-06-17

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