MY157634A - Silver Dust and Manufacturing Method Thereof - Google Patents
Silver Dust and Manufacturing Method ThereofInfo
- Publication number
- MY157634A MY157634A MYPI2013701715A MYPI2013701715A MY157634A MY 157634 A MY157634 A MY 157634A MY PI2013701715 A MYPI2013701715 A MY PI2013701715A MY PI2013701715 A MYPI2013701715 A MY PI2013701715A MY 157634 A MY157634 A MY 157634A
- Authority
- MY
- Malaysia
- Prior art keywords
- range
- silver powder
- paste
- manufacturing
- shoulder
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/12—Metallic powder containing non-metallic particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011137622 | 2011-06-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY157634A true MY157634A (en) | 2016-07-15 |
Family
ID=47422662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2013701715A MY157634A (en) | 2011-06-21 | 2012-06-21 | Silver Dust and Manufacturing Method Thereof |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5278627B2 (ko) |
KR (1) | KR101883709B1 (ko) |
CN (1) | CN103079729B (ko) |
MY (1) | MY157634A (ko) |
TW (1) | TWI525641B (ko) |
WO (1) | WO2012176831A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012017542A1 (ja) * | 2010-08-05 | 2012-02-09 | トヨタ自動車株式会社 | 操舵制御装置 |
JP5500237B1 (ja) * | 2012-12-05 | 2014-05-21 | 住友金属鉱山株式会社 | 銀粉 |
JP6282616B2 (ja) * | 2014-07-30 | 2018-02-21 | Dowaエレクトロニクス株式会社 | 銀粉およびその製造方法 |
WO2016129686A1 (ja) * | 2015-02-13 | 2016-08-18 | 株式会社カネカ | 太陽電池およびその製造方法、ならびに太陽電池モジュール |
WO2020262115A1 (ja) * | 2019-06-27 | 2020-12-30 | Dowaエレクトロニクス株式会社 | 銀粉およびその製造方法 |
JP7093812B2 (ja) * | 2019-06-27 | 2022-06-30 | Dowaエレクトロニクス株式会社 | 銀粉およびその製造方法 |
WO2021193575A1 (ja) * | 2020-03-24 | 2021-09-30 | Dowaエレクトロニクス株式会社 | 銀粉の製造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10251701A (ja) * | 1997-03-10 | 1998-09-22 | Tanaka Kikinzoku Kogyo Kk | 高純度銀粉末の製造方法 |
JP3751154B2 (ja) | 1998-10-22 | 2006-03-01 | 同和鉱業株式会社 | 銀粉の製造方法 |
JP2001226596A (ja) * | 2000-02-14 | 2001-08-21 | Sumitomo Bakelite Co Ltd | 導電性樹脂ペースト及びこれを用いて製造された半導体装置 |
JP3854103B2 (ja) * | 2001-06-28 | 2006-12-06 | 住友ベークライト株式会社 | 導電性ペースト及び該ペーストを用いてなる半導体装置 |
JP3991218B2 (ja) | 2002-12-20 | 2007-10-17 | 信越化学工業株式会社 | 導電性接着剤及びその製造方法 |
JP2004265607A (ja) | 2003-01-23 | 2004-09-24 | Matsushita Electric Ind Co Ltd | 導電性ペースト、その導電性ペーストを用いた回路形成基板、およびその製造方法 |
JP4078990B2 (ja) * | 2003-01-23 | 2008-04-23 | 松下電器産業株式会社 | 導電性ペースト、その導電性ペーストを用いた回路形成基板、およびその製造方法 |
JP4212035B2 (ja) * | 2003-06-05 | 2009-01-21 | 株式会社ノリタケカンパニーリミテド | 銀粉末を主体とする導体ペースト及びその製造方法 |
JP4248938B2 (ja) * | 2003-06-06 | 2009-04-02 | 旭化成エレクトロニクス株式会社 | 導電性材料、導電性成形体、導電性成形体の製造方法 |
JP4489389B2 (ja) * | 2003-07-29 | 2010-06-23 | 三井金属鉱業株式会社 | 微粒銀粉の製造方法 |
JP4976642B2 (ja) * | 2004-02-10 | 2012-07-18 | 三井金属鉱業株式会社 | 高結晶性銀粉及びその製造方法 |
JP5028695B2 (ja) * | 2004-11-25 | 2012-09-19 | Dowaエレクトロニクス株式会社 | 銀粉およびその製造方法 |
JP2006196246A (ja) * | 2005-01-12 | 2006-07-27 | Sumitomo Electric Ind Ltd | 導電性ペースト及びそれを用いた配線回路基板 |
JPWO2006098160A1 (ja) * | 2005-03-14 | 2008-08-21 | 株式会社村田製作所 | 導電性ペーストおよびガラス構造体 |
JP4577515B2 (ja) * | 2005-03-30 | 2010-11-10 | 三菱マテリアル株式会社 | 高分散性の銀微粒子とその製造方法、および用途 |
JP5148821B2 (ja) * | 2005-09-20 | 2013-02-20 | 三井金属鉱業株式会社 | フレーク銀粉の製造方法及び、その製造方法で製造されたフレーク銀粉 |
JP5110420B2 (ja) * | 2007-03-20 | 2012-12-26 | 日立金属株式会社 | Ag粉末、導体ペースト及び多層セラミック基板とその製造方法 |
JP2009270130A (ja) * | 2008-04-30 | 2009-11-19 | Aida Kagaku Kogyo Kk | 銀粉末または銀合金粉末、銀または銀合金の造形体の製造方法並びに銀または銀合金の造形体 |
JP2010180471A (ja) * | 2009-02-09 | 2010-08-19 | Dowa Electronics Materials Co Ltd | フレーク状銀粉及びその製造方法、並びに導電性ペースト |
-
2012
- 2012-06-21 KR KR1020137005229A patent/KR101883709B1/ko active IP Right Grant
- 2012-06-21 TW TW101122202A patent/TWI525641B/zh not_active IP Right Cessation
- 2012-06-21 MY MYPI2013701715A patent/MY157634A/en unknown
- 2012-06-21 JP JP2012548248A patent/JP5278627B2/ja not_active Expired - Fee Related
- 2012-06-21 CN CN201280002703.7A patent/CN103079729B/zh not_active Expired - Fee Related
- 2012-06-21 WO PCT/JP2012/065842 patent/WO2012176831A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR101883709B1 (ko) | 2018-08-01 |
CN103079729A (zh) | 2013-05-01 |
KR20140024830A (ko) | 2014-03-03 |
TWI525641B (zh) | 2016-03-11 |
WO2012176831A1 (ja) | 2012-12-27 |
TW201320105A (zh) | 2013-05-16 |
JPWO2012176831A1 (ja) | 2015-02-23 |
JP5278627B2 (ja) | 2013-09-04 |
CN103079729B (zh) | 2015-06-17 |
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