MY146167A - Electronic device sorter comprising dual buffers - Google Patents

Electronic device sorter comprising dual buffers

Info

Publication number
MY146167A
MY146167A MYPI2010000572A MYPI2010000572A MY146167A MY 146167 A MY146167 A MY 146167A MY PI2010000572 A MYPI2010000572 A MY PI2010000572A MY PI2010000572 A MYPI2010000572 A MY PI2010000572A MY 146167 A MY146167 A MY 146167A
Authority
MY
Malaysia
Prior art keywords
electronic devices
loading region
electronic device
buffer assembly
testing
Prior art date
Application number
MYPI2010000572A
Other languages
English (en)
Inventor
Sze Chak Tong Albert
Tsai Pei Wei
Wong Ho Yin
Chan Tin Yi
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Publication of MY146167A publication Critical patent/MY146167A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
MYPI2010000572A 2009-02-17 2010-02-08 Electronic device sorter comprising dual buffers MY146167A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/372,142 US7851721B2 (en) 2009-02-17 2009-02-17 Electronic device sorter comprising dual buffers

Publications (1)

Publication Number Publication Date
MY146167A true MY146167A (en) 2012-07-13

Family

ID=42560058

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010000572A MY146167A (en) 2009-02-17 2010-02-08 Electronic device sorter comprising dual buffers

Country Status (5)

Country Link
US (1) US7851721B2 (zh)
KR (1) KR101053796B1 (zh)
CN (1) CN101804405B (zh)
MY (1) MY146167A (zh)
TW (1) TWI430848B (zh)

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US8476918B2 (en) * 2010-04-28 2013-07-02 Tsmc Solid State Lighting Ltd. Apparatus and method for wafer level classification of light emitting device
JP2012104565A (ja) * 2010-11-08 2012-05-31 Fuji Mach Mfg Co Ltd 部品実装装置における部品分別廃棄装置
TWI418811B (zh) * 2011-02-14 2013-12-11 Youngtek Electronics Corp 封裝晶片檢測與分類裝置
TWI442603B (zh) * 2011-05-09 2014-06-21 Youngtek Electronics Corp 發光二極體封裝晶片分類系統
CN102891098B (zh) * 2011-07-22 2016-12-21 韩华泰科株式会社 用于制造半导体的设备和方法
US20130146418A1 (en) * 2011-12-09 2013-06-13 Electro Scientific Industries, Inc Sorting apparatus and method of sorting components
TWM430614U (en) * 2011-12-21 2012-06-01 Youngtek Electronics Corp Fiber optic light guiding top cover structure
US9519007B2 (en) * 2012-02-10 2016-12-13 Asm Technology Singapore Pte Ltd Handling system for testing electronic components
TWI544567B (zh) * 2013-06-27 2016-08-01 Asm Tech Singapore Pte Ltd 使用成像設備以調整半導體元件的處理設備的裝置和方法
MY180233A (en) * 2014-01-03 2020-11-25 Intotest Sdn Bhd An assembly of apparatus for testing electronic components and a method thereof
TW201632899A (zh) * 2015-03-11 2016-09-16 All Ring Tech Co Ltd 電子元件分類料盒防落料受損方法及裝置
TW201638600A (zh) * 2015-04-22 2016-11-01 All Ring Tech Co Ltd 電子元件分類方法及裝置
TWI590876B (zh) * 2015-10-23 2017-07-11 All Ring Tech Co Ltd Electronic component classification method and device
CN105195443B (zh) * 2015-11-04 2017-10-03 东莞市台工电子机械科技有限公司 一种全自动贴片led快速进料分光分色机及其工作方法
JP6710050B2 (ja) * 2016-01-19 2020-06-17 株式会社ディスコ 搬送装置
CN105834116A (zh) * 2016-04-29 2016-08-10 深圳市华腾半导体设备有限公司 一种转移式分类的高速分选方法
CN106984560A (zh) * 2017-05-31 2017-07-28 成都福誉科技有限公司 一种基于太阳能硅片外观缺陷的分拣方法
TWI765578B (zh) * 2020-05-20 2022-05-21 馬來西亞商正齊科技有限公司 黏合半導體晶粒的裝置及其方法

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Also Published As

Publication number Publication date
KR101053796B1 (ko) 2011-08-03
TW201031470A (en) 2010-09-01
CN101804405A (zh) 2010-08-18
CN101804405B (zh) 2014-09-24
KR20100094381A (ko) 2010-08-26
US20100209219A1 (en) 2010-08-19
TWI430848B (zh) 2014-03-21
US7851721B2 (en) 2010-12-14

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