MY146167A - Electronic device sorter comprising dual buffers - Google Patents
Electronic device sorter comprising dual buffersInfo
- Publication number
- MY146167A MY146167A MYPI2010000572A MYPI2010000572A MY146167A MY 146167 A MY146167 A MY 146167A MY PI2010000572 A MYPI2010000572 A MY PI2010000572A MY PI2010000572 A MYPI2010000572 A MY PI2010000572A MY 146167 A MY146167 A MY 146167A
- Authority
- MY
- Malaysia
- Prior art keywords
- electronic devices
- loading region
- electronic device
- buffer assembly
- testing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/372,142 US7851721B2 (en) | 2009-02-17 | 2009-02-17 | Electronic device sorter comprising dual buffers |
Publications (1)
Publication Number | Publication Date |
---|---|
MY146167A true MY146167A (en) | 2012-07-13 |
Family
ID=42560058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2010000572A MY146167A (en) | 2009-02-17 | 2010-02-08 | Electronic device sorter comprising dual buffers |
Country Status (5)
Country | Link |
---|---|
US (1) | US7851721B2 (zh) |
KR (1) | KR101053796B1 (zh) |
CN (1) | CN101804405B (zh) |
MY (1) | MY146167A (zh) |
TW (1) | TWI430848B (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8305104B2 (en) * | 2009-03-26 | 2012-11-06 | Electro Scientific Industries, Inc. | Testing and sorting system having a linear track and method of using the same |
SG171498A1 (en) * | 2009-12-01 | 2011-06-29 | Rokko Systems Pte Ltd | Method and apparatus for improved sorting of diced substrates |
US8476918B2 (en) * | 2010-04-28 | 2013-07-02 | Tsmc Solid State Lighting Ltd. | Apparatus and method for wafer level classification of light emitting device |
JP2012104565A (ja) * | 2010-11-08 | 2012-05-31 | Fuji Mach Mfg Co Ltd | 部品実装装置における部品分別廃棄装置 |
TWI418811B (zh) * | 2011-02-14 | 2013-12-11 | Youngtek Electronics Corp | 封裝晶片檢測與分類裝置 |
TWI442603B (zh) * | 2011-05-09 | 2014-06-21 | Youngtek Electronics Corp | 發光二極體封裝晶片分類系統 |
CN102891098B (zh) * | 2011-07-22 | 2016-12-21 | 韩华泰科株式会社 | 用于制造半导体的设备和方法 |
US20130146418A1 (en) * | 2011-12-09 | 2013-06-13 | Electro Scientific Industries, Inc | Sorting apparatus and method of sorting components |
TWM430614U (en) * | 2011-12-21 | 2012-06-01 | Youngtek Electronics Corp | Fiber optic light guiding top cover structure |
US9519007B2 (en) * | 2012-02-10 | 2016-12-13 | Asm Technology Singapore Pte Ltd | Handling system for testing electronic components |
TWI544567B (zh) * | 2013-06-27 | 2016-08-01 | Asm Tech Singapore Pte Ltd | 使用成像設備以調整半導體元件的處理設備的裝置和方法 |
MY180233A (en) * | 2014-01-03 | 2020-11-25 | Intotest Sdn Bhd | An assembly of apparatus for testing electronic components and a method thereof |
TW201632899A (zh) * | 2015-03-11 | 2016-09-16 | All Ring Tech Co Ltd | 電子元件分類料盒防落料受損方法及裝置 |
TW201638600A (zh) * | 2015-04-22 | 2016-11-01 | All Ring Tech Co Ltd | 電子元件分類方法及裝置 |
TWI590876B (zh) * | 2015-10-23 | 2017-07-11 | All Ring Tech Co Ltd | Electronic component classification method and device |
CN105195443B (zh) * | 2015-11-04 | 2017-10-03 | 东莞市台工电子机械科技有限公司 | 一种全自动贴片led快速进料分光分色机及其工作方法 |
JP6710050B2 (ja) * | 2016-01-19 | 2020-06-17 | 株式会社ディスコ | 搬送装置 |
CN105834116A (zh) * | 2016-04-29 | 2016-08-10 | 深圳市华腾半导体设备有限公司 | 一种转移式分类的高速分选方法 |
CN106984560A (zh) * | 2017-05-31 | 2017-07-28 | 成都福誉科技有限公司 | 一种基于太阳能硅片外观缺陷的分拣方法 |
US10406562B2 (en) * | 2017-07-21 | 2019-09-10 | Applied Materials, Inc. | Automation for rotary sorters |
TWM626077U (zh) * | 2020-05-20 | 2022-04-21 | 馬來西亞商正齊科技有限公司 | 黏合半導體晶粒的裝置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3584741A (en) * | 1969-06-30 | 1971-06-15 | Ibm | Batch sorting apparatus |
US3847284A (en) * | 1973-05-11 | 1974-11-12 | Teledyne Inc | Magnetic tape die sorting system |
US5484062A (en) * | 1993-01-22 | 1996-01-16 | Technology Handlers, Inc. | Article stack handler/sorter |
US5829222A (en) * | 1994-06-10 | 1998-11-03 | Johnson & Johnson Vision Products, Inc. | Automated apparatus and method for consolidating products for packaging |
US5588797A (en) * | 1994-07-18 | 1996-12-31 | Advantek, Inc. | IC tray handling apparatus and method |
US5568870A (en) * | 1994-08-18 | 1996-10-29 | Testec, Inc. | Device for testing and sorting small electronic components |
US6019564A (en) * | 1995-10-27 | 2000-02-01 | Advantest Corporation | Semiconductor device transporting and handling apparatus |
US5842579A (en) * | 1995-11-16 | 1998-12-01 | Electro Scientific Industries, Inc. | Electrical circuit component handler |
KR20010018869A (ko) * | 1999-08-23 | 2001-03-15 | 윤세원 | 발광소자 검사장치 |
JP2001176892A (ja) * | 1999-12-15 | 2001-06-29 | Shinkawa Ltd | ダイボンディング方法及びその装置 |
JP3687503B2 (ja) * | 2000-07-11 | 2005-08-24 | 株式会社村田製作所 | 電子部品の搬送装置およびこの搬送装置を用いた検査装置 |
KR100569240B1 (ko) * | 2003-04-15 | 2006-04-07 | (주)알티에스 | 비젼 시스템을 이용한 전자부품 검사장치 |
JP4123141B2 (ja) * | 2003-03-28 | 2008-07-23 | 株式会社村田製作所 | チップ型電子部品の取扱い装置およびチップ型電子部品の取扱い方法 |
JP4039324B2 (ja) * | 2003-06-26 | 2008-01-30 | 株式会社村田製作所 | 電子部品の搬送装置 |
US6967475B2 (en) * | 2004-01-22 | 2005-11-22 | Asm Assembly Automation Ltd. | Device transfer mechanism for a test handler |
JP4537400B2 (ja) * | 2004-07-23 | 2010-09-01 | 株式会社アドバンテスト | 電子部品ハンドリング装置の編成方法 |
US7973259B2 (en) * | 2007-05-25 | 2011-07-05 | Asm Assembly Automation Ltd | System for testing and sorting electronic components |
CN201152881Y (zh) * | 2008-01-16 | 2008-11-19 | 佛山市国星光电股份有限公司 | 一种片式led产品吸放机构 |
KR100931323B1 (ko) | 2009-02-20 | 2009-12-11 | (주)큐엠씨 | 엘이디 칩 분류장치 |
KR101111952B1 (ko) * | 2009-09-23 | 2012-02-14 | (주)제이티 | 엘이디소자다이본더 |
-
2009
- 2009-02-17 US US12/372,142 patent/US7851721B2/en active Active
-
2010
- 2010-02-05 TW TW099103412A patent/TWI430848B/zh active
- 2010-02-08 MY MYPI2010000572A patent/MY146167A/en unknown
- 2010-02-10 CN CN201010108482.4A patent/CN101804405B/zh active Active
- 2010-02-16 KR KR1020100013675A patent/KR101053796B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN101804405A (zh) | 2010-08-18 |
CN101804405B (zh) | 2014-09-24 |
KR20100094381A (ko) | 2010-08-26 |
US7851721B2 (en) | 2010-12-14 |
KR101053796B1 (ko) | 2011-08-03 |
US20100209219A1 (en) | 2010-08-19 |
TWI430848B (zh) | 2014-03-21 |
TW201031470A (en) | 2010-09-01 |
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