WO2010071609A3 - System and processing of a substrate - Google Patents
System and processing of a substrate Download PDFInfo
- Publication number
- WO2010071609A3 WO2010071609A3 PCT/SG2009/000484 SG2009000484W WO2010071609A3 WO 2010071609 A3 WO2010071609 A3 WO 2010071609A3 SG 2009000484 W SG2009000484 W SG 2009000484W WO 2010071609 A3 WO2010071609 A3 WO 2010071609A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- processing
- station
- surface inspection
- top surface
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Abstract
A system for processing a substrate (100) comprising a loading station for receiving the substrate; a bottom surface inspection station (30) for inspecting the bottom surface of the substrate; a top surface inspection station (35) for inspecting the top surface of the substrate and; a sorting station for sorting the substrate into a predetermined category based upon the bottom surface inspection and top surface inspection.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009801503236A CN102439707A (en) | 2008-12-17 | 2009-12-17 | System and processing of a substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200809409-6A SG162631A1 (en) | 2008-12-17 | 2008-12-17 | System and processing of a substrate |
SG200809409-6 | 2008-12-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010071609A2 WO2010071609A2 (en) | 2010-06-24 |
WO2010071609A3 true WO2010071609A3 (en) | 2013-10-24 |
Family
ID=42269270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SG2009/000484 WO2010071609A2 (en) | 2008-12-17 | 2009-12-17 | System and processing of a substrate |
Country Status (4)
Country | Link |
---|---|
CN (1) | CN102439707A (en) |
SG (1) | SG162631A1 (en) |
TW (1) | TW201033600A (en) |
WO (1) | WO2010071609A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013117246A1 (en) * | 2012-02-07 | 2013-08-15 | Ismeca Semiconductor Holding Sa | A device for sorting components |
TW201421013A (en) * | 2012-11-16 | 2014-06-01 | Prov Technology Corp | Electronic device inspection and classification equipment |
TW201500733A (en) * | 2013-06-25 | 2015-01-01 | Chiuan Yan Technology Co Ltd | Conductive glass inspection system |
US9341580B2 (en) * | 2014-06-27 | 2016-05-17 | Applied Materials, Inc. | Linear inspection system |
CN110108716A (en) * | 2019-05-06 | 2019-08-09 | 华侨大学 | A kind of automation substrate wafer defect and thickness detecting system |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050134256A1 (en) * | 2003-12-19 | 2005-06-23 | Asm Assembly Automation Ltd. | System for processing electronic devices |
WO2008097012A1 (en) * | 2007-02-06 | 2008-08-14 | Hanmi Semiconductor Co., Ltd. | Vision system of sawing and placement equipment |
WO2008126955A1 (en) * | 2007-04-13 | 2008-10-23 | Jt Corporation | Apparatus for inspecting semiconductor device |
-
2008
- 2008-12-17 SG SG200809409-6A patent/SG162631A1/en unknown
-
2009
- 2009-12-17 CN CN2009801503236A patent/CN102439707A/en active Pending
- 2009-12-17 WO PCT/SG2009/000484 patent/WO2010071609A2/en active Application Filing
- 2009-12-17 TW TW098143507A patent/TW201033600A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050134256A1 (en) * | 2003-12-19 | 2005-06-23 | Asm Assembly Automation Ltd. | System for processing electronic devices |
WO2008097012A1 (en) * | 2007-02-06 | 2008-08-14 | Hanmi Semiconductor Co., Ltd. | Vision system of sawing and placement equipment |
WO2008126955A1 (en) * | 2007-04-13 | 2008-10-23 | Jt Corporation | Apparatus for inspecting semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
CN102439707A (en) | 2012-05-02 |
TW201033600A (en) | 2010-09-16 |
SG162631A1 (en) | 2010-07-29 |
WO2010071609A2 (en) | 2010-06-24 |
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