SG162631A1 - System and processing of a substrate - Google Patents

System and processing of a substrate

Info

Publication number
SG162631A1
SG162631A1 SG200809409-6A SG2008094096A SG162631A1 SG 162631 A1 SG162631 A1 SG 162631A1 SG 2008094096 A SG2008094096 A SG 2008094096A SG 162631 A1 SG162631 A1 SG 162631A1
Authority
SG
Singapore
Prior art keywords
substrate
processing
station
surface inspection
top surface
Prior art date
Application number
SG200809409-6A
Inventor
Hae Choon Yang
Original Assignee
Rokko Ventures Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Ventures Pte Ltd filed Critical Rokko Ventures Pte Ltd
Priority to SG200809409-6A priority Critical patent/SG162631A1/en
Priority to TW098143507A priority patent/TW201033600A/en
Priority to PCT/SG2009/000484 priority patent/WO2010071609A2/en
Priority to CN2009801503236A priority patent/CN102439707A/en
Publication of SG162631A1 publication Critical patent/SG162631A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sorting Of Articles (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

A system for processing a substrate comprising a loading station for receiving the substrate; a bottom surface inspection station for inspecting the bottom surface of the substrate; a top surface inspection station for inspecting the top surface of the substrate and; a sorting station for sorting the substrate into a predetermined category based upon the bottom surface inspection and top surface inspection.
SG200809409-6A 2008-12-17 2008-12-17 System and processing of a substrate SG162631A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SG200809409-6A SG162631A1 (en) 2008-12-17 2008-12-17 System and processing of a substrate
TW098143507A TW201033600A (en) 2008-12-17 2009-12-17 System and processing of a substrate
PCT/SG2009/000484 WO2010071609A2 (en) 2008-12-17 2009-12-17 System and processing of a substrate
CN2009801503236A CN102439707A (en) 2008-12-17 2009-12-17 System and processing of a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200809409-6A SG162631A1 (en) 2008-12-17 2008-12-17 System and processing of a substrate

Publications (1)

Publication Number Publication Date
SG162631A1 true SG162631A1 (en) 2010-07-29

Family

ID=42269270

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200809409-6A SG162631A1 (en) 2008-12-17 2008-12-17 System and processing of a substrate

Country Status (4)

Country Link
CN (1) CN102439707A (en)
SG (1) SG162631A1 (en)
TW (1) TW201033600A (en)
WO (1) WO2010071609A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2812914A1 (en) * 2012-02-07 2014-12-17 ISMECA Semiconductor Holding SA A device for sorting components
TW201421013A (en) * 2012-11-16 2014-06-01 Prov Technology Corp Electronic device inspection and classification equipment
TW201500733A (en) * 2013-06-25 2015-01-01 Chiuan Yan Technology Co Ltd Conductive glass inspection system
US9341580B2 (en) * 2014-06-27 2016-05-17 Applied Materials, Inc. Linear inspection system
CN110108716A (en) * 2019-05-06 2019-08-09 华侨大学 A kind of automation substrate wafer defect and thickness detecting system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7190446B2 (en) * 2003-12-19 2007-03-13 Asm Assembly Automation Ltd. System for processing electronic devices
KR100814284B1 (en) * 2007-02-06 2008-03-18 한미반도체 주식회사 Vision system for sawing & placement equipment
KR100869539B1 (en) * 2007-04-13 2008-11-19 (주)제이티 Apparatus for inspecting semiconductor

Also Published As

Publication number Publication date
WO2010071609A3 (en) 2013-10-24
CN102439707A (en) 2012-05-02
WO2010071609A2 (en) 2010-06-24
TW201033600A (en) 2010-09-16

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