201033600 六、發明說明： 【發明所屬之技術領域】 本發明係關於為了各種用途用於半導體工業的基板之製 程’該等用途包含無特徵晶圓、積體電路陣列及光伏打電 池工業。 特定言之，本發明係關於一種在其中一基板為易碎之情 況下處理此一基板之手段。 【先前技術】201033600 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a process for substrates used in the semiconductor industry for various purposes. These applications include featureless wafers, integrated circuit arrays, and photovoltaic cell industries. In particular, the present invention relates to a means for treating such a substrate in the event that one of the substrates is frangible. [Prior Art]
用於半導體工業的基板之不同製程技術普遍相依於該基 板之最終用途而變化。特定言之，在處理期間該等基板之 易碎性可極大變化，取決於許多因素，包含材料厚度最 終用途及是否已施加外部增強以強化該基板。 晶圓，舉例而言可如0.18毫米厚，並可由具有低挽曲強 度之材料（諸如單晶矽）製成。處理此等單元需要專員操作 以避免損壞。舉例而言，如在PCT/SG2006/000015中所揭 示（該案之内容併入本文中），通常與積體電路陣列之基板 相關的基板粗魯處理將為不適當並引起對該等單元之I不 可接受等級的損壞。 【發明内容】 以更適於此等元件之 因此，本發明之一目的係提供一種 方式處理易碎基板之手段。 一基板之系 一底面檢查 ，其用於檢 在—第一態樣中，本發明提供一種用於處3 統，其包括：一負載台，其用於接收該基板； 台，其用於檢查該基板之底面；一頂面檢查会 145458.doc 201033600 查該基板之頂面；及-分類台，其用於基於底面檢查u 面檢查而將該基板分類為一預定類別。 在一第二態樣中，本發明提供一基板接合裝置其包 括：-外殼’其具有用於真空接合該基板之一真空源一 間隔裝置’其用於當該基板與該裝置真空接合時接觸該基 板’該間隔裝置經配置以保持介於該真空源與該基板之間 之一間隙。 在一第三態樣中，本發明提供—種接合一基板之方法， 該方法包括以下步驟：提供一真空源，其用於真空接合該 基板，當該基板與該裝置真空接合時使該基板與一間隔裝 置接觸，該間隔裝置經配4以保持介於該真线與該基板 之間之一間隙。 因此，本發明提供一種接合並支撐該等單元之手段藉 此由不同功能達成該接合及支標。特定言之，本發明係關 於一種用於在接合期間自該真空源分離該基板之手段。 【實施方式】 將為便利的是參考繪示本發明之可能配置之隨附圖式而 進一步描述本發明。本發明之其他配置為可能，且因此該 等隨附圖式之特性不應理解為取代本發明之先前描述之通 性。 圖1顯示用於處理一基板或晶圓之該系統之一綜覽。該 系統5係經定位於分離區域之下游，藉由該分離區域自一 較大材料源切割出該等基板。繼分離之後，該等基板被送 /月洗σ 1 0及一乾燥台1 5，然後經由一輸送帶i 7離開該 145458.doc 201033600 乾燥台15。接著該等基板在進入一檢查及分類區域6之前 進入一雷射標記頭20。 該檢查及分類區域6包含作為基板之一緩衝容器之一載 具25。此可在該等上游清洗/乾燥區域與該檢查及分類區 域ό之間之處理速度有任何區別時有用。在此實施例中， 該等基板係經輸送至一底面檢查台3〇，繼之以一頂面檢查 台3 5。為處理瓶頸問題，此實施例亦包含在進入一雙重托 ❹ 架載具50之前之二厚度測量台40、45，以基於該等先前檢 查台之結果而運輸該等基板至各自儲存箱6〇β當該等各自 儲存箱被填滿時，該等基板係經運輸至封裝區域8〇並放置 於各自區域8 5内。 在隨後圖式中將更詳細描述本發明之各種態樣。 圖2顯示該基板1〇〇進入該檢查及分類區域6。此處，一 輸送帶17運輸該基板1〇〇至一載具25。在此實施例中，該 載具可容納3個基板1 〇5。然而，其他實施例可包含可容納 φ 3個、4個或5個基板之載具。另外實施例可承載更多基 板，取決於s亥基板之尺寸及具有基板之一緩衝容器以管理 經由該系統之製程流量之需求。該載具係經配置以與該 輸送帶17成直角之方向110移動並因此移動該載具乃，使 得自該載具内之一空狹槽對應於自該載具25輸送的一基板 100 ° 如圖1所示，存在一線性導軌27,其具有一拾取器配 置，藉此一拾取器115接合個別基板12〇以沿著該線性導軌 27輸送。在此實施例中，該第一台係一底面檢查台3〇，藉 145458.doc 201033600 此該拾取器115接合該等基板120並移動該等基板12〇越過 一相機130。該底面檢查台3〇進一步包含一光125以加強影 像並容許更準確檢查該基板12〇。該底面檢查台3〇可經配 置以檢查該基板之各種面向，包含適當且準確標記、巨大 裂缝、微小裂縫及該基板距可容許容差之任何偏移。 接著’該等基板係經輸送至用於穿過一頂面檢查台35下 面之一輸送帶150。圖4顯示當該等基板145在仍具有光135 之一相機140下方穿過時該等基板145在該輸送帶15〇上之 移動。該輸送帶可包含托架或光或其他構件以將該基板 145固持在一精確位置用於由該頂面檢查台35更準確且快 速檢查。此外，該輸送帶150可係照射光線朝向該相機14〇 之一照明塊體。此具有投射光穿過可能存在於該基板i45 内之任何裂縫或微小裂縫之優點。因此，具有照射穿過該 等裂縫之光將使該檢查過程更準確，尤其對於具有在正常 條件下可能無法偵測之一極小間隙之微小裂縫而言。 可包含另一頂面檢查台155以特定識別微小裂縫。如圖5 所示’此一台可包含在一極特定視野上投射之一相機 160。不像可具有觀察大部分基板或整體基板之相機之先 前檢查台’該微小裂縫檢查相機160可具有一極詳細視 野。在一實施例中，具有尺寸X及y之視野17〇可係具有2 5 毫米χ2·5宅米之尺寸之一正方形視野。因為微小裂縫具有 在分離期間發生之一較大可能性’該基板145可承受沿著 該基板之該等周邊邊緣之微小裂縫檢查。 在根據此實施例之該系統内之居後台係檢查該基板之厚 145458.doc 201033600 度。有用於檢查該基板之厚度之許多專有系統…個此系 統可關注該晶圓之電阻率並以該材料之電阻率之一函數判 定厚度。或者，並如圖6所示，該系統18〇可量測一光徑及 當該晶圓進入光場内時該光徑之縮短。 無論如何熟習纟將意識到量測此厚&之可獲得方法及該 等專有系統之任U途。不管選擇何種方法，有不同 測量路徑可被選擇以便在具有統計學可靠性下測定該晶圓 ❿ 179之厚度。舉例而言，可選擇由—周邊路徑”5界定的— 邊界…W2以確保圍繞該基板之_貫測量。此連同或代 替亦可包含在該基板179之面内之中心線177、178或一内 部路徑176。 因而選擇較大路控數目及/或路徑長度以量測厚度將增 加厚度檢查之敏感度以及減緩該過程。因此 台可證明係受該等上游及下游製程影響之該系 頸。在圖1顯示的該實施例中’設置兩個此厚度測量台 40、45以便減輕該瓶頸。 繼該等各種檢查台之後’自_雙重載具5晴送該等基板 至一系列類別儲存箱60，藉此每-基板係根據遵照任何精 確檢查而歸類。在此實施例中，有基板之13種類別，該基 ，可在該U種類別中分類。在進—步實施例中，該等儲二 箱之若干個可為相同類別，舉例而言，儲存箱！至7可用於 通過」基板而儲存箱8至11用於「修補加工」且儲存 12至13係「驳回j儲存箱。 目 在圖7中進一步顯示該等實際儲存箱配置55，其等具有 14545S.doc 201033600 放置於一桌台185上的直立托架195，該基板190裝配在該 等托架195中。該等儲存箱之每一者將接收基板直到填 滿，藉此位於線性滑道65、75上的一夾持拾取器配置輸送 該等儲存箱至該打包台70，藉此該等儲存箱在各自類別内 打包然後最終沿著一輸送帶90移動至準備輸送之拆封堆疊 區域95。 此一夾具可經調適以接合整個儲存箱。此外，該線性滑 道在相同滑道上可包含一拾取器及夹具兩者以便給予該線 性滑道一雙重功能：基板置放及儲存箱移除。以相同方 式，該夾具及拾取器可經安裝在一起以進一步節省基礎結 構。 圖8A至圖8D顯示根據本發明之另一實施例之一基板接 合裝置。在此情況下，該接合裝置係一拾取器2〇〇。該拾 取器200包含一外殼205 ’若干真空源215係安裝至該外殼 205。在該外殼205之該等邊緣處係一間隔裝置，在此情況 下，該間隔裝置包含一系列分離塊體21〇。 此處，該等真空源215顯示為複數個離散真空源。在一 替代實施例中之該真空源可包含具有複數個真空孔之一真 空板。在另一實施例中，該等真空源215可係提供一高負 壓以便接合該基板220之離散真空喷嘴。 在另-實施例中，該等真空源215可係氣旋墊。該等塾 可接收一主動氣流，其係以圍繞該裝置之圓形周邊之一氣 旋方向導引。循環流動空氣導致在該中心氣旋墊255處之 -低壓區域245。在其中該基板22()係極輕之應用中產生 U5458.doc 201033600 低壓之該氣旋墊將向上牵拉該基板。該氣旋墊255之寬基 台及負麼之低集中係與容許該真空255提供該基板之一更 柔和接合之習知真空源相比較。 該分離塊體21〇意欲自該真空源215分離該基板220並因 此提供一間隙236。此具有避免抗著具有重集中負壓之一 I知真空源之該基板之局部應力集中之益處。在其中該真 空源實際上為一氣旋墊255之情況下，該間隙236提供容許 空氣在該氣旋墊255與基板220之間240逸出之空間之另一 益處，該間隙23 6為操作該氣旋墊所需。 對應於該分離塊體210，在此實施例中使用一階梯配 置。该基板220距該真空源215之該間隙係藉由該基板與一 階梯面230之間之接觸而達成。一旦接合該基板，該基板 係經向上牵拉朝向該真空源，但被防止作出實際接觸。 此外，側突出體235被用於包圍該基板以防止該基板之 橫向移動。因此，當經製造為一嚴格容差時，該基板在該 φ 分離塊體210之範圍内與一高容差相配，因此防止經由過 度撓曲強度而對該基板之進一步潛在損壞或經由與該接合 裝置200之一未對齊而偏移。此外，在此實施例中，該分 離塊體210係由較軟材料，諸如聚合物（舉例而言聚丙烯）製 成以便進一步限制在接合期間對該基板之損壞。 【圖式簡單說明】 圖1係根據本發明之一實施例之一系統之一平面圖； 圖2係根據圖1之一裝載輸送帶之一詳細平面圖； 圖3係根據本發明之另一實施例之一底面檢查台之一等 145458.doc -9- 201033600 角視圖； 之一等 之一等 之一等 一等角 實施例 圖4係根據本發明之另一實施例之一頂面檢查台 角視圖； 圖5係根據本發明之另一實施例之一周邊檢查台 角視圖；The different process technologies used for substrates in the semiconductor industry generally vary depending on the end use of the substrate. In particular, the friability of such substrates can vary greatly during processing, depending on a number of factors, including the ultimate use of the material thickness and whether external reinforcement has been applied to strengthen the substrate. The wafer, for example, may be 0.18 mm thick and may be made of a material having a low tensile strength such as single crystal germanium. Dealing with these units requires specialist action to avoid damage. For example, as disclosed in PCT/SG2006/000015 (the contents of which are incorporated herein), generally the substrate rude processing associated with the substrate of the integrated circuit array will be inappropriate and cause I of the cells. Unacceptable level of damage. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a means of handling a frangible substrate in a manner that is more suitable for such elements. A substrate is inspected by a bottom surface for inspection. In the first aspect, the present invention provides a system for: a load platform for receiving the substrate; a table for checking The bottom surface of the substrate; a top surface inspection 145458.doc 201033600 to inspect the top surface of the substrate; and a sorting table for classifying the substrate into a predetermined category based on the bottom surface inspection u-face inspection. In a second aspect, the present invention provides a substrate bonding apparatus comprising: a housing having a vacuum source for vacuum bonding the substrate, a spacer for contacting the substrate when vacuum bonded to the device The substrate 'the spacer is configured to maintain a gap between the vacuum source and the substrate. In a third aspect, the present invention provides a method of bonding a substrate, the method comprising the steps of: providing a vacuum source for vacuum bonding the substrate, the substrate being vacuum bonded to the device In contact with a spacer, the spacer is configured to maintain a gap between the true line and the substrate. Accordingly, the present invention provides a means of engaging and supporting the units whereby the joints and supports are achieved by different functions. In particular, the invention relates to a means for separating the substrate from the vacuum source during bonding. [Embodiment] It will be convenient to further describe the invention with reference to the accompanying drawings, which illustrate the possible configurations of the invention. Other configurations of the present invention are possible, and thus the characteristics of the accompanying drawings are not to be construed as limiting the nature of the foregoing description of the present invention. Figure 1 shows an overview of one of the systems for processing a substrate or wafer. The system 5 is positioned downstream of the separation zone by which the substrates are cut from a source of material. Following the separation, the substrates are fed/month washed σ 10 and a drying station 15 and then exited the 145458.doc 201033600 drying station 15 via a conveyor belt i 7 . The substrates then enter a laser marking head 20 before entering an inspection and sorting area 6. The inspection and sorting area 6 includes a carrier 25 as one of the buffer containers of the substrate. This can be useful in any case where there is any difference in processing speed between the upstream cleaning/drying zone and the inspection and sorting zone. In this embodiment, the substrates are conveyed to a bottom inspection station 3, followed by a top inspection station 35. To address the bottleneck problem, this embodiment also includes two thickness measurement stations 40, 45 prior to entering a double carrier carrier 50 to transport the substrates to respective storage bins based on the results of the previous inspection stations. When the respective storage tanks are filled, the substrates are transported to the package area 8 and placed in the respective areas 85. Various aspects of the invention are described in more detail in the following figures. Figure 2 shows the substrate 1 entering the inspection and sorting area 6. Here, a conveyor belt 17 transports the substrate 1 to a carrier 25. In this embodiment, the carrier can accommodate three substrates 1 〇5. However, other embodiments may include a carrier that can accommodate φ 3, 4, or 5 substrates. Still other embodiments can carry more of the substrate, depending on the size of the substrate and having a buffer container of the substrate to manage the process flow through the system. The carrier is configured to move in a direction 110 at right angles to the conveyor belt 17 and thereby move the carrier such that an empty slot from the carrier corresponds to a substrate 100 from the carrier 25 As shown in FIG. 1, there is a linear guide 27 having a pickup configuration whereby a pickup 115 engages the individual substrates 12A to be transported along the linear guides 27. In this embodiment, the first stage is a bottom inspection table 3, and the pickup 115 joins the substrates 120 and moves the substrates 12 over a camera 130 by 145458.doc 201033600. The bottom surface inspection table 3 further includes a light 125 to enhance the image and allow for a more accurate inspection of the substrate 12A. The bottom inspection station 3 can be configured to inspect various orientations of the substrate, including appropriate and accurate markings, large cracks, minute cracks, and any offset of the substrate from tolerances. The substrates are then conveyed to a conveyor belt 150 for passing underneath a top inspection station 35. Figure 4 shows the movement of the substrates 145 on the conveyor belt 15 as they pass under the camera 140, which still has light 135. The conveyor belt can include a carrier or light or other member to hold the substrate 145 in a precise position for more accurate and quick inspection by the top inspection station 35. Additionally, the conveyor belt 150 can illuminate the illumination block toward the camera 14 . This has the advantage that the projected light passes through any cracks or micro-cracks that may be present in the substrate i45. Therefore, having light that illuminates through the cracks will make the inspection process more accurate, especially for micro-cracks that may not detect a very small gap under normal conditions. Another top inspection station 155 can be included to specifically identify micro cracks. As shown in Figure 5, this one can include one camera 160 projected on a particular field of view. Unlike the prior inspection table that can have a camera that observes most of the substrate or the integral substrate, the microcrack inspection camera 160 can have a very detailed view. In one embodiment, the field of view 17 having dimensions X and y may be a square field of view having a size of 2 5 mm χ 2·5 house meters. Because the microcracks have a greater likelihood of occurring during the separation, the substrate 145 can withstand microcrack inspection along the peripheral edges of the substrate. In the background of the system according to this embodiment, the thickness of the substrate was checked 145458.doc 201033600 degrees. There are many proprietary systems for inspecting the thickness of the substrate. One such system can focus on the resistivity of the wafer and determine the thickness as a function of the resistivity of the material. Alternatively, and as shown in Figure 6, the system 18 can measure an optical path and shorten the optical path as the wafer enters the optical field. No matter how familiar you are, you will be aware of the way in which this thickness can be measured and the way in which such proprietary systems are available. Regardless of the method chosen, different measurement paths can be selected to determine the thickness of the wafer 179 with statistical reliability. For example, the boundary ... W2 defined by the -peripheral path 5 can be selected to ensure a measurement around the substrate. This may be included with or instead of the centerline 177, 178 or one within the face of the substrate 179. Internal path 176. Thus selecting a larger number of gates and/or path length to measure thickness will increase the sensitivity of the thickness check and slow the process. Thus the station can prove to be affected by the upstream and downstream processes. In the embodiment shown in Fig. 1, two such thickness measuring stations 40, 45 are provided to alleviate the bottleneck. Following the various inspection stations, the two substrates are sent to the series of storage tanks 60. Thereby, each substrate is classified according to any precise inspection. In this embodiment, there are 13 categories of substrates, which can be classified in the U category. In the further embodiment, Some of the storage bins may be of the same type, for example, storage bins! to 7 may be used to pass the "substrate" storage bins 8 through 11 for "repair processing" and store 12 to 13 series "dismissed j storage bins. The purpose is further shown in Figure 7. The actual storage tank configuration 55, which has an upright bracket 195 placed on a table 185, having 14545S.doc 201033600, is assembled in the brackets 195. Each of the storage boxes will receive The substrate is not filled until a pick-up picker arrangement on the linear slides 65, 75 is configured to transport the storage bins to the baling station 70, whereby the storage bins are packaged in respective categories and ultimately transported along a conveyor The belt 90 is moved to the unpacking stacking area 95 ready for transport. This jig can be adapted to engage the entire storage bin. Further, the linear chute can include both a picker and a jig on the same chute to give the linear chute A dual function: substrate placement and storage bin removal. In the same manner, the fixture and pickup can be mounted together to further save the infrastructure. Figures 8A-8D show a substrate in accordance with another embodiment of the present invention. Engagement device. In this case, the engagement device is a pickup 2. The pickup 200 includes a housing 205 'a plurality of vacuum sources 215 are attached to the housing 205. The equilateral side of the housing 205 There is a spacer device, in which case the spacer device comprises a series of discrete blocks 21 . Here, the vacuum sources 215 are shown as a plurality of discrete vacuum sources. In an alternative embodiment, the vacuum source can be A vacuum plate having a plurality of vacuum holes is included. In another embodiment, the vacuum sources 215 can provide a high vacuum to engage discrete vacuum nozzles of the substrate 220. In other embodiments, the vacuum Source 215 may be a cyclone pad that receives an active gas stream that is directed in a cyclonic direction around one of the circular perimeters of the device. Circulating flowing air results in a low pressure region 245 at the central cyclone pad 255. The cyclone pad, which produces a low pressure of U5458.doc 201033600 in an application where the substrate 22() is extremely light, will pull the substrate up. The wide base of the cyclone pad 255 and the low concentration of the negative are compared to conventional vacuum sources that allow the vacuum 255 to provide a softer engagement of one of the substrates. The separation block 21 is intended to separate the substrate 220 from the vacuum source 215 and thereby provide a gap 236. This has the benefit of avoiding local stress concentrations on the substrate that are resistant to one of the re-concentration negative pressures. In the case where the vacuum source is actually a cyclone pad 255, the gap 236 provides another benefit of allowing space for air to escape between the cyclone pad 255 and the substrate 220, the gap 23 6 being operated by the cyclone Pad required. Corresponding to the separation block 210, a step configuration is used in this embodiment. The gap of the substrate 220 from the vacuum source 215 is achieved by contact between the substrate and a step surface 230. Once the substrate is bonded, the substrate is pulled upward toward the vacuum source, but is prevented from making actual contact. Further, side protrusions 235 are used to surround the substrate to prevent lateral movement of the substrate. Thus, when fabricated to a tight tolerance, the substrate is matched to a high tolerance within the range of the φ separation block 210, thereby preventing further potential damage to the substrate via excessive flexural strength or via One of the engagement devices 200 is misaligned and offset. Moreover, in this embodiment, the discrete block 210 is formed from a relatively soft material, such as a polymer (e.g., polypropylene) to further limit damage to the substrate during bonding. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of a system according to one embodiment of the present invention; FIG. 2 is a detailed plan view of one of the loading conveyors according to one of FIG. 1; FIG. 3 is another embodiment of the present invention. One of the bottom inspection tables, etc. 145458.doc -9-201033600 angular view; one of the other, etc., an isometric embodiment, FIG. 4 is a top inspection table angle according to another embodiment of the present invention Figure 5 is a perspective view of a peripheral inspection station according to another embodiment of the present invention;
圖6係根據本發明之另一實施例之一厚度測| A 至 口 角視圖； 圖7係根據本發明之另一實施例之分類儲存箱之 視圖，及 圖8A、圖8B、圖8C及圖8D係根據本發明之另一 之一拾取器之各種視圖。 【主要元件符號說明】 5 系統 6 檢查及分類區域 10 清洗台 15 乾燥台 17 輸送帶 20 雷射標記頭 25 載具 27 線性導轨 30 底面檢查台 35 頂面檢查台 40 厚度測量台 45 厚度測量台 145458.doc -10- 201033600Figure 6 is a perspective view of a thickness measurement according to another embodiment of the present invention; Figure 7 is a view of a classification storage box according to another embodiment of the present invention, and Figures 8A, 8B, 8C and 8D is a various view of a picker according to another of the present invention. [Main component symbol description] 5 System 6 Inspection and classification area 10 Cleaning station 15 Drying station 17 Conveyor belt 20 Laser marking head 25 Carrier 27 Linear guide 30 Underside inspection table 35 Top inspection table 40 Thickness measurement table 45 Thickness measurement Taiwan 145458.doc -10- 201033600
50 雙重載具 55 儲存箱配置 60 儲存箱 65 線性滑道 70 打包台 75 線性滑道 80 封裝區域 85 區域 90 輸送帶 100 基板 105 基板 115 拾取器 120 基板 125 光 130 相機 135 光 140 相機 145 基板 150 輸送帶 155 頂面檢查台 160 微小裂縫檢查相機 179 基板面 180 系統 185 桌台 145458.doc -11 - 基板 直立托架 拾取器 外殼 分離塊體 真空源 基板 階梯面 側突出體 間隙 低壓區域 氣旋墊 -12-50 Dual Carrier 55 Storage Box Configuration 60 Storage Box 65 Linear Slide 70 Packing Table 75 Linear Slide 80 Package Area 85 Area 90 Conveyor Belt 100 Substrate 105 Substrate 115 Pickup 120 Substrate 125 Light 130 Camera 135 Light 140 Camera 145 Substrate 150 Conveyor Belt 155 Top Surface Inspection Table 160 Micro Crack Inspection Camera 179 Substrate Surface 180 System 185 Table Table 145458.doc -11 - Substrate Upright Bracket Pickup Case Separation Block Vacuum Source Substrate Step Surface Side Projection Clearance Low Pressure Area Cyclone Pad - 12-