TWI477767B - - Google Patents
Info
- Publication number
- TWI477767B TWI477767B TW101142895A TW101142895A TWI477767B TW I477767 B TWI477767 B TW I477767B TW 101142895 A TW101142895 A TW 101142895A TW 101142895 A TW101142895 A TW 101142895A TW I477767 B TWI477767 B TW I477767B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101142895A TW201421013A (en) | 2012-11-16 | 2012-11-16 | Electronic device inspection and classification equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101142895A TW201421013A (en) | 2012-11-16 | 2012-11-16 | Electronic device inspection and classification equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201421013A TW201421013A (en) | 2014-06-01 |
| TWI477767B true TWI477767B (en) | 2015-03-21 |
Family
ID=51393355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101142895A TW201421013A (en) | 2012-11-16 | 2012-11-16 | Electronic device inspection and classification equipment |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201421013A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016156715A (en) * | 2015-02-25 | 2016-09-01 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
| TWI585393B (en) * | 2015-10-30 | 2017-06-01 | 由田新技股份有限公司 | Component inspection system and component inspection method |
| CN106226329A (en) * | 2016-09-08 | 2016-12-14 | 连云港康达智精密技术有限公司 | Mobile lens appearance inspection machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003234361A (en) * | 2002-02-07 | 2003-08-22 | Mitsui High Tec Inc | Method and facilities for inspecting semiconductor device |
| JP2007188975A (en) * | 2006-01-11 | 2007-07-26 | Sony Corp | Apparatus and method for defect inspection |
| WO2008126955A1 (en) * | 2007-04-13 | 2008-10-23 | Jt Corporation | Apparatus for inspecting semiconductor device |
| TW200846653A (en) * | 2007-02-06 | 2008-12-01 | Hanmi Semiconductor Co Ltd | Vision system for sawing & placement equipment |
| TW201033600A (en) * | 2008-12-17 | 2010-09-16 | Rokko Ventures Pte Ltd | System and processing of a substrate |
-
2012
- 2012-11-16 TW TW101142895A patent/TW201421013A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003234361A (en) * | 2002-02-07 | 2003-08-22 | Mitsui High Tec Inc | Method and facilities for inspecting semiconductor device |
| JP2007188975A (en) * | 2006-01-11 | 2007-07-26 | Sony Corp | Apparatus and method for defect inspection |
| TW200846653A (en) * | 2007-02-06 | 2008-12-01 | Hanmi Semiconductor Co Ltd | Vision system for sawing & placement equipment |
| WO2008126955A1 (en) * | 2007-04-13 | 2008-10-23 | Jt Corporation | Apparatus for inspecting semiconductor device |
| TW201033600A (en) * | 2008-12-17 | 2010-09-16 | Rokko Ventures Pte Ltd | System and processing of a substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201421013A (en) | 2014-06-01 |