MXPA03001223A - Celda de memoria, dispositivo de celda de memoria y metodo de fabricaccion del mismo. - Google Patents

Celda de memoria, dispositivo de celda de memoria y metodo de fabricaccion del mismo.

Info

Publication number
MXPA03001223A
MXPA03001223A MXPA03001223A MXPA03001223A MXPA03001223A MX PA03001223 A MXPA03001223 A MX PA03001223A MX PA03001223 A MXPA03001223 A MX PA03001223A MX PA03001223 A MXPA03001223 A MX PA03001223A MX PA03001223 A MXPA03001223 A MX PA03001223A
Authority
MX
Mexico
Prior art keywords
memory cell
production
cell device
memory
cell
Prior art date
Application number
MXPA03001223A
Other languages
English (en)
Inventor
Josef Willer
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10039441A external-priority patent/DE10039441A1/de
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of MXPA03001223A publication Critical patent/MXPA03001223A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66833—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a charge trapping gate insulator, e.g. MNOS transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
MXPA03001223A 2000-08-11 2001-08-06 Celda de memoria, dispositivo de celda de memoria y metodo de fabricaccion del mismo. MXPA03001223A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10039441A DE10039441A1 (de) 2000-08-11 2000-08-11 Speicherzelle, Speicherzellenanordnung und Herstellungsverfahren
US09/900,654 US20020024092A1 (en) 2000-08-11 2001-07-06 Memory cell, memory cell arrangement and fabrication method
PCT/DE2001/002997 WO2002015276A2 (de) 2000-08-11 2001-08-06 Speicherzelle, speicherzellenanordnung und herstellungsverfahren

Publications (1)

Publication Number Publication Date
MXPA03001223A true MXPA03001223A (es) 2003-09-22

Family

ID=26006676

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA03001223A MXPA03001223A (es) 2000-08-11 2001-08-06 Celda de memoria, dispositivo de celda de memoria y metodo de fabricaccion del mismo.

Country Status (9)

Country Link
US (1) US6844584B2 (es)
EP (1) EP1307920A2 (es)
JP (1) JP2004517464A (es)
CN (1) CN100446258C (es)
BR (1) BR0113164A (es)
MX (1) MXPA03001223A (es)
RU (1) RU2247441C2 (es)
TW (1) TWI244199B (es)
WO (1) WO2002015276A2 (es)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10204868B4 (de) * 2002-02-06 2007-08-23 Infineon Technologies Ag Speicherzelle mit Grabenspeichertransistor und Oxid-Nitrid-Oxid-Dielektrikum
DE10219917A1 (de) * 2002-05-03 2003-11-13 Infineon Technologies Ag Grabentransistor in einem Halbleiterkörper aus Silizium und Herstellungsverfahren
DE10225410A1 (de) 2002-06-07 2004-01-08 Infineon Technologies Ag Verfahren zur Herstellung von NROM-Speicherzellen mit Grabentransistoren
DE10226964A1 (de) 2002-06-17 2004-01-08 Infineon Technologies Ag Verfahren zur Herstellung einer NROM-Speicherzellenanordnung
DE10229065A1 (de) * 2002-06-28 2004-01-29 Infineon Technologies Ag Verfahren zur Herstellung eines NROM-Speicherzellenfeldes
KR100885910B1 (ko) * 2003-04-30 2009-02-26 삼성전자주식회사 게이트 적층물에 ｏｈａ막을 구비하는 비 휘발성 반도체메모리 장치 및 그 제조방법
US6979857B2 (en) * 2003-07-01 2005-12-27 Micron Technology, Inc. Apparatus and method for split gate NROM memory
DE10333549B3 (de) * 2003-07-23 2005-01-13 Infineon Technologies Ag Charge-Trapping-Speicherzelle
US6987689B2 (en) * 2003-08-20 2006-01-17 International Business Machines Corporation Non-volatile multi-stable memory device and methods of making and using the same
US6977412B2 (en) * 2003-09-05 2005-12-20 Micron Technology, Inc. Trench corner effect bidirectional flash memory cell
US6965143B2 (en) * 2003-10-10 2005-11-15 Advanced Micro Devices, Inc. Recess channel flash architecture for reduced short channel effect
US7041545B2 (en) * 2004-03-08 2006-05-09 Infineon Technologies Ag Method for producing semiconductor memory devices and integrated memory device
KR100594266B1 (ko) * 2004-03-17 2006-06-30 삼성전자주식회사 소노스 타입 메모리 소자
US20060043463A1 (en) * 2004-09-01 2006-03-02 Taiwan Semiconductor Manufacturing Company, Ltd. Floating gate having enhanced charge retention
TWI270199B (en) * 2005-01-31 2007-01-01 Powerchip Semiconductor Corp Non-volatile memory and manufacturing method and operating method thereof
US7186607B2 (en) * 2005-02-18 2007-03-06 Infineon Technologies Ag Charge-trapping memory device and method for production
US7196008B1 (en) * 2005-03-23 2007-03-27 Spansion Llc Aluminum oxide as liner or cover layer to spacers in memory device
DE102005024951A1 (de) * 2005-05-31 2006-12-14 Infineon Technologies Ag Halbleiterspeicherbauelement
US7468299B2 (en) * 2005-08-04 2008-12-23 Macronix International Co., Ltd. Non-volatile memory cells and methods of manufacturing the same
US7292478B2 (en) * 2005-09-08 2007-11-06 Macronix International Co., Ltd. Non-volatile memory including charge-trapping layer, and operation and fabrication of the same
US20070221979A1 (en) * 2006-03-22 2007-09-27 Dirk Caspary Method for production of memory devices and semiconductor memory device
US20070257293A1 (en) * 2006-05-08 2007-11-08 Josef Willer Semiconductor memory device and method for production of the semiconductor memory device
JP2008166528A (ja) * 2006-12-28 2008-07-17 Spansion Llc 半導体装置およびその製造方法
US7778073B2 (en) 2007-10-15 2010-08-17 Qimonda Ag Integrated circuit having NAND memory cell strings
JP5405737B2 (ja) * 2007-12-20 2014-02-05 スパンション エルエルシー 半導体装置およびその製造方法
JP2009277782A (ja) * 2008-05-13 2009-11-26 Oki Semiconductor Co Ltd 半導体記憶装置および半導体記憶装置の製造方法
US8304840B2 (en) 2010-07-29 2012-11-06 Taiwan Semiconductor Manufacturing Company, Ltd. Spacer structures of a semiconductor device
RU2543668C2 (ru) * 2012-08-27 2015-03-10 Федеральное государственное бюджетное учреждение науки Физико-технический институт им. Ф.Ф. Иоффе Российской академии наук Полевой транзистор с ячейкой памяти
US9412790B1 (en) * 2012-12-04 2016-08-09 Crossbar, Inc. Scalable RRAM device architecture for a non-volatile memory device and method
CN108735772B (zh) * 2017-04-14 2020-08-21 上海磁宇信息科技有限公司 一种共享型的高密度随机存储器架构
CN108735773A (zh) * 2017-04-14 2018-11-02 上海磁宇信息科技有限公司 一种超高密度随机存储器架构

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SU752476A1 (ru) 1978-07-24 1980-07-30 Предприятие П/Я А-1889 Ячейка пам ти
DE2946864A1 (de) * 1978-11-27 1980-06-04 Texas Instruments Inc Nicht-fluechtige halbleiterspeicherelemente und verfahren zu ihrer herstellung
US4360900A (en) * 1978-11-27 1982-11-23 Texas Instruments Incorporated Non-volatile semiconductor memory elements
US4242737A (en) * 1978-11-27 1980-12-30 Texas Instruments Incorporated Non-volatile semiconductor memory elements
JP2662076B2 (ja) * 1990-05-02 1997-10-08 松下電子工業株式会社 不揮発性半導体記憶装置およびその製造方法
DE19545903C2 (de) 1995-12-08 1997-09-18 Siemens Ag Festwertspeicherzellenanordnung und Verfahren zu deren Herstellung
DE19600423C2 (de) 1996-01-08 2001-07-05 Siemens Ag Elektrisch programmierbare Speicherzellenanordnung und Verfahren zu deren Herstellung
DE19600422C1 (de) 1996-01-08 1997-08-21 Siemens Ag Elektrisch programmierbare Speicherzellenanordnung und Verfahren zu deren Herstellung
US5768192A (en) 1996-07-23 1998-06-16 Saifun Semiconductors, Ltd. Non-volatile semiconductor memory cell utilizing asymmetrical charge trapping
US5817560A (en) 1996-09-12 1998-10-06 Advanced Micro Devices, Inc. Ultra short trench transistors and process for making same
US5808340A (en) * 1996-09-18 1998-09-15 Advanced Micro Devices, Inc. Short channel self aligned VMOS field effect transistor
US5966603A (en) * 1997-06-11 1999-10-12 Saifun Semiconductors Ltd. NROM fabrication method with a periphery portion
US5973358A (en) * 1997-07-01 1999-10-26 Citizen Watch Co., Ltd. SOI device having a channel with variable thickness
US6768165B1 (en) 1997-08-01 2004-07-27 Saifun Semiconductors Ltd. Two bit non-volatile electrically erasable and programmable semiconductor memory cell utilizing asymmetrical charge trapping
JP3544833B2 (ja) * 1997-09-18 2004-07-21 株式会社東芝 半導体装置及びその製造方法
TW383427B (en) * 1998-04-03 2000-03-01 United Microelectronics Corp Method for etching tantalum oxide
EP0967654A1 (en) * 1998-06-26 1999-12-29 EM Microelectronic-Marin SA Non-volatile semiconductor memory device

Also Published As

Publication number Publication date
TWI244199B (en) 2005-11-21
US6844584B2 (en) 2005-01-18
RU2247441C2 (ru) 2005-02-27
WO2002015276A3 (de) 2002-06-06
JP2004517464A (ja) 2004-06-10
US20030015752A1 (en) 2003-01-23
CN1446378A (zh) 2003-10-01
CN100446258C (zh) 2008-12-24
WO2002015276A2 (de) 2002-02-21
EP1307920A2 (de) 2003-05-07
BR0113164A (pt) 2003-06-24

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