MX9409531A - Circuitos impresos plasticos y contactos y metodo para realizarlos. - Google Patents
Circuitos impresos plasticos y contactos y metodo para realizarlos.Info
- Publication number
- MX9409531A MX9409531A MX9409531A MX9409531A MX9409531A MX 9409531 A MX9409531 A MX 9409531A MX 9409531 A MX9409531 A MX 9409531A MX 9409531 A MX9409531 A MX 9409531A MX 9409531 A MX9409531 A MX 9409531A
- Authority
- MX
- Mexico
- Prior art keywords
- conductive
- substrate
- adhered
- contacts
- plating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
- H01R13/035—Plated dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/04—Pins or blades for co-operation with sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/931—Conductive coating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Liquid Crystal Substances (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
Un componente conductor para portar señales eléctricas construido de un substrato polimérico moldeado y una cubierta conductora adherida al substrato, el recubrimiento define una vía eléctrica continute, plástico moldeado tal como polímero cristalino líquido se forma para hacer circuitos que tengan tinta conductora con el fin de proporcionar tableros de circuitos impresos baratos y versátiles para portar huellas eléctricas y otros componentes y para proporcionar contactos formados impresos. Las tintas soldables conductoras pueden adherirse al substrato, por ejemplo por medio de serigrafía, chapeado con pincel, rocío, inmersion, enmascaramiento al vacío o deposicion al vacío con la subsecuente secado en horno, reflujo en una fase de vapor, postcurado o chapeado.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16415093A | 1993-12-09 | 1993-12-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9409531A true MX9409531A (es) | 1997-01-31 |
Family
ID=22593199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9409531A MX9409531A (es) | 1993-12-09 | 1994-12-08 | Circuitos impresos plasticos y contactos y metodo para realizarlos. |
Country Status (10)
Country | Link |
---|---|
US (2) | US5599595A (es) |
JP (1) | JPH0850967A (es) |
KR (1) | KR100339767B1 (es) |
CN (1) | CN1110046A (es) |
DE (1) | DE4443410A1 (es) |
FR (1) | FR2713830B1 (es) |
GB (1) | GB2284566B (es) |
IE (1) | IE940943A1 (es) |
MX (1) | MX9409531A (es) |
TW (1) | TW349320B (es) |
Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5546281A (en) | 1995-01-13 | 1996-08-13 | Methode Electronics, Inc. | Removable optoelectronic transceiver module with potting box |
US5717533A (en) | 1995-01-13 | 1998-02-10 | Methode Electronics Inc. | Removable optoelectronic module |
US6220878B1 (en) | 1995-10-04 | 2001-04-24 | Methode Electronics, Inc. | Optoelectronic module with grounding means |
KR0155877B1 (ko) * | 1995-09-12 | 1998-12-15 | 이대원 | 다층 회로기판 및 그 제조방법 |
US5873751A (en) * | 1995-12-07 | 1999-02-23 | Methode Electronics, Inc. | Circuitized insulator |
US5955703A (en) * | 1996-02-28 | 1999-09-21 | Methode Electronics, Inc. | Circuitized electrical cable and method of assembling same |
US6074728A (en) * | 1996-09-11 | 2000-06-13 | Samsung Aerospace Industries, Ltd. | Multi-layered circuit substrate |
US6106336A (en) * | 1997-09-24 | 2000-08-22 | Intel Corporation | Computer system including a co-planar processor connector and thermal spacer |
US6160714A (en) * | 1997-12-31 | 2000-12-12 | Elpac (Usa), Inc. | Molded electronic package and method of preparation |
JP2004506309A (ja) | 1997-12-31 | 2004-02-26 | エルパック(ユーエスエー)、インコーポレイテッド | モールドされた電子パッケージ、製作方法およびシールディング方法 |
GB2336161B (en) * | 1998-04-06 | 2003-03-26 | John Michael Lowe | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
US6939447B2 (en) * | 1998-04-06 | 2005-09-06 | Tdao Limited | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
US6000954A (en) * | 1998-04-15 | 1999-12-14 | Methode Electronics, Inc. | Two piece pin connector |
US6179627B1 (en) | 1998-04-22 | 2001-01-30 | Stratos Lightwave, Inc. | High speed interface converter module |
US6203333B1 (en) | 1998-04-22 | 2001-03-20 | Stratos Lightwave, Inc. | High speed interface converter module |
US6102742A (en) * | 1998-06-30 | 2000-08-15 | Methode Electronics, Inc. | Electrical connector having variable resistance contacts |
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US6203387B1 (en) | 1999-10-21 | 2001-03-20 | Stratos Lightwave, Inc. | Solderable metallized plastic contact |
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US6491545B1 (en) * | 2000-05-05 | 2002-12-10 | Molex Incorporated | Modular shielded coaxial cable connector |
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US6872586B2 (en) * | 2000-10-17 | 2005-03-29 | Seiko Epson Corporation | Method of manufacture of active matrix substrate and liquid crystal display device |
US6340314B1 (en) * | 2000-12-21 | 2002-01-22 | Hon Hai Precision Ind. Co., Ltd. | Electrical adapter |
US7018239B2 (en) | 2001-01-22 | 2006-03-28 | Molex Incorporated | Shielded electrical connector |
EP1374342A1 (fr) * | 2001-04-06 | 2004-01-02 | Fci | Connecteur pour montage en surface de circuit imprime et procede de fabrication |
JP4744724B2 (ja) * | 2001-05-24 | 2011-08-10 | 第一電子工業株式会社 | 電子部品 |
DE60214371T2 (de) | 2001-06-13 | 2007-08-30 | Molex Inc., Lisle | Mehrfachhochgeschwindigkeitssteckverbinder |
US6974765B2 (en) * | 2001-09-27 | 2005-12-13 | Intel Corporation | Encapsulation of pin solder for maintaining accuracy in pin position |
DE10314716A1 (de) * | 2003-03-31 | 2004-10-14 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Elektrisches Anschlusselement |
US7086868B2 (en) * | 2003-12-09 | 2006-08-08 | Xytrans, Inc. | Board-to-board connector |
US20050227096A1 (en) * | 2004-04-06 | 2005-10-13 | Phil Harding | Emulsion with discontinouous phase including particle sol |
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FR2871621A1 (fr) * | 2004-06-10 | 2005-12-16 | Fci Sa | Connecteur electrique muni d'au moins un contact electrique et procede de fabrication d'un tel connecteur |
US7172347B1 (en) * | 2004-09-07 | 2007-02-06 | Finisar Corporation | Optoelectronic arrangement with a pluggable optoelectronic module and an electrical connector to be mounted on a host-printed circuit board and electrical connector |
US7037114B1 (en) * | 2005-01-21 | 2006-05-02 | Cleveland Medical Devices Inc. | Low profile electro-mechanical connector |
CN100420049C (zh) * | 2005-02-02 | 2008-09-17 | 银河制版印刷有限公司 | 发光二极管模块的基板结构 |
US7354794B2 (en) * | 2005-02-18 | 2008-04-08 | Lexmark International, Inc. | Printed conductive connectors |
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US7166913B2 (en) * | 2005-04-19 | 2007-01-23 | International Business Machines Corporation | Heat dissipation for heat generating element of semiconductor device and related method |
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US7316507B2 (en) | 2005-11-03 | 2008-01-08 | Covidien Ag | Electronic thermometer with flex circuit location |
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US7749170B2 (en) | 2007-05-22 | 2010-07-06 | Tyco Healthcare Group Lp | Multiple configurable electronic thermometer |
JP4875595B2 (ja) * | 2007-11-16 | 2012-02-15 | 三共化成株式会社 | 導電回路を有する合成樹脂製のばね |
US8496377B2 (en) | 2007-12-31 | 2013-07-30 | Covidien Lp | Thermometer having molded probe component |
KR100974092B1 (ko) * | 2008-05-30 | 2010-08-04 | 삼성전기주식회사 | 탄소나노튜브를 포함하는 도전성 페이스트 및 이를 이용한인쇄회로기판 |
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EP2705575B1 (en) * | 2011-05-03 | 2017-04-12 | CardioInsight Technologies, Inc. | High-voltage resistance for a connector attached to a circuit board |
TWI449273B (zh) * | 2011-05-04 | 2014-08-11 | Hon Hai Prec Ind Co Ltd | 電連接器及其組裝方法 |
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US8961228B2 (en) * | 2012-02-29 | 2015-02-24 | Tyco Electronics Corporation | Electrical connector having shielded differential pairs |
EP3134945B1 (en) * | 2014-04-23 | 2019-06-12 | TE Connectivity Corporation | Electrical connector with shield cap and shielded terminals |
DE102014010628A1 (de) * | 2014-07-21 | 2016-01-21 | Krallmann Kunststoffverarbeitung Gmbh | Kunststoff-Bauteil mit zumindest einem elektrischen Kontaktelement und Verfahren zu seiner Herstellung |
DE102014221306A1 (de) * | 2014-10-21 | 2016-04-21 | Robert Bosch Gmbh | Schaltungsträger und Schaltungsmodul |
KR101673706B1 (ko) * | 2014-12-02 | 2016-11-07 | 현대자동차주식회사 | 피메일 커넥터 및 그 제조 방법 |
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US12024356B2 (en) | 2022-09-29 | 2024-07-02 | Apothecary Products, Llc | Multiple compartment container and methods |
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-
1994
- 1994-11-30 TW TW083111147A patent/TW349320B/zh not_active IP Right Cessation
- 1994-11-30 IE IE940943A patent/IE940943A1/en not_active IP Right Cessation
- 1994-11-30 KR KR1019940031908A patent/KR100339767B1/ko not_active IP Right Cessation
- 1994-12-05 GB GB9424531A patent/GB2284566B/en not_active Expired - Fee Related
- 1994-12-07 DE DE4443410A patent/DE4443410A1/de not_active Withdrawn
- 1994-12-08 CN CN94112904A patent/CN1110046A/zh active Pending
- 1994-12-08 MX MX9409531A patent/MX9409531A/es not_active IP Right Cessation
- 1994-12-09 JP JP33092094A patent/JPH0850967A/ja active Pending
- 1994-12-09 FR FR9414865A patent/FR2713830B1/fr not_active Expired - Fee Related
-
1995
- 1995-06-06 US US08/468,235 patent/US5599595A/en not_active Expired - Fee Related
-
1996
- 1996-07-25 US US08/686,982 patent/US5688146A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2713830A1 (fr) | 1995-06-16 |
DE4443410A1 (de) | 1995-06-14 |
GB9424531D0 (en) | 1995-01-25 |
CN1110046A (zh) | 1995-10-11 |
US5599595A (en) | 1997-02-04 |
KR100339767B1 (ko) | 2002-11-30 |
IE940943A1 (en) | 1995-06-14 |
JPH0850967A (ja) | 1996-02-20 |
FR2713830B1 (fr) | 1998-04-03 |
TW349320B (en) | 1999-01-01 |
KR950021891A (ko) | 1995-07-26 |
GB2284566A (en) | 1995-06-14 |
US5688146A (en) | 1997-11-18 |
GB2284566B (en) | 1998-05-06 |
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FG | Grant or registration | ||
MM | Annulment or lapse due to non-payment of fees |