KR950021891A - 인쇄 플라스틱 회로와 접점 및 그 제조방법 - Google Patents

인쇄 플라스틱 회로와 접점 및 그 제조방법 Download PDF

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KR950021891A
KR950021891A KR1019940031908A KR19940031908A KR950021891A KR 950021891 A KR950021891 A KR 950021891A KR 1019940031908 A KR1019940031908 A KR 1019940031908A KR 19940031908 A KR19940031908 A KR 19940031908A KR 950021891 A KR950021891 A KR 950021891A
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contact
substrate
printed plastic
plastic circuit
circuit
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KR1019940031908A
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KR100339767B1 (ko
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제이. 맥글린레이 윌리암
알. 캔논 존
제이. 그린 윌리암
피. 자나도 리차드
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윌리암 티. 젠센
메소드 일렉트로닉스 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/04—Pins or blades for co-operation with sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/931—Conductive coating

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Liquid Crystal Substances (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

본 발명은 성형 폴리머 기판과 이 기판에 부착하는 전도성 피복물로 구성된 전기 신호를 운송하기 위한 전도성 콤포네트에 관한 것이고, 상기 피복물은 적어도 두 단자 사이에 연속 전기 통로를 한정한다. 양호하게, 액정 폴리머와 같은 성형플라스틱은 전기 트레이스와 다른 콤포넨트를 운송하기 위해 값싸고 다양한 인쇄 회로판을 제공하기 위하여 그리고 인쇄 선형접점을 제공하기 위하여 이에 부착된 전도성 잉크를 갖는 회로를 제조하기 위해 형성된다. 전도 용접성 잉크는 스크린 인쇄, 브러쉬, 분무, 디핑, 마스킹, 진공 도금 또는 연속 오븐 건조, 기상 역류, 후 가공 또는 도금을 갖는 진공 증착을 걸쳐서 기판에 부착된다.

Description

인쇄 플라스틱 회로와 접점 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 신규하고 개량된 연속 암형(female)전기 커넥터 회로의 사시도,
제3도는 제2도의 3-3선을 따라 취한 측단면도,
제4도는 전도성면에 접착하기 전에 제2도의 전기 커넥터의 접점 소자의 사시도,
제5도는 전도성면에 접착한 수의 제2도의 전기 커넥터의 접점 소자의 사시도.

Claims (20)

  1. 전기 신호를 운송하기 위한 인쇄 플라스틱 회로와 접점에 있어서, 적어도 두개의 단자 사이에 연속 전기 통로를 한정하는 성형 폴리머 기판과, 상기 기판에 부착된 전도성 피복물을 포함하는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  2. 제1항에 있어서, 상기 기판은 이에 부착된 전도성 피복물을 갖는 회로 영역을 포함하는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  3. 제2항에 있어서, 상기 전도성 피복물을 금속계 조성물을 포함하는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  4. 제2항에 있어서, 상기 폴리머 기판은 액정 폴리머 조성물을 포함하는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  5. 제2항에 있어서, 상기 기판은 상기 기판으로 부터 돌출하는 접점을 포함하는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  6. 제5항에 있어서, 상기 전도성 피복물은 상기 회로 영역으로 부터 상기 접점까지 연속 트레이스를 형성하는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  7. 제5항에 있어서, 상기 전도성 피복물은 스크린 인쇄를 거쳐서 상기 기판에 부착되는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  8. 제5항에 있어서, 상기 접점은 상기 기판에 수직인 상기 기판의 일 엣지를 따라 배열되고, 평행한 복수의 접점은 빗형 접점을 형성하는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  9. 제8항에 있어서, 상기 빗형 접점은 대응 암형 커넥터에 삽입하기 위한 수형 핀 접접인 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  10. 제8항에 있어서, 상기 빗형 접점은 대응 수형 핀 접점을 수용하기 위한 암형 접점인 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  11. 제8항에 있어서, 상기 기판은 상기 기판의 양측면 엣지를 따라 상기 두개의 빗형 접점을 포함하는 것을 특징으로 하는 인쇄 플라스틱회로와 접점.
  12. 제2항에 있어서, 상기 기판은 상기 기판의 제1측면으로 부터 상기 기판의 제2측면까지 진행하고 그위에 전도성 잉크를 갖는 연통 브릿지를 포함하고, 전기 신호는 상기 제1측면으로부터 제2측면까지 전송되는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  13. 제2항에 있어서, 평행하게 나란히 정렬된 두 기판과, 상기 두 기판을 함유하는 하우징을 더 포함하는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  14. 제13항에 있어서, 상기 기판은 접점을 포함하고, 두행의 쌍 접점을 형성하는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  15. 제14항에 있어서, 상기 전도성 피복물은 가요성 인쇄 회로를 포함하는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  16. 제15항에 있어서, 상기 양 기판 사이에 배향된 연통 브릿지를 더 포함하고, 전기 신호는 상기 양 기판 사이로 전송되는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
  17. 기판을 적합한 형상으로 성형하는 단계와, 전도성 잉크를 상기 기판상에 부착하는 단계와, 상기 전도성 잉크를 20 내지 40분동안 70 내지 90℃로 오븐에서 건조하는 단계와, 상기 전도성 잉크를 1 내지 5분동안 180 내지 230℃로 기상에서 역류시키는 단계 및, 상기 전도성 잉크를 순환 공기를 갖는 오븐에서 후경화하고 30 내지 90분동안 125 내지 185℃로 배출하는 단계를 포함하는 것을 특징으로 하는 전도성 콤포넨트 형성방법.
  18. 제17항에 있어서, 상기 전도성 잉크를 상기 기판상에 스크린 인쇄하는 단계를 더 포함하는 것을 특징으로 하는 전도성 콤포넨트 형성방법.
  19. 단일 쇼트에 나란히 연결된 두개의 기판 회로를 성형하는 단계와, 전도성 피복물을 상기 양 기판 회로상에서 동시에 스크린 인쇄하는 단계와, 기판을 적합한 형상으로 성형하는 단계와, 전도성 잉크를 상기 기판상에 부착하는 단계와, 상기 전도성 잉크를 20 내지 45분 동안 70 내지 90℃로 오븐에서 건조하는 단계와, 상기 전도성 잉크를 1내지 5분 동안 180 내지 230℃로 오븐에서 역류시키는 단계 및, 상기 전도성 잉크를 순환 공기를 갖는 오븐에서 후경화하고 30내지 90분 동안 125 내지 185℃로 배출하는 단계를 포함하는 것을 특징으로 하는 전도성 콤포넨트 형성 방법.
  20. 전기 신호를 운송하기 위한 인쇄 플라스틱 회로와 접점에 있어서, 회로 영역을 구비하는 성형 폴리머 기판과, 전기 트레이스를 형성하는 상기 회로 영역에 부착되고 상기 전기 트레이스가 전기 신호를 외부 소스로 운송하기 위해 노출된 단자 지점을 가지는 상기 트레이스에 부착되며 금속계 조성물을 구비하는 전도성 피복물을 포함하는 것을 특징으로 하는 인쇄 플라스틱 회로와 접점.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940031908A 1993-12-09 1994-11-30 전기신호전달용전기커넥터및그제조방법 KR100339767B1 (ko)

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GB9424531D0 (en) 1995-01-25
JPH0850967A (ja) 1996-02-20
GB2284566B (en) 1998-05-06
MX9409531A (es) 1997-01-31
CN1110046A (zh) 1995-10-11
IE940943A1 (en) 1995-06-14
TW349320B (en) 1999-01-01
US5599595A (en) 1997-02-04
FR2713830A1 (fr) 1995-06-16
DE4443410A1 (de) 1995-06-14
US5688146A (en) 1997-11-18
GB2284566A (en) 1995-06-14
KR100339767B1 (ko) 2002-11-30

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